BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5CGXBC5C6F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	77000	Yes	1.13 V		CMOS		240		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			240		23 mm
5CGXFC3B6F23I7N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	31000	Yes	1.13 V		CMOS		224		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm						Bottom	S-PBGA-B484		2 mm	23 mm	No					224		23 mm
5CGXFC9D6F27C7N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS		336		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1		30 s	336	260 °C (500 °F)	27 mm
A2F500M3G-1FGG484M	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V		CMOS		204	500000	1.5			Grid Array	BGA484,22X22,40		1.425 V	1 mm	125 °C (257 °F)		500000 Gates	-55 °C (-67 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s	204	250 °C (482 °F)	23 mm
A2F500M3G-FGG484	Microchip Technology	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	11520	CMOS		128	500000	1.5	Tray	1.5,1.8,2.5,3.3 V	Grid Array	BGA484,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		11520 CLBS, 500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	80 MHz	30 s	128	250 °C (482 °F)	23 mm
A3PE3000-FG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)		75264 CLBS, 3000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	350 MHz		341		23 mm
AGL600V2-FGG256	Microchip Technology	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	13824	Yes	1.575 V		CMOS		177	600000	1.2			Grid Array	BGA256,16X16,40		1.14 V	1 mm	85 °C (185 °F)		600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1		30 s	177	250 °C (482 °F)	17 mm
AGL600V5-FGG256	Microchip Technology	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	13824	Yes	1.575 V		CMOS		177	600000	1.5			Grid Array	BGA256,16X16,40		1.425 V	1 mm	85 °C (185 °F)		600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1		30 s	177	250 °C (482 °F)	17 mm
APA600-BG456	Microchip Technology	FPGA	Commercial	Ball	456	BGA	Square	Plastic/Epoxy	21504	Yes	2.7 V		CMOS		356	600000	2.5	Tray	2.5,2.5/3.3 V	Grid Array	BGA456,26X26,50	Field Programmable Gate Arrays	2.3 V	1.27 mm	70 °C (158 °F)		600000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B456	3	2.54 mm	35 mm	No			180 MHz		356		35 mm
APA600-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	21504	Yes	2.7 V		CMOS		370	600000	2.5	Tray	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	2.3 V	1 mm	85 °C (185 °F)		600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	25 mm	No		e1	180 MHz	30 s	370	250 °C (482 °F)	25 mm
EP1S30F780C5N	Intel	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	32470	Yes	1.575 V	3819	CMOS		726		1.5		1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		3819 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1			726		29 mm
EP2C35F484C8	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	33216	Yes	1.25 V	2076	CMOS		322		1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2076 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also requires 3.3 V supply	e0	402.5 MHz		306		23 mm
EP3C40F780C6N	Intel	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS		535		1.2			Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		39600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No		e1	472.5 MHz		535		29 mm
EP3C40F780C7N	Intel	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS		535		1.2			Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		39600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No		e1	472.5 MHz		535		29 mm
EP4CE15F23C8	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	15408	Yes	1.25 V	963			346		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	472.5 MHz		346		23 mm
EP4CE15F23C9LN	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	15408	Yes	1.03 V	963			346		1		1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	265 MHz		346		23 mm
EP4CE15F23I7	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	15408	Yes	1.25 V	963			346		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm			963 CLBS		Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0			346		23 mm
EP4CE40F23I8LN	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	1.03 V	2475			331		1		1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm			2475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	362 MHz		331		23 mm
EP4CE55F23C8	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	55856	Yes	1.25 V	3491			327		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3491 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	472.5 MHz		327		23 mm
EP4CE55F23C9LN	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	55856	Yes	1.03 V	3491			327		1		1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)		3491 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	265 MHz		327		23 mm
EP4CGX30CF23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	29440	Yes	1.24 V	1840			290		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		1840 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		290		23 mm
LCMXO2-1200UHC-5FTG256I	Lattice Semiconductor	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1280	Yes	3.465 V				206		2.5	Tray	2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also Operates at 3.3 V nominal supply	e1	133 MHz	30 s	206	260 °C (500 °F)	17 mm
LFE2-70E-5FN900C	Lattice Semiconductor	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	70000	Yes	1.26 V	8500			583		1.2		1.2 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	311 MHz	40 s	583	250 °C (482 °F)	31 mm
LFE3-17EA-6FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	17000	Yes	1.26 V				222		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.379 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	375 MHz		222	250 °C (482 °F)	23 mm
LFE3-17EA-6FN484I	Lattice Semiconductor	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	17000	Yes	1.26 V				222		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.379 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	375 MHz		222	250 °C (482 °F)	23 mm
LFE3-70EA-8FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V				295		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.281 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	500 MHz		295	250 °C (482 °F)	23 mm
LFXP2-17E-7FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	17000	Yes	1.26 V	2125	CMOS		201		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.304 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		201	260 °C (500 °F)	17 mm
LFXP2-30E-5FTN256I	Lattice Semiconductor	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	29000	Yes	1.26 V	3625	CMOS		201		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		201	260 °C (500 °F)	17 mm
LFXP2-40E-6FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	40000	Yes	1.26 V	5000	CMOS		363		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.399 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	435 MHz		363	250 °C (482 °F)	23 mm
LFXP6E-3FN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	720	Yes	1.26 V	720	CMOS		188		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.63 ns	720 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	375 MHz	40 s	188	250 °C (482 °F)	17 mm
M1A3P400-FG256	Microchip Technology	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	9216	CMOS			400000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		9216 CLBS, 400000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No			350 MHz				17 mm
M1A3P600-FGG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS			600000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	23 mm
M1A3PE3000-2FG324I	Microchip Technology	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		221	3000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B324	3	1.78 mm	19 mm	No		e0	350 MHz		221		19 mm
M1A3PE3000-FG324I	Microchip Technology	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		221	3000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B324	3	1.78 mm	19 mm	No		e0	350 MHz		221		19 mm
M1A3PE3000L-1FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	250 MHz		341		23 mm
M1AGL600V2-FGG256	Microchip Technology	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	13824	Yes	1.575 V		CMOS		177	600000	1.2			Grid Array	BGA256,16X16,40		1.14 V	1 mm	85 °C (185 °F)		600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1		30 s	177	250 °C (482 °F)	17 mm
M2GL025-1FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V				267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0			267		23 mm
M2GL025TS-1FCS325I	Microchip Technology	FPGA	Industrial	Ball	325	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		CMOS		180		1.2	Tray	1.2 V	Grid Array	BGA325,21X21,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325			11 mm	No				20 s	180	240 °C (464 °F)	11 mm
M2GL050T-1FGG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V		CMOS		267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
M2GL060T-1FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm			e0					23 mm
M2GL060T-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s		250 °C (482 °F)	23 mm
M2S010T-1FGG484	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	12084	Yes	1.26 V				233		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	233	250 °C (482 °F)	23 mm
M2S010TS-1FG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	12084	Yes	1.26 V				233		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s	233	240 °C (464 °F)	23 mm
M2S090T-1FGG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	86184	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
MPF200T-1FCG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	192000	Yes	1.03 V		CMOS		244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				244		23 mm
MPF200T-1FCG784I	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	192000	Yes	1.03 V		CMOS		364		1			Grid Array	BGA784,28X28,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm		It also Operates at 1.05 V nominal supply				364		29 mm
XA3S1600E-4FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS	AEC-Q100	376	1600000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	4.88 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	572 MHz	30 s	294	250 °C (482 °F)	23 mm
XC2V1000-4FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		172	1000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	650 MHz	30 s	172	260 °C (500 °F)	17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.