BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
A3PE600-FG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square		Plastic/Epoxy	13824	Yes	1.575 V	13824	CMOS	270	600000	1.5	Tray	1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)		13824 CLBS, 600000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	350 MHz		270		23 mm
EP3C10F256A7N	Intel	FPGA	Automotive	Ball	256	BGA	Square		Plastic/Epoxy	10320	Yes	2.625 V	10320	CMOS	182		2.5		1.2/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	125 °C (257 °F)		10320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No		e1			182		17 mm
EP3C120F484C8NES	Intel	FPGA	Other	Ball	484	BGA	Rectangular		Plastic/Epoxy		Yes	1.25 V	119088				1.2			Grid Array			1.15 V	1 mm	85 °C (185 °F)		119088 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484		2.6 mm	23 mm	No		e1	472.5 MHz				23 mm
EP4CE15F23C8L	Intel	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	15408	Yes	1.03 V	963		346		1		1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	362 MHz		346		23 mm
EP4SGX230FF35I3	Intel	FPGA		Ball	1152	BGA	Square		Plastic/Epoxy	228000	Yes	.93 V	9120	CMOS	564		.9		0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm			9120 CLBS		Tin Lead	Bottom	S-PBGA-B1152		3.6 mm	35 mm	No		e0	717 MHz		564		35 mm
LFE3-70EA-9FN672I	Lattice Semiconductor	FPGA		Ball	672	BGA	Square		Plastic/Epoxy	67000	Yes	1.26 V			380		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.252 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	500 MHz	30 s	380	250 °C (482 °F)	27 mm
M7A3PE600-FG484	Microchip Technology	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	13824	Yes	1.575 V		CMOS	270		1.5		1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484				No					270
MPF300TS-FCG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	300000	Yes	1.03 V		CMOS	244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	4	2.87 mm	23 mm		It also Operates at 1.05 V nominal supply			30 s	244	260 °C (500 °F)	23 mm
XC6SLX150-3FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square		Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	498		1.2		1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	862 MHz	30 s	498	250 °C (482 °F)	27 mm
XC7A100T-1FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square		Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS	300		1		1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1098 MHz	30 s	300	250 °C (482 °F)	27 mm
XC7K160T-3FBG484E	Xilinx	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	162240	Yes	1.03 V	12675	CMOS	285		1		1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm		0.58 ns	12675 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1412 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7VX690T-3FFG1930E	Xilinx	FPGA		Ball	1930	BGA	Square		Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	1000		1		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.58 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No		e1	1818 MHz		1000		45 mm
XCVU9P-1FLGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square		Plastic/Epoxy	2586150	Yes	.876 V	147780		832		0.85			Grid Array	BGA2577,51X51,40		.825 V	1 mm	100 °C (212 °F)		147780 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577		4.24 mm	52.5 mm						832		52.5 mm
XCVU9P-2FLGA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square		Plastic/Epoxy	2586150	Yes	.876 V	147780		832		0.85			Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		147780 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.24 mm	47.5 mm			e1			832		47.5 mm
10AX115S1F45I1SG	Intel	FPGA	Industrial	Ball	1932	BGA	Square		Plastic/Epoxy	1150000	Yes	.93 V	42720	TSMC	624		0.9			Grid Array	BGA1932,44X44,40		.87 V	1 mm	100 °C (212 °F)		42720 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm		Also Operates at 0.95 V nominal supply				624		45 mm
10CX220YU484I6G	Intel	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	220000	Yes	.93 V	80330	TSMC	188		.9			Grid Array			.87 V		100 °C (212 °F)		80330 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484									188
1SG040HH3F35E2LG	Intel	FPGA		Ball	1152	BGA	Square		Plastic/Epoxy	378000	Yes	.88 V	47250		430		0.85			Grid Array	BGA1152,34X34,40		.82 V	1 mm	100 °C (212 °F)		47250 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.706 mm	35 mm						430		35 mm
1SG280LN2F43E2VG	Intel	FPGA		Ball	1760	BGA	Square		Plastic/Epoxy	2753000	Yes		344125		704					Grid Array	BGA1760,42X42,40			1 mm	100 °C (212 °F)		344125 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm						704		42.5 mm
1SG280LN3F43I1VP	Intel	FPGA		Ball	1760	BGA	Square		Plastic/Epoxy	2753000	Yes		344125		704					Grid Array	BGA1760,42X42,40			1 mm	100 °C (212 °F)		344125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm						704		42.5 mm
5CGXBC7D6F27C7N	Intel	FPGA	Other	Ball	672	BGA	Square		Plastic/Epoxy	149500	Yes	1.13 V		CMOS	336		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			336		27 mm
5CGXFC4C6F27I7N	Intel	FPGA		Ball	672	BGA	Square		Plastic/Epoxy	50000	Yes	1.13 V		CMOS	368		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm					Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1		30 s	368	260 °C (500 °F)	27 mm
EP4CE55F23I8L	Intel	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	55856	Yes	1.03 V	3491		327		1		1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm			3491 CLBS		Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	362 MHz		327		23 mm
LFE2-12E-5FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	12000	Yes	1.26 V	1500		297		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	311 MHz		297	250 °C (482 °F)	23 mm
LFE2M35E-5FN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square		Plastic/Epoxy	35000	Yes	1.26 V	4250		410		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	311 MHz	30 s	410	250 °C (482 °F)	27 mm
LFE3-70EA-7LFN672I	Lattice Semiconductor	FPGA		Ball	672	BGA	Square		Plastic/Epoxy	67000	Yes	1.26 V			380		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.335 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	420 MHz	30 s	380	250 °C (482 °F)	27 mm
LFXP2-17E-6FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square		Plastic/Epoxy	17000	Yes	1.26 V	2125	CMOS	201		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.399 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		201	260 °C (500 °F)	17 mm
M2GL050-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	56340	Yes	1.26 V		CMOS	267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
M2GL050T-FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	56340	Yes	1.26 V		CMOS	267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s	267	225 °C (437 °F)	23 mm
MPF300T-FCG1152E	Microchip Technology	FPGA		Ball	1152	BGA	Square		Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512		1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				512		35 mm
MPF500T-FCG784E	Microchip Technology	FPGA		Ball	784	BGA	Square		Plastic/Epoxy	481000	Yes	1.03 V		CMOS	388		1			Grid Array	BGA784,28X28,40		.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm		It also Operates at 1.05 V nominal supply				388		29 mm
MPF500TLS-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square		Plastic/Epoxy	481000	Yes	1.03 V		CMOS	584		1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
MPF500TLSFCG1152I	Microsemi	FPGA		Ball	1152	BGA	Square		Plastic/Epoxy	481000	Yes	1.03 V		CMOS	584		1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
RT4G150-CB1657PROTO	Microchip Technology	FPGA	Military	Ball	1657	BGA	Square	100k Rad(Si)	Plastic/Epoxy	151824	Yes	1.26 V			720		1.2			Grid Array	BGA1657,41X41,40		1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B1657		4.17 mm	42.5 mm						720		42.5 mm
XC7VX690T-1FFG1930C	Xilinx	FPGA	Other	Ball	1930	BGA	Square		Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	1000		1		0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No		e1	1818 MHz		1000		45 mm
XC7VX690T-2FFG1157I	Xilinx	FPGA		Ball	1157	BGA	Square		Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	600		1		1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	54150 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157		3.35 mm	35 mm	No		e1	1818 MHz		600		35 mm
XC7VX690T-3FFG1927E	Xilinx	FPGA		Ball	1927	BGA	Square		Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	600		1		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.58 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1927	4	3.65 mm	45 mm	No		e1	1818 MHz		600	245 °C (473 °F)	45 mm
XCVU37P-2FSVH2892E	Xilinx	FPGA	Other	Ball	2892	BGA	Square		Plastic/Epoxy	2851800	Yes	.876 V	162960		624		0.85			Grid Array	BGA2892,54X54,40		.825 V	1 mm	100 °C (212 °F)		162960 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2892	4	4.51 mm	55 mm			e1		30 s	624	240 °C (464 °F)	55 mm
10AX016E4F29I3SG	Intel	FPGA	Industrial	Ball	780	BGA	Square		Plastic/Epoxy	160000	Yes	.93 V	6151	TSMC	288		0.9		0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		6151 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					288		29 mm
10M40DCF256C8G	Intel	FPGA	Other	Ball	256	BGA	Square		Plastic/Epoxy	40000	Yes	1.25 V	2500		500		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			500		17 mm
1SG280HN1F43E1VG	Intel	FPGA		Ball	1760	BGA	Square		Plastic/Epoxy	2753000	Yes		344125		704					Grid Array	BGA1760,42X42,40			1 mm	100 °C (212 °F)		344125 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm						704		42.5 mm
5CEFA5F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	76500	Yes	1.13 V		CMOS	240		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					240		23 mm
5CGXFC5C6F27C7N	Intel	FPGA	Other	Ball	672	BGA	Square		Plastic/Epoxy	76500	Yes	1.13 V		CMOS	368		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			368		27 mm
5CGXFC7D7F27C8N	Intel	FPGA	Other	Ball	672	BGA	Square		Plastic/Epoxy	149500	Yes	1.13 V		CMOS	336		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			336		27 mm
5SGXEABN1F45I2G	Intel	FPGA	Industrial	Ball	1932	BGA	Square		Plastic/Epoxy	952000	Yes	.93 V	35920	TSMC	840		.9			Grid Array	BGA1932,44X44,40		.87 V	1 mm	100 °C (212 °F)		35920 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.85 mm	45 mm						840		45 mm
EP1AGX60DF780I6N	Intel	FPGA	Industrial	Ball	780	BGA	Square		Plastic/Epoxy		Yes	1.25 V	60100		350		1.2		1.2,2.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		60100 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1	640 MHz		350		29 mm
EP1C12F324C7N	Intel	FPGA	Other	Ball	324	BGA	Square		Plastic/Epoxy	12060	Yes	1.575 V	1206		249		1.5		1.5,1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		1206 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No		e1	320 MHz		249		19 mm
EP1C12F324I7	Intel	FPGA	Industrial	Ball	324	BGA	Square		Plastic/Epoxy	12060	Yes	1.575 V	1206		249		1.5		1.5,1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)		1206 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No		e0	320 MHz	20 s	249	220 °C (428 °F)	19 mm
EP1SGX25CF672C6N	Intel	FPGA	Other	Ball	672	BGA	Square		Plastic/Epoxy	25660	Yes	1.575 V	2852	CMOS	455		1.5		1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		2852 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1			455		27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.