20 Programmable Logic Devices (PLD) 1,360

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

TIBPAL16R8-30MW

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

25 ns

Yes

5.5 V

TTL

8

PAL-TYPE

5

5 V

Flatpack

FL20,.3

Programmable Logic Devices

Registered

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

No

Power-Up Reset

25 MHz

8

0

5962-8515506RA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

TTL

MIL-STD-883

8

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Registered

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

Yes

e0

25 MHz

8

24.2 mm

No

0

TIBPAL16R4-30MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

MIL-STD-883

12

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

25 MHz

8

24.195 mm

No

4

TIBPAL16R8-12MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.5 V

TTL

MIL-PRF-38535

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

48 MHz

8

24.195 mm

0

TIBPAL16L8-10MWB

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

12 ns

Yes

5.5 V

TTL

MIL-PRF-38535

10

PAL-TYPE

5

5 V

Flatpack

FL20,.3

Programmable Logic Devices

Combinatorial

4.5 V

64

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Dual

R-GDFP-F20

2.45 mm

6.92 mm

No

52.5 MHz

8

13.09 mm

6

TIBPAL16R8-30MFKB

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

25 ns

Yes

5.5 V

TTL

MIL-STD-883

8

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Registered

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin/Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

e0

25 MHz

8

8.89 mm

No

0

JM38510/50403BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

TTL

MIL-M-38510 Class B

5

In-Line

Mixed

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

No

e0

20 MHz

TIBPAL16R6-30MFKB

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.5 V

TTL

MIL-STD-883

10

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Tin/Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

e0

25 MHz

6

8.89 mm

No

2

PAL16R8AMJ

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

TTL

8

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Registered

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

25 MHz

8

24.195 mm

No

0

TIBPAL16R8-20MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

TTL

MIL-PRF-38535

8

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Registered

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

41.6 MHz

8

24.195 mm

No

0

TICPAL16L8-55CN

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

55 ns

No

5.25 V

CMOS

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.75 V

64

2.54 mm

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Dual

R-PDIP-T20

5.08 mm

7.62 mm

No

8

24.325 mm

6

PAL16R4ACN

Texas Instruments

OT PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

8

TIBPAL16L8-7CFN

Texas Instruments

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

9 ns

Yes

5.25 V

TTL

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Combinatorial

4.75 V

64

1.27 mm

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQCC-J20

3

4.57 mm

8.9662 mm

No

e4

74 MHz

30 s

8

245 °C (473 °F)

8.9662 mm

6

5962-8515512SA

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

15 ns

Yes

5.5 V

TTL

MIL-STD-883

12

PAL-TYPE

5

Tube

5 V

Flatpack

FL20,.3

Programmable Logic Devices

No

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDFP-F20

2.45 mm

6.92 mm

Yes

e0

50 MHz

8

No

4

TICPAL16R4-55CN

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

55 ns

No

5.25 V

CMOS

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Mixed

4.75 V

64

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 4 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T20

5.08 mm

7.62 mm

No

Register Preload

16 MHz

4

24.325 mm

4

8103609RX

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

MIL-STD-883 Class B

5

In-Line

Mixed

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

Yes

25 MHz

2

M38510/50604BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

6.92 mm

Yes

e0

41.6 MHz

8

24.2 mm

No

4

81036112X

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

40 ns

Yes

5.5 V

TTL

MIL-STD-883 Class B

5

Chip Carrier

Combinatorial

4.5 V

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Quad

S-CQCC-N20

Yes

6

5962-85155102A

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

12 ns

Yes

5.5 V

TTL

MIL-STD-883

8

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Registered

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

50 MHz

8

8.89 mm

0

TIBPAL16R8-15MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

12 ns

No

5.5 V

TTL

MIL-PRF-38535

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

50 MHz

8

24.195 mm

0

PAL16R4A-2MFKB

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

40 ns

Yes

5.5 V

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

e0

16 MHz

8

8.89 mm

No

4

SN54PL16R4-2J

Texas Instruments

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

8

TIBPAL20L10-20CN

Texas Instruments

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

20 ns

No

TTL

20

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

40

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

10

TICHAL16L8-35CDW

Texas Instruments

Mask PLD

Commercial Extended

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

35 ns

Yes

5.5 V

CMOS

5

Small Outline

Combinatorial

4.5 V

1.27 mm

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Dual

R-PDSO-G20

2.65 mm

7.5 mm

No

12.8 mm

6

TIBPAL16R8-20MFH

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic

Yes

TTL

8

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Registered

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N20

No

40 MHz

8

TIBPAL16L8-10MJ

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

12 ns

No

5.5 V

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.5 V

64

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

52.5 MHz

8

24.195 mm

6

5962-8515511SX

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

15 ns

Yes

5.5 V

TTL

MIL-STD-883

5

Flatpack

Mixed

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

No

50 MHz

2

PAL16R4A-2MWB

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

40 ns

Yes

5.5 V

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

5 V

Flatpack

FL20,.3

Programmable Logic Devices

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

2.54 mm

6.92 mm

No

16 MHz

8

4

5962-8515511RX

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

TTL

MIL-STD-883

5

In-Line

Mixed

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

No

50 MHz

2

TIBPAL16R6-30MFK

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.5 V

TTL

10

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

Power-Up Reset

25 MHz

6

8.89 mm

2

PAL16L8AMFH

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic

30 ns

Yes

TTL

16

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Combinatorial

64

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N20

No

8

M38510/50607BRX

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

5

In-Line

Mixed

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

No

25 MHz

2

5962-85155122X

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

15 ns

Yes

5.5 V

TTL

MIL-STD-883

16

PAL-TYPE

5

Chip Carrier

No

Mixed

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

Yes

50 MHz

4

No

4

SN74S330J

Texas Instruments

OT PLD

Commercial

Through-Hole

20

DIP

Rectangular

Ceramic

No

TTL

12

PLA-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

50

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T20

No

6

TIBPAL16R6-7MFK

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

TTL

10

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

Power-Up Reset; Register Preload

74 MHz

6

8.89 mm

2

SN74PL16R6-2N

Texas Instruments

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

TTL

10

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

6

81036122X

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

25 ns

Yes

5.5 V

TTL

5

Chip Carrier

Registered

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

No

16 MHz

0

TIBPAL16R8-15CN

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

12 ns

No

5.25 V

TTL

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

4.75 V

64

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 0 I/O

8

0 °C (32 °F)

Nickel Palladium Gold

Dual

R-PDIP-T20

5.08 mm

7.62 mm

No

Power-Up Reset

e4

50 MHz

8

25.4 mm

0

5962-01-369-4334

Texas Instruments

OT PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

25 ns

No

TTL

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

28.6 MHz

8

TIBPAL16R8-30MJ

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

TTL

MIL-STD-883

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

Power-Up Reset

25 MHz

8

24.195 mm

0

PAL16R4ACFN

Texas Instruments

OT PLD

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

TTL

12

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J20

No

8

PAL16L8ACFN

Texas Instruments

OT PLD

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

TTL

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Combinatorial

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J20

No

8

PAL16L8A-2CN

Texas Instruments

OT PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

35 ns

No

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

8

EP330-15CN

Texas Instruments

OT PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

16 ns

No

5.25 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.75 V

72

2.54 mm

70 °C (158 °F)

9 Dedicated Inputs, 8 I/O

9

0 °C (32 °F)

Dual

R-PDIP-T20

5.08 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock

55.6 MHz

8

24.325 mm

8

TIBPAL16L8-25CJ

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.25 V

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

4.75 V

64

2.54 mm

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

8

24.195 mm

6

TIBPAL16R4-15MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

TTL

MIL-PRF-38535

12

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

50 MHz

8

24.195 mm

No

4

TICPAL16R4-55CJ

Texas Instruments

Commercial

Through-Hole

20

DIP

Rectangular

Ceramic

55 ns

No

CMOS

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T20

No

16 MHz

4

TIBPAL16R8-25CFNR

Texas Instruments

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

TTL

MIL-STD-883

5

Chip Carrier

Registered

4.75 V

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 0 I/O

8

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

Power-Up Reset

30 MHz

8.965 mm

0

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.