20 Programmable Logic Devices (PLD) 1,360

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

PHD16N8-5N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Combinatorial

4.75 V

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Dual

R-PDIP-T20

No

High Speed Decoder

6

PLC18V8ZZID-T

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

40 ns

Yes

5.5 V

CMOS

5

Small Outline

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2.65 mm

7.5 mm

No

8 Macrocell; Power Up Reset; Shared Input/Clock

18 MHz

12.8 mm

8

PLUS16L8/BRA

NXP Semiconductors

OT PLD

Military

Through-Hole

20

Rectangular

Ceramic, Metal-Sealed Cofired

12 ns

No

5.5 V

TTL

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Dual

R-CDIP-T20

No

Security Fuse

6

PLUS16R8-7A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

8 ns

Yes

5.25 V

TTL

5

Chip Carrier

Registered

4.75 V

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 0 I/O

8

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

Power-Up Reset

74 MHz

8.965 mm

0

P3C18V8ZIAFA

NXP Semiconductors

UV PLD

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

45 ns

No

3.6 V

CMOS

3.3

In-Line

Macrocell

3 V

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-CDIP-T20

5.08 mm

7.62 mm

No

Programmable Output Polarity

18 MHz

24.305 mm

8

5962-8768201M2A

NXP Semiconductors

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

45 ns

Yes

5.5 V

Bipolar

MIL-STD-883

5

Chip Carrier

Combinatorial

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 10 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

No

e0

10

S82S153F/883B

NXP Semiconductors

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

45 ns

No

5.5 V

TTL

18

PLA-TYPE

5

In-Line

DIP20,.3

No

4.5 V

42

125 °C (257 °F)

0 Dedicated Inputs, 10 I/O

0

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T20

e0

10

No

10

PLS159AN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

35 ns

No

5.25 V

TTL

5

In-Line

Mixed

4.75 V

75 °C (167 °F)

4 Dedicated Inputs, 12 I/O

4

0 °C (32 °F)

Dual

R-PDIP-T20

No

Programmable Logic Sequencer; 1 External Clock

18 MHz

12

PLUS16L8-7A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

TTL

5

Chip Carrier

Combinatorial

4.75 V

1.27 mm

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

8.965 mm

6

PLC18V8ZIAN

NXP Semiconductors

OT PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

25 ns

No

5.5 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.5 V

74

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDIP-T20

4.2 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

30 MHz

8

26.73 mm

8

PLC18V8Z35A-T

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

35 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

21 MHz

8.965 mm

8

P3C18V8ZIA

NXP Semiconductors

OT PLD

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

50 ns

Yes

3.6 V

CMOS

3.3

Chip Carrier

Macrocell

2.7 V

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Quad

S-PQCC-J20

4.57 mm

8.9662 mm

No

8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

17 MHz

8.9662 mm

8

PLC18V8ZIAD-T

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

25 ns

Yes

5.5 V

CMOS

5

Small Outline

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2.65 mm

7.5 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

30 MHz

12.8 mm

8

N82S153AFB

NXP Semiconductors

OT PLD

Commercial

Through-Hole

20

DIP

Rectangular

Ceramic

30 ns

No

TTL

18

PLA-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

42

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-XDIP-T20

e0

10

PLQ16R4-5A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

8 ns

Yes

5.25 V

BICMOS

5

Chip Carrier

Mixed

4.75 V

75 °C (167 °F)

8 Dedicated Inputs, 4 I/O

8

0 °C (32 °F)

Quad

S-PQCC-J20

No

Register Preload; Power-Up Reset

118 MHz

4

PLC18V8ZIAD

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

25 ns

Yes

5.5 V

CMOS

18

PAL-TYPE

5

5 V

Small Outline

SOP20,.4

Programmable Logic Devices

Macrocell

4.5 V

74

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2.65 mm

7.5 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

30 MHz

8

12.8 mm

8

PLUS153DA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

12 ns

Yes

5.25 V

TTL

18

PLA-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Combinatorial

4.75 V

42

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 10 I/O

8

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

Programmable Output Polarity

10

8.965 mm

10

P3C18V8ZIDB

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

50 ns

Yes

3.6 V

CMOS

3.3

Small Outline, Shrink Pitch

Macrocell

2.7 V

.65 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

17 MHz

7.2 mm

8

P3C18V8Z40D-T

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

40 ns

Yes

3.6 V

CMOS

3.3

Small Outline

Macrocell

3 V

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDSO-G20

2.65 mm

7.5 mm

No

Programmable Output Polarity

22 MHz

12.8 mm

8

PLC18V8Z25D-T

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

25 ns

Yes

5.25 V

CMOS

5

Small Outline

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDSO-G20

2.65 mm

7.5 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

30 MHz

12.8 mm

8

P3C18V8Z40DH

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

40 ns

Yes

3.6 V

CMOS

3.3

Small Outline, Thin Profile, Shrink Pitch

Macrocell

3 V

.65 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDSO-G20

1.1 mm

4.4 mm

No

Programmable Output Polarity

22 MHz

6.5 mm

8

PLC18V8Z25FA

NXP Semiconductors

UV PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.25 V

CMOS

5

In-Line

Macrocell

4.75 V

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

30 MHz

24.305 mm

8

PLUS16R4-7N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Mixed

4.75 V

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 4 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T20

4.06 mm

7.62 mm

No

Power-Up Reset

74 MHz

26.695 mm

4

PLC18V8ZIFA

NXP Semiconductors

UV PLD

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

40 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

18 MHz

24.305 mm

8

PLUS16R8-7N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 0 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T20

4.06 mm

7.62 mm

No

Power-Up Reset

74 MHz

26.695 mm

0

PLC18V8Z35DB-T

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

35 ns

Yes

5.25 V

CMOS

5

Small Outline, Shrink Pitch

Macrocell

4.75 V

.65 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

21 MHz

7.2 mm

8

5962-8768201RX

NXP Semiconductors

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

45 ns

No

5.5 V

Bipolar

MIL-STD-883

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 10 I/O

8

-55 °C (-67 °F)

Dual

R-CDIP-T20

No

10

PLUS16R4-7A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

TTL

5

Chip Carrier

Mixed

4.75 V

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 4 I/O

8

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

Power-Up Reset

74 MHz

8.965 mm

4

PLC18V8ZIADH

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

25 ns

Yes

5.5 V

CMOS

18

PAL-TYPE

5

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

Programmable Logic Devices

Macrocell

4.5 V

74

.65 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

1.1 mm

4.4 mm

No

8 Macrocell; Power Up Reset; Shared Input/Clock

30 MHz

8

6.5 mm

8

PLC18V8Z25DB-T

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

25 ns

Yes

5.25 V

CMOS

5

Small Outline, Shrink Pitch

Macrocell

4.75 V

.65 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

8 Macrocell; Power Up Reset; Shared Input/Clock

30 MHz

7.2 mm

8

P3C18V8ZIADB-T

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

45 ns

Yes

3.6 V

CMOS

3.3

Small Outline, Shrink Pitch

Macrocell

3 V

.65 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

Programmable Output Polarity

18 MHz

7.2 mm

8

PLC18V8ZIN

NXP Semiconductors

OT PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

40 ns

No

5.5 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.5 V

74

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDIP-T20

4.2 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

18 MHz

8

26.73 mm

8

PLQ16R4-5N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8 ns

No

5.25 V

BICMOS

5

In-Line

Mixed

4.75 V

75 °C (167 °F)

8 Dedicated Inputs, 4 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T20

No

Register Preload; Power-Up Reset

118 MHz

4

PLC18V8Z35N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

35 ns

No

5.25 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.75 V

74

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T20

4.2 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

21 MHz

8

26.73 mm

8

PLUS16R8DN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 0 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T20

4.06 mm

7.62 mm

No

Power-Up Reset

60.6 MHz

26.695 mm

0

P3C18V8Z35N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

45 ns

No

3.6 V

CMOS

3.3

In-Line

Macrocell

2.7 V

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T20

4.2 mm

7.62 mm

No

8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

21 MHz

26.73 mm

8

PLC18V8ZIDB

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

40 ns

Yes

5.5 V

CMOS

18

PAL-TYPE

5

5 V

Small Outline, Shrink Pitch

DIP20,.3

Programmable Logic Devices

Macrocell

4.5 V

74

.65 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

18 MHz

8

7.2 mm

8

P3C18V8ZIFA

NXP Semiconductors

UV PLD

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

50 ns

No

3.6 V

CMOS

3.3

In-Line

Macrocell

2.7 V

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

17 MHz

24.305 mm

8

PLC18V8ZIADH-T

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

25 ns

Yes

5.5 V

CMOS

5

Small Outline, Thin Profile, Shrink Pitch

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

1.1 mm

4.4 mm

No

8 Macrocell; Power Up Reset; Shared Input/Clock

30 MHz

6.5 mm

8

PLC18V8Z35A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

35 ns

Yes

5.25 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.75 V

74

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

21 MHz

8

8.965 mm

8

LVT16V8-7DB

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

9 ns

Yes

3.6 V

BICMOS

3.3

Small Outline, Shrink Pitch

Macrocell

3 V

.65 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

91 MHz

7.2 mm

8

P3C18V8ZIAD-T

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

45 ns

Yes

3.6 V

CMOS

3.3

Small Outline

Macrocell

3 V

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2.65 mm

7.5 mm

No

Programmable Output Polarity

18 MHz

12.8 mm

8

82S153A/B2A

NXP Semiconductors

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

45 ns

Yes

5.5 V

TTL

5

Chip Carrier

Combinatorial

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 10 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

No

10

82S153A/BRA

NXP Semiconductors

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

45 ns

No

5.5 V

TTL

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 10 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

No

10

PLS157A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

55 ns

Yes

5.25 V

TTL

5

Chip Carrier

Mixed

4.75 V

1.27 mm

75 °C (167 °F)

4 Dedicated Inputs, 12 I/O

4

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

Programmable Logic Sequencer; 1 External Clock

14 MHz

8.965 mm

12

PLC18V8ZID

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

40 ns

Yes

5.5 V

CMOS

5

Small Outline

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2.65 mm

7.5 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

18 MHz

12.8 mm

8

PLC18V8Z25A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.25 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.75 V

74

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

30 MHz

8

8.965 mm

8

LVT16V8-7D

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

9 ns

Yes

3.6 V

BICMOS

3.3

Small Outline

Macrocell

3 V

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDSO-G20

2.65 mm

7.5 mm

No

8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

91 MHz

12.8 mm

8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.