20 Programmable Logic Devices (PLD) 1,360

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	JTAG Boundary Scan Test	No. of I/O Lines
PLUS16L8DA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	TTL				5		Chip Carrier				Combinatorial	4.75 V		1.27 mm	75 °C (167 °F)	10 Dedicated Inputs, 6 I/O	10	0 °C (32 °F)		Quad	S-PQCC-J20	4.57 mm	8.965 mm	No					8.965 mm		6
PLC18V8ZIA-T	NXP Semiconductors	OT PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.5 V	CMOS				5		Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		18 MHz		8.965 mm		8
PLUS16R6-7A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	TTL				5		Chip Carrier				Mixed	4.75 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 2 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	Power-Up Reset		74 MHz		8.965 mm		2
PHD16N8-5A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	TTL				5		Chip Carrier				Combinatorial	4.75 V		1.27 mm	75 °C (167 °F)	10 Dedicated Inputs, 6 I/O	10	0 °C (32 °F)		Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	High Speed Decoder				8.965 mm		6
PLC18V8Z35FA	NXP Semiconductors	UV PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	35 ns	No	5.25 V	CMOS				5		In-Line				Macrocell	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-GDIP-T20	5.08 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		21 MHz		24.305 mm		8
P3Q16V8-7N	NXP Semiconductors	OT PLD		Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	3.6 V	BICMOS				3.3		In-Line				Macrocell	3 V		2.54 mm		8 Dedicated Inputs, 9 I/O	8			Dual	R-PDIP-T20	4.06 mm	7.62 mm	No	8 Macrocells; 1 External Clock; 5 V compatile Inputs & I/O; Register Preload; Power-up reset		105 MHz		26.695 mm		9
PLUS16R4DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL				5		In-Line				Mixed	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 4 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20	4.06 mm	7.62 mm	No	Power-Up Reset		60.6 MHz		26.695 mm		4
PLC18V8Z25D	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline	SOP20,.4	Programmable Logic Devices		Macrocell	4.75 V	74	1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20	2.65 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		30 MHz	8	12.8 mm		8
PLUS153BA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	TTL		18	PLA-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Combinatorial	4.75 V	42	1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 10 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	Programmable Output Polarity			10	8.965 mm		10
PLC18V8ZIAA	NXP Semiconductors	OT PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.5 V	CMOS		18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	74	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		30 MHz	8	8.965 mm		8
P3C18V8ZIAN	NXP Semiconductors	OT PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	45 ns	No	3.6 V	CMOS				3.3		In-Line				Macrocell	3 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDIP-T20	4.2 mm	7.62 mm	No	Programmable Output Polarity		18 MHz		26.73 mm		8
LVT16V8-7N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	9 ns	No	3.6 V	BICMOS				3.3		In-Line				Macrocell	3 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20	4.2 mm	7.62 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		91 MHz		26.73 mm		8
PLHS18P8A/B2A	NXP Semiconductors	OT PLD		No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes								Chip Carrier									10 Dedicated Inputs, 8 I/O	10			Quad	S-CQCC-N20			No							8
PLC18V8ZIDB-T	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	40 ns	Yes	5.5 V	CMOS				5		Small Outline, Shrink Pitch				Macrocell	4.5 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20	2 mm	5.3 mm	No			18 MHz		7.2 mm		8
LVT16V8-7A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	9 ns	Yes	3.6 V	BICMOS				3.3		Chip Carrier				Macrocell	3 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J20	4.57 mm	8.9662 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		91 MHz		8.9662 mm		8
PLC18V8Z35D-T	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	35 ns	Yes	5.25 V	CMOS				5		Small Outline				Macrocell	4.75 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20	2.65 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		21 MHz		12.8 mm		8
LVT16V8-6A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	7 ns	Yes	3.6 V	BICMOS				3.3		Chip Carrier				Macrocell	3 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J20	4.57 mm	8.9662 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		111 MHz		8.9662 mm		8
PLQ16R6-5N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	BICMOS				5		In-Line				Mixed	4.75 V			75 °C (167 °F)	8 Dedicated Inputs, 2 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20			No	Register Preload; Power-Up Reset		118 MHz				2
PLC18V8Z/BRA(OT)	NXP Semiconductors	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	CMOS				5		In-Line				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20	5.08 mm	7.62 mm	No			25 MHz				8
P3C18V8Z35FA	NXP Semiconductors	UV PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	45 ns	No	3.6 V	CMOS				3.3		In-Line				Macrocell	2.7 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-GDIP-T20	5.08 mm	7.62 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		21 MHz		24.305 mm		8
PLS155N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	55 ns	No	5.25 V	TTL				5		In-Line				Mixed	4.75 V			75 °C (167 °F)	4 Dedicated Inputs, 12 I/O	4	0 °C (32 °F)		Dual	R-PDIP-T20			No	Programmable Logic Sequencer; 1 External Clock		14 MHz				12
PLS159AA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	35 ns	Yes	5.25 V	TTL		16	PLS-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Mixed	4.75 V	45	1.27 mm	75 °C (167 °F)	4 Dedicated Inputs, 12 I/O	4	0 °C (32 °F)		Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	Programmable Logic Sequencer; 1 External Clock		18 MHz	12	8.965 mm		12
PLHS18P8A/BSA	NXP Semiconductors	OT PLD		Flat	20	DFP	Rectangular	Ceramic, Metal-Sealed Cofired	30 ns	Yes								Flatpack				Combinatorial					10 Dedicated Inputs, 8 I/O	10			Dual	R-CDFP-F20			No							8
PLQ16L8-5N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	BICMOS				5		In-Line				Combinatorial	4.75 V			75 °C (167 °F)	10 Dedicated Inputs, 6 I/O	10	0 °C (32 °F)		Dual	R-PDIP-T20			No							6
PLUS16L8-7N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL				5		In-Line				Combinatorial	4.75 V		2.54 mm	75 °C (167 °F)	10 Dedicated Inputs, 6 I/O	10	0 °C (32 °F)		Dual	R-PDIP-T20	4.06 mm	7.62 mm	No					26.695 mm		6
PLUS16R8DA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	TTL				5		Chip Carrier				Registered	4.75 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 0 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	Power-Up Reset		60.6 MHz		8.965 mm		0
PLC18V8Z35DH-T	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	35 ns	Yes	5.25 V	CMOS				5		Small Outline, Thin Profile, Shrink Pitch				Macrocell	4.75 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Nickel Palladium Gold	Dual	R-PDSO-G20	1.1 mm	4.4 mm	No		e4	21 MHz		6.5 mm		8
5962-8768201MRX	NXP Semiconductors	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	45 ns	No	5.5 V	Bipolar	MIL-STD-883			5		In-Line				Combinatorial	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 10 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20			No							10
PLQ16R8-5A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	6 ns	Yes	5.25 V	BICMOS				5		Chip Carrier				Registered	4.75 V			75 °C (167 °F)	8 Dedicated Inputs, 0 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J20			No	Register Preload; Power-Up Reset		118 MHz				0
PLS153N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	40 ns	No	5.25 V	TTL				5		In-Line				Combinatorial	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 10 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20	4.06 mm	7.62 mm	No	Programmable Output Polarity				26.695 mm		10
P3Q16V8-7A	NXP Semiconductors	OT PLD		J Bend	20	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	BICMOS				3.3		Chip Carrier				Macrocell	3 V		1.27 mm		8 Dedicated Inputs, 9 I/O	8			Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	8 Macrocells; 1 External Clock; 5 V compatile Inputs & I/O; Register Preload; Power-up reset		105 MHz		8.965 mm		9
PLC18V8ZIAA-T	NXP Semiconductors	OT PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.5 V	CMOS				5		Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		30 MHz		8.965 mm		8
P3C18V8Z40DB	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	40 ns	Yes	3.6 V	CMOS				3.3		Small Outline, Shrink Pitch				Macrocell	3 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20	2 mm	5.3 mm	No	Programmable Output Polarity		22 MHz		7.2 mm		8
P3C18V8ZIADB	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	45 ns	Yes	3.6 V	CMOS				3.3		Small Outline, Shrink Pitch				Macrocell	3 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20	2 mm	5.3 mm	No	Programmable Output Polarity		18 MHz		7.2 mm		8
PLS157N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	55 ns	No	5.25 V	TTL				5		In-Line				Mixed	4.75 V		2.54 mm	75 °C (167 °F)	4 Dedicated Inputs, 12 I/O	4	0 °C (32 °F)		Dual	R-PDIP-T20	4.06 mm	7.62 mm	No	Programmable Logic Sequencer; 1 External Clock		14 MHz		26.695 mm		12
5962-8768201RA	NXP Semiconductors	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	45 ns	No	5.5 V	Bipolar		18	PLA-TYPE	5		In-Line			No	Combinatorial	4.5 V	42		125 °C (257 °F)	8 Dedicated Inputs, 10 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20			No				10		No	10
PLC18V8Z35DH	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	35 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.75 V	74	.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Nickel Palladium Gold	Dual	R-PDSO-G20	1.1 mm	4.4 mm	No		e4	21 MHz	8	6.5 mm		8
PLUS16L8DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL				5		In-Line				Combinatorial	4.75 V		2.54 mm	75 °C (167 °F)	10 Dedicated Inputs, 6 I/O	10	0 °C (32 °F)		Dual	R-PDIP-T20	4.06 mm	7.62 mm	No					26.695 mm		6
PLC18V8ZZID	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes	5.5 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline	SOP20,.4	Programmable Logic Devices		Macrocell	4.5 V	74	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20	2.65 mm	7.5 mm	No	8 Macrocell; Power Up Reset; Shared Input/Clock		18 MHz	8	12.8 mm		8
PLQ16R8-5N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	6 ns	No	5.25 V	BICMOS				5		In-Line				Registered	4.75 V			75 °C (167 °F)	8 Dedicated Inputs, 0 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20			No	Register Preload; Power-Up Reset		118 MHz				0
P3C18V8ZIADH	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	45 ns	Yes	3.6 V	CMOS				3.3		Small Outline, Thin Profile, Shrink Pitch				Macrocell	3 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20	1.1 mm	4.4 mm	No	Programmable Output Polarity		18 MHz		6.5 mm		8
5962-9233807M2A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	7 ns	Yes	5.5 V	BICMOS	MIL-STD-883			5		Chip Carrier				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20	1.905 mm	8.89 mm	No	Power-Up Reset	e0	105.3 MHz		8.89 mm		2
5962-9233804M2A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V	BICMOS	MIL-STD-883			5		Chip Carrier				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20	1.905 mm	8.89 mm	No	Power-Up Reset	e0	87 MHz		8.89 mm		4
5962-9233802M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V	BICMOS	MIL-STD-883			5		Chip Carrier				Registered	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20	1.905 mm	8.89 mm	No	Power-Up Reset		87 MHz		8.89 mm		0
5962-9233805M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	7 ns	Yes	5.5 V	BICMOS	MIL-STD-883			5		Chip Carrier				Combinatorial	4.5 V		1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Quad	S-CQCC-N20	1.905 mm	8.89 mm	No					8.89 mm		6
5962-9233804M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V	BICMOS	MIL-STD-883			5		Chip Carrier				Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20	1.905 mm	8.89 mm	No	Power-Up Reset		87 MHz		8.89 mm		4
5962-01-394-3671	Infineon Technologies	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	30 ns	No		CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20			No				8
5962-9233801M2A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V	BICMOS	MIL-STD-883			5		Chip Carrier				Combinatorial	4.5 V		1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20	1.905 mm	8.89 mm	No		e0			8.89 mm		6

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.