20 Programmable Logic Devices (PLD) 1,360

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
5962-9233806M2A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	7 ns	Yes	5.5 V	BICMOS	MIL-STD-883			5		Chip Carrier			Registered	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset	e0	105.3 MHz				8.89 mm	0
5962-01-421-4812	Infineon Technologies	EE PLD	Military	No Lead	20	QCCN	Square	Ceramic	20 ns	Yes		CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices	Registered		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N20				No			28.5 MHz		6
5962-9233808M2A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	7 ns	Yes	5.5 V	BICMOS	MIL-STD-883			5		Chip Carrier			Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset	e0	105.3 MHz				8.89 mm	4
5962-88713082X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V	CMOS				5		Chip Carrier			Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		1.905 mm	8.89 mm	No			22 MHz				8.89 mm	4
5962-9233803M2A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V	BICMOS	MIL-STD-883			5		Chip Carrier			Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset	e0	87 MHz				8.89 mm	2
5962-9233805M2A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	7 ns	Yes	5.5 V	BICMOS	MIL-STD-883			5		Chip Carrier			Combinatorial	4.5 V		1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		1.905 mm	8.89 mm	No		e0					8.89 mm	6
5962-9233808M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	7 ns	Yes	5.5 V	BICMOS	MIL-STD-883			5		Chip Carrier			Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset		105.3 MHz				8.89 mm	4
5962-9233801M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V	BICMOS	MIL-STD-883			5		Chip Carrier			Combinatorial	4.5 V		1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Quad	S-CQCC-N20		1.905 mm	8.89 mm	No							8.89 mm	6
5962-9233803M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V	BICMOS	MIL-STD-883			5		Chip Carrier			Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset		87 MHz				8.89 mm	2
5962-88713082A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V	CMOS				5		Chip Carrier			Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		1.905 mm	8.89 mm	No		e0	22 MHz				8.89 mm	4
5962-01-382-8760	Infineon Technologies	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	40 ns	No		CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Combinatorial		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20				No					8
5962-01-360-1553	Infineon Technologies	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	30 ns	No		CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Combinatorial		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20				No					8
5962-01-382-8715	Infineon Technologies	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	40 ns	No		CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Combinatorial		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20				No					8
5962-01-277-6831	Infineon Technologies	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	40 ns	No		CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20				No			16.5 MHz		4
5962-9233806M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	7 ns	Yes	5.5 V	BICMOS	MIL-STD-883			5		Chip Carrier			Registered	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset		105.3 MHz				8.89 mm	0
5962-01-360-4028	Infineon Technologies	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	40 ns	No		CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20				No			16.5 MHz		6
5962-01-364-5424	Infineon Technologies	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Combinatorial		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T20				No					8
5962-9233802M2A	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V	BICMOS	MIL-STD-883			5		Chip Carrier			Registered	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset	e0	87 MHz				8.89 mm	0
5962-9233807M2X	Infineon Technologies	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	7 ns	Yes	5.5 V	BICMOS	MIL-STD-883			5		Chip Carrier			Mixed	4.5 V		1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		1.905 mm	8.89 mm	No	Power-Up Reset		105.3 MHz				8.89 mm	2
PEEL18CV8ZP-25	Diodes Incorporated	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V	CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.75 V	113	2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20			7.62 mm	No		e0	33.3 MHz		8		26.162 mm	8
PEEL18CV8S-7L	Diodes Incorporated	EE PLD	Commercial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline	SOP20,.4	Programmable Logic Devices	Macrocell	4.75 V	74	1.27 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Matte Tin	Dual	R-PDSO-G20	3	2.64 mm	7.5 mm	No		e3	83.3 MHz		8	260 °C (500 °F)	12.8 mm	8
PEEL18LV8ZT-15	Diodes Incorporated	EE PLD	Commercial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V	CMOS		18	PAL-TYPE	3	3/3.3 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices	Macrocell	2.7 V	113	.65 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G20		1.1 mm	4.4 mm	No		e0	31.25 MHz		8		6.5 mm	8
PEEL18CV8J-10	Diodes Incorporated	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Macrocell	4.75 V	74	1.27 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20		4.369 mm	8.9662 mm	No		e0	83.3 MHz		8		8.9662 mm	8
PEEL18CV8SI-25	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline	SOP20,.4	Programmable Logic Devices	Macrocell	4.5 V	74	1.27 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G20		2.64 mm	7.5 mm	No		e0	28.5 MHz		8		12.8 mm	8
PEEL18CV8ZS-25	Diodes Incorporated	EE PLD	Commercial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline	SOP20,.4	Programmable Logic Devices	Macrocell	4.75 V	113	1.27 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G20		2.64 mm	7.5 mm	No		e0	33.3 MHz		8		12.8 mm	8
PEEL18CV8S-10L	Diodes Incorporated	EE PLD	Commercial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline	SOP20,.4	Programmable Logic Devices	Macrocell	4.75 V	74	1.27 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Matte Tin	Dual	R-PDSO-G20	3	2.64 mm	7.5 mm	No		e3	83.3 MHz		8	260 °C (500 °F)	12.8 mm	8
PEEL18CV8S-10	Diodes Incorporated	EE PLD	Commercial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline	SOP20,.4	Programmable Logic Devices	Macrocell	4.75 V	74	1.27 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G20		2.64 mm	7.5 mm	No		e0	83.3 MHz		8		12.8 mm	8
PEEL18LV8ZP-15	Diodes Incorporated	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	3.6 V	CMOS		18	PAL-TYPE	3	3/3.3 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	2.7 V	113	2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20			7.62 mm	No		e0	31.25 MHz		8		26.162 mm	8
PEEL18CV8TI-15	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices	Macrocell	4.5 V	74	.65 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G20		1.1 mm	4.4 mm	No		e0	41.6 MHz		8		6.5 mm	8
PEEL16CV8T-25L	Diodes Incorporated	EE PLD	Commercial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices	Macrocell	4.75 V	64	.65 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Matte Tin	Dual	R-PDSO-G20	3	1.1 mm	4.4 mm	No		e3	28.5 MHz		8	260 °C (500 °F)	6.5 mm	8
PEEL18CV8J-7L	Diodes Incorporated	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Macrocell	4.75 V	74	1.27 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J20	3	4.369 mm	8.9662 mm	No		e3	83.3 MHz		8	260 °C (500 °F)	8.9662 mm	8
PEEL18CV8ZTI-25	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices	Macrocell	4.5 V	113	.65 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G20		1.1 mm	4.4 mm	No		e0	33.3 MHz		8		6.5 mm	8
PEEL18LV8ZSI-35	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	35 ns	Yes	3.6 V	CMOS		18	PAL-TYPE	3	3/3.3 V	Small Outline	SOP20,.4	Programmable Logic Devices	Macrocell	2.7 V	113	1.27 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G20		2.64 mm	7.5 mm	No		e0	17.9 MHz		8		12.8 mm	8
PEEL18CV8S-15L	Diodes Incorporated	EE PLD	Commercial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline	SOP20,.4	Programmable Logic Devices	Macrocell	4.75 V	74	1.27 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Matte Tin	Dual	R-PDSO-G20	3	2.64 mm	7.5 mm	No		e3	41.6 MHz		8	260 °C (500 °F)	12.8 mm	8
PEEL18CV8JI-10L	Diodes Incorporated	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	CMOS		18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Macrocell	4.5 V	74	1.27 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J20	3	4.369 mm	8.9662 mm	No		e3	83.3 MHz		8	260 °C (500 °F)	8.9662 mm	8
PEEL18CV8JI-10	Diodes Incorporated	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	CMOS		18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Macrocell	4.5 V	74	1.27 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J20		4.369 mm	8.9662 mm	No		e0	83.3 MHz		8		8.9662 mm	8
PEEL18CV8S-25L	Diodes Incorporated	EE PLD	Commercial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline	SOP20,.4	Programmable Logic Devices	Macrocell	4.75 V	74	1.27 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Matte Tin	Dual	R-PDSO-G20	3	2.64 mm	7.5 mm	No		e3	28.5 MHz		8	260 °C (500 °F)	12.8 mm	8
PEEL18LV8ZT-25	Diodes Incorporated	EE PLD	Commercial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	3.6 V	CMOS		18	PAL-TYPE	3	3/3.3 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices	Macrocell	2.7 V	113	.65 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G20		1.1 mm	4.4 mm	No		e0	25 MHz		8		6.5 mm	8
PEEL18CV8T-10	Diodes Incorporated	EE PLD	Commercial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices	Macrocell	4.75 V	74	.65 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G20		1.1 mm	4.4 mm	No		e0	83.3 MHz		8		6.5 mm	8
PEEL16CV8J-25L	Diodes Incorporated	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	7 Dedicated Inputs, 10 I/O	7	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J20	3	4.369 mm	8.9662 mm	No		e3	28.5 MHz		8	260 °C (500 °F)	8.9662 mm	10
PEEL18LV8ZTI-15L	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V	CMOS		18	PAL-TYPE	3	3/3.3 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices	Macrocell	2.7 V	113	.65 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	3	1.1 mm	4.4 mm	No		e3	31.25 MHz		8	260 °C (500 °F)	6.5 mm	8
PEEL18CV8TI-15L	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices	Macrocell	4.5 V	74	.65 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	3	1.1 mm	4.4 mm	No		e3	41.6 MHz		8	260 °C (500 °F)	6.5 mm	8
PEEL18CV8PI-15	Diodes Incorporated	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V	CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.5 V	74	2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20			7.62 mm	No		e0	41.6 MHz		8		26.162 mm	8
PEEL18CV8T-15	Diodes Incorporated	EE PLD	Commercial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices	Macrocell	4.75 V	74	.65 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G20		1.1 mm	4.4 mm	No		e0	41.6 MHz		8		6.5 mm	8
PEEL18CV8J-15	Diodes Incorporated	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Macrocell	4.75 V	74	1.27 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20		4.369 mm	8.9662 mm	No		e0	41.6 MHz		8		8.9662 mm	8
PEEL18LV8ZS-15	Diodes Incorporated	EE PLD	Commercial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V	CMOS		18	PAL-TYPE	3	3/3.3 V	Small Outline	SOP20,.4	Programmable Logic Devices	Macrocell	2.7 V	113	1.27 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G20		2.64 mm	7.5 mm	No		e0	31.25 MHz		8		12.8 mm	8
PEEL18CV8ZSI-25L	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V	CMOS				5		Small Outline			Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	3	2.64 mm	7.5 mm	No		e3	33.3 MHz	40 s		260 °C (500 °F)	12.8 mm	8
PEEL18LV8ZPI-35L	Diodes Incorporated	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	35 ns	No	3.6 V	CMOS		18	PAL-TYPE	3	3/3.3 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	2.7 V	113	2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T20			7.62 mm	No		e3	17.9 MHz		8	260 °C (500 °F)	26.162 mm	8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.