20 Programmable Logic Devices (PLD) 1,360

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	JTAG Boundary Scan Test	No. of I/O Lines
M38510/50404BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	Bipolar	MIL-M-38510 Class B	12	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 8 I/O	10	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20			Yes		e0	20 MHz	8		No	8
GAL16V8AS-15EC1	STMicroelectronics	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	CMOS				5			Chip Carrier				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J20	4.57 mm	8.9662 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		41.6 MHz		8.9662 mm		8
GAL16V8S-20EB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.25 V	CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3.93 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	33.3 MHz	8	25.15 mm		8
GAL16V8AS-15QC1	STMicroelectronics	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20	4.57 mm	8.9662 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	41.6 MHz	8	8.9662 mm		8
GAL16V8S-25HC3	STMicroelectronics	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J20			No		e0	28.5 MHz	8
GAL16V8AS-15EC3	STMicroelectronics	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	CMOS				5			Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Quad	S-PQCC-J20	4.57 mm	8.9662 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		41.6 MHz		8.9662 mm		8
GAL16V8S-25QC3	STMicroelectronics	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J20			No		e0	28.5 MHz	8
GAL16V8-15HF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Ceramic	15 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	41.6 MHz	8
GAL16V8-25HD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Ceramic	25 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	28.5 MHz	8
GAL16V8-20HZ2	STMicroelectronics	EE PLD	Military	No Lead	20	QCCN	Square	Ceramic	20 ns	Yes		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-XQCC-N20			No		e0	33.3 MHz	8
GAL16V8AS-12HC1	STMicroelectronics	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20	4.57 mm	8.9662 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	48.5 MHz	8	8.9662 mm		8
GAL16V8AS-15QC3	STMicroelectronics	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J20	4.57 mm	8.9662 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	41.6 MHz	8	8.9662 mm		8
GAL16V8S-25EB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	28.5 MHz	8
GAL16V8AS-25HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	28.5 MHz	8
GAL16V8AS-25HC1	STMicroelectronics	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20			No		e0	28.5 MHz	8
GAL16V8AS-10HC1	STMicroelectronics	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20	4.57 mm	8.9662 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	58.8 MHz	8	8.9662 mm		8
GAL16V8S-20QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	33.3 MHz	8
GAL16V8-20HC1	STMicroelectronics	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	20 ns	Yes		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20			No		e0	33.3 MHz	8
GAL16V8AS-12HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	12 ns	No	5.25 V	CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3.93 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	48.5 MHz	8	25.15 mm		8
GAL16V8S-20EB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.5 V	CMOS				5			In-Line				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDIP-T20	3.93 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		33.3 MHz		25.15 mm		8
GAL16V8AS-15EB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	CMOS				5			In-Line				Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20	3.93 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		41.6 MHz		25.15 mm		8
GAL16V8AS-25QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	28.5 MHz	8
GAL16V8-30QZ2	STMicroelectronics	EE PLD	Military	No Lead	20	QCCN	Square	Ceramic	30 ns	Yes		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-XQCC-N20			No		e0	22.2 MHz	8
GAL16V8-25HZ1	STMicroelectronics	EE PLD	Commercial	No Lead	20	QCCN	Square	Ceramic	25 ns	Yes		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-XQCC-N20			No		e0	28.5 MHz	8
GAL16V8-20QF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Ceramic	20 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	33.3 MHz	8
GAL16V8AS-25QC1	STMicroelectronics	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20			No		e0	28.5 MHz	8
GAL16V8S-20QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	33.3 MHz	8
GAL16V8S-25EC1	STMicroelectronics	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20			No		e0	28.5 MHz	8
GAL16V8S-15EC1	STMicroelectronics	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	15 ns	Yes		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20			No		e0	41.6 MHz	8
GAL16V8AS-20HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.25 V	CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3.93 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	33.3 MHz	8	25.15 mm		8
GAL16V8-20QD2	STMicroelectronics	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	20 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	33.3 MHz	8
GAL16V8AS-25HB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	28.5 MHz	8
GAL16V8S-20HC3	STMicroelectronics	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	20 ns	Yes		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J20			No		e0	33.3 MHz	8
GAL16V8AS-20HC1	STMicroelectronics	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20	4.57 mm	8.9662 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	33.3 MHz	8	8.9662 mm		8
GAL16V8S-20HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	33.3 MHz	8
GAL16V8-15HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	41.6 MHz	8
GAL16V8-15HZ1	STMicroelectronics	EE PLD	Commercial	No Lead	20	QCCN	Square	Ceramic	15 ns	Yes		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-XQCC-N20			No		e0	41.6 MHz	8
GAL16V8AS-15QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V	CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20	3.93 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	41.6 MHz	8	25.15 mm		8
GAL16V8S-20HB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	33.3 MHz	8
GAL16V8-20HF2	STMicroelectronics	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	20 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	33.3 MHz	8
GAL16V8-30QF2	STMicroelectronics	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	30 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	22.2 MHz	8
GAL16V8-25HC1	STMicroelectronics	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20			No		e0	28.5 MHz	8
GAL16V8S-20EC1	STMicroelectronics	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20	4.57 mm	8.9662 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	33.3 MHz	8	8.9662 mm		8
GAL16V8S-25QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	28.5 MHz	8
GAL16V8-25QC1	STMicroelectronics	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20	4.57 mm	8.965 mm	No		e0	28.5 MHz	8	8.965 mm		8
GAL16V8AS-25QC3	STMicroelectronics	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J20			No		e0	28.5 MHz	8
GAL16V8-25QF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Ceramic	25 ns	No		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	28.5 MHz	8
GAL16V8S-25HC1	STMicroelectronics	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell		64	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J20			No		e0	28.5 MHz	8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.