Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
30 ns |
No |
5.25 V |
TTL |
5 |
In-Line |
Registered |
4.75 V |
2.54 mm |
75 °C (167 °F) |
16 Dedicated Inputs, 0 I/O |
16 |
0 °C (32 °F) |
Dual |
R-PDIP-T28 |
5.08 mm |
15.24 mm |
No |
Programmable Logic Sequencer; 1 External Clock |
9.8 MHz |
36.51 mm |
0 |
||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Chip Carrier |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
No |
65 MHz |
11.5062 mm |
10 |
|||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
35 ns |
Yes |
5.5 V |
Bipolar |
MIL-STD-883 |
5 |
Chip Carrier |
Registered |
4.5 V |
125 °C (257 °F) |
16 Dedicated Inputs, 0 I/O |
16 |
-55 °C (-67 °F) |
Quad |
S-CQCC-N28 |
No |
0 |
|||||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
8 ns |
Yes |
5.25 V |
BICMOS |
5 |
Chip Carrier |
Combinatorial |
4.75 V |
75 °C (167 °F) |
14 Dedicated Inputs, 6 I/O |
14 |
0 °C (32 °F) |
Quad |
S-PQCC-J28 |
No |
6 |
||||||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
35 ns |
No |
5.5 V |
Bipolar |
MIL-STD-883 |
5 |
In-Line |
Registered |
4.5 V |
125 °C (257 °F) |
15 Dedicated Inputs, 0 I/O |
15 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T28 |
No |
0 |
|||||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Military |
Flat |
28 |
DFP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
80 ns |
Yes |
5.5 V |
TTL |
5 |
Flatpack |
Combinatorial |
4.5 V |
125 °C (257 °F) |
16 Dedicated Inputs, 0 I/O |
16 |
-55 °C (-67 °F) |
Dual |
R-CDFP-F28 |
No |
0 |
||||||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
8 ns |
Yes |
5.25 V |
BICMOS |
22 |
PLA-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Quad |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
No |
10 Macrocells; Variable Product Terms; Power-Up Reset; 1 External Clock; Shared Input/Clock |
111 MHz |
10 |
11.5062 mm |
10 |
|||||||||||||
NXP Semiconductors |
OT PLD |
Other |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
4.5 ns |
Yes |
ECL |
20 |
PAL-TYPE |
-4.5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
90 |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 8 I/O |
11 |
0 °C (32 °F) |
Quad |
S-PQCC-J28 |
1 |
4.57 mm |
11.505 mm |
No |
8 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset |
204 MHz |
8 |
11.505 mm |
8 |
|||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
TTL |
5 |
Chip Carrier |
Combinatorial |
4.75 V |
1.27 mm |
75 °C (167 °F) |
14 Dedicated Inputs, 6 I/O |
14 |
0 °C (32 °F) |
Quad |
S-PQCC-J28 |
4.57 mm |
11.505 mm |
No |
11.505 mm |
6 |
||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
30 ns |
No |
5.25 V |
TTL |
5 |
In-Line |
Registered |
4.75 V |
2.54 mm |
75 °C (167 °F) |
16 Dedicated Inputs, 0 I/O |
16 |
0 °C (32 °F) |
Dual |
R-PDIP-T28 |
5.08 mm |
15.24 mm |
No |
Programmable Logic Sequencer; 1 External Clock |
12.5 MHz |
36.51 mm |
0 |
||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
40 ns |
Yes |
5.5 V |
TTL |
5 |
Chip Carrier |
Registered |
4.5 V |
125 °C (257 °F) |
15 Dedicated Inputs, 0 I/O |
15 |
-55 °C (-67 °F) |
Quad |
S-CQCC-N28 |
No |
10.5 MHz |
0 |
|||||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
Bipolar |
In-Line |
16 Dedicated Inputs |
16 |
Dual |
R-CDIP-T28 |
No |
30 MHz |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Quad |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
No |
83 MHz |
11.5062 mm |
10 |
|||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
TTL |
5 |
Chip Carrier |
Mixed |
4.75 V |
1.27 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 2 I/O |
12 |
0 °C (32 °F) |
Quad |
S-PQCC-J28 |
4.57 mm |
11.505 mm |
No |
Power-Up Reset |
60.6 MHz |
11.505 mm |
2 |
||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
7.5 ns |
Yes |
5.25 V |
BICMOS |
MIL-STD-883 Class B |
5 |
Chip Carrier |
Macrocell |
4.75 V |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
No |
e0 |
71 MHz |
10 |
||||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J28 |
4.57 mm |
11.505 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset |
50 MHz |
11.505 mm |
10 |
||||||||||||||||||||
Infineon Technologies |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
132 |
1.27 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
No |
e0 |
143 MHz |
10 |
|||||||||||||||||||
Infineon Technologies |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
132 |
1.27 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
No |
e0 |
143 MHz |
10 |
|||||||||||||||||||
Infineon Technologies |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
132 |
1.27 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
No |
e0 |
143 MHz |
10 |
|||||||||||||||||||
Infineon Technologies |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
132 |
1.27 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
No |
e0 |
143 MHz |
10 |
|||||||||||||||||||
Infineon Technologies |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic |
No |
CMOS |
25 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP28,.3 |
Programmable Logic Devices |
192 |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-XDIP-T28 |
No |
23.8 MHz |
12 |
|||||||||||||||||||||||||
Infineon Technologies |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
132 |
1.27 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
No |
e0 |
143 MHz |
10 |
|||||||||||||||||||
Infineon Technologies |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic |
No |
CMOS |
38535Q/M;38534H;883B |
25 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP28,.3 |
Programmable Logic Devices |
192 |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T28 |
No |
14.2 MHz |
12 |
||||||||||||||||||||||||
Infineon Technologies |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
132 |
1.27 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
No |
e0 |
143 MHz |
10 |
|||||||||||||||||||
Diodes Incorporated |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
4.369 mm |
11.5062 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
33.3 MHz |
10 |
11.5062 mm |
10 |
|||||||||||
Diodes Incorporated |
EE PLD |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
26 |
5 |
5 V |
Small Outline |
SOP28,.4 |
Field Programmable Gate Arrays |
Mixed |
4.5 V |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 12 I/O |
12 |
-40 °C (-40 °F) |
Dual |
R-PDSO-G28 |
2.64 mm |
7.5 mm |
No |
83.3 MHz |
12 |
245 °C (473 °F) |
17.9 mm |
12 |
|||||||||||||||
|
Diodes Incorporated |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
3 |
4.369 mm |
11.5062 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e3 |
33.3 MHz |
40 s |
260 °C (500 °F) |
11.5062 mm |
10 |
||||||||||||||
Diodes Incorporated |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
4.369 mm |
11.5062 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
62.5 MHz |
10 |
11.5062 mm |
10 |
|||||||||||
Diodes Incorporated |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
4.369 mm |
11.5062 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
33.3 MHz |
10 |
11.5062 mm |
10 |
|||||||||||
|
Diodes Incorporated |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
133 |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
3 |
4.369 mm |
11.5062 mm |
No |
e3 |
33.3 MHz |
10 |
260 °C (500 °F) |
11.5062 mm |
10 |
|||||||||
Diodes Incorporated |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
26 |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Field Programmable Gate Arrays |
Mixed |
4.5 V |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 12 I/O |
12 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J28 |
4.369 mm |
11.5062 mm |
No |
83.3 MHz |
12 |
245 °C (473 °F) |
11.5062 mm |
12 |
|||||||||||||||
Diodes Incorporated |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
4.369 mm |
11.5062 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
62.5 MHz |
10 |
11.5062 mm |
10 |
|||||||||||
Diodes Incorporated |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
26 |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Field Programmable Gate Arrays |
Mixed |
4.75 V |
1.27 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 12 I/O |
12 |
0 °C (32 °F) |
Quad |
S-PQCC-J28 |
4.369 mm |
11.5062 mm |
No |
83.3 MHz |
12 |
245 °C (473 °F) |
11.5062 mm |
12 |
|||||||||||||||
|
Diodes Incorporated |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
22 |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Field Programmable Gate Arrays |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 20 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
3 |
4.369 mm |
11.5062 mm |
No |
e3 |
71.4 MHz |
22 |
260 °C (500 °F) |
11.5062 mm |
20 |
|||||||||||
Diodes Incorporated |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
4.369 mm |
11.5062 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
117 MHz |
10 |
11.5062 mm |
10 |
|||||||||||
|
Diodes Incorporated |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
3 |
4.369 mm |
11.5062 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e3 |
62.5 MHz |
40 s |
260 °C (500 °F) |
11.5062 mm |
10 |
||||||||||||||
Diodes Incorporated |
EE PLD |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
26 |
5 |
5 V |
In-Line |
DIP28,.3 |
Field Programmable Gate Arrays |
Mixed |
4.75 V |
2.54 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 12 I/O |
12 |
0 °C (32 °F) |
Dual |
R-PDIP-T28 |
7.62 mm |
No |
83.3 MHz |
12 |
245 °C (473 °F) |
34.925 mm |
12 |
||||||||||||||||
|
Diodes Incorporated |
EE PLD |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
26 |
5 |
5 V |
Small Outline |
SOP28,.4 |
Field Programmable Gate Arrays |
Mixed |
4.5 V |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 12 I/O |
12 |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G28 |
3 |
2.64 mm |
7.5 mm |
No |
e3 |
83.3 MHz |
12 |
260 °C (500 °F) |
17.9 mm |
12 |
|||||||||||
Diodes Incorporated |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
22 |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Field Programmable Gate Arrays |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 20 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
4.369 mm |
11.5062 mm |
No |
e0 |
71.4 MHz |
22 |
11.5062 mm |
20 |
||||||||||||||
|
Diodes Incorporated |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
3.6 V |
CMOS |
22 |
PAL-TYPE |
3 |
3/3.3 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
2.7 V |
133 |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
3 |
4.369 mm |
11.5062 mm |
No |
e3 |
25 MHz |
10 |
260 °C (500 °F) |
11.5062 mm |
10 |
|||||||||
|
Diodes Incorporated |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
22 |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Field Programmable Gate Arrays |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 20 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
3 |
4.369 mm |
11.5062 mm |
No |
e3 |
71.4 MHz |
22 |
260 °C (500 °F) |
11.5062 mm |
20 |
|||||||||||
|
Diodes Incorporated |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
3 |
4.369 mm |
11.5062 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e3 |
90.9 MHz |
260 °C (500 °F) |
11.5062 mm |
10 |
|||||||||||||||
|
Diodes Incorporated |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
133 |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
3 |
4.369 mm |
11.5062 mm |
No |
e3 |
33.3 MHz |
10 |
260 °C (500 °F) |
11.5062 mm |
10 |
|||||||||
Diodes Incorporated |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
133 |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQCC-J28 |
4.369 mm |
11.5062 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
33.3 MHz |
10 s |
10 |
235 °C (455 °F) |
11.5062 mm |
10 |
|||||||||
|
Diodes Incorporated |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
3 |
4.369 mm |
11.5062 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock |
e3 |
117 MHz |
260 °C (500 °F) |
11.5062 mm |
10 |
|||||||||||||||
Diodes Incorporated |
EE PLD |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.5 V |
CMOS |
26 |
5 |
5 V |
In-Line |
DIP28,.3 |
Field Programmable Gate Arrays |
Mixed |
4.5 V |
2.54 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 12 I/O |
12 |
-40 °C (-40 °F) |
Dual |
R-PDIP-T28 |
7.62 mm |
No |
83.3 MHz |
12 |
245 °C (473 °F) |
34.925 mm |
12 |
||||||||||||||||
|
Diodes Incorporated |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
22 |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Field Programmable Gate Arrays |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 20 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
3 |
4.369 mm |
11.5062 mm |
No |
e3 |
71.4 MHz |
22 |
260 °C (500 °F) |
11.5062 mm |
20 |
|||||||||||
Diodes Incorporated |
EE PLD |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
3.6 V |
CMOS |
22 |
PAL-TYPE |
3 |
3/3.3 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
2.7 V |
133 |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
4.369 mm |
11.5062 mm |
No |
e0 |
25 MHz |
10 |
11.5062 mm |
10 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.