28 Programmable Logic Devices (PLD) 916

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

PLS105N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

30 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Dual

R-PDIP-T28

5.08 mm

15.24 mm

No

Programmable Logic Sequencer; 1 External Clock

9.8 MHz

36.51 mm

0

P3Z22V10IBA-T

NXP Semiconductors

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

3.6 V

CMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

65 MHz

11.5062 mm

10

5962-8670901Y3X

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

35 ns

Yes

5.5 V

Bipolar

MIL-STD-883

5

Chip Carrier

Registered

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Quad

S-CQCC-N28

No

0

PLQ20L8-5A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

8 ns

Yes

5.25 V

BICMOS

5

Chip Carrier

Combinatorial

4.75 V

75 °C (167 °F)

14 Dedicated Inputs, 6 I/O

14

0 °C (32 °F)

Quad

S-PQCC-J28

No

6

5962-8670901XX

NXP Semiconductors

OT PLD

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

35 ns

No

5.5 V

Bipolar

MIL-STD-883

5

In-Line

Registered

4.5 V

125 °C (257 °F)

15 Dedicated Inputs, 0 I/O

15

-55 °C (-67 °F)

Dual

R-GDIP-T28

No

0

82S100/BYA

NXP Semiconductors

OT PLD

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

80 ns

Yes

5.5 V

TTL

5

Flatpack

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-CDFP-F28

No

0

ABT22V10A7A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

8 ns

Yes

5.25 V

BICMOS

22

PLA-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

132

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

10 Macrocells; Variable Product Terms; Power-Up Reset; 1 External Clock; Shared Input/Clock

111 MHz

10

11.5062 mm

10

10020EV8-4A

NXP Semiconductors

OT PLD

Other

J Bend

28

QCCJ

Square

Plastic/Epoxy

4.5 ns

Yes

ECL

20

PAL-TYPE

-4.5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

90

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 8 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

1

4.57 mm

11.505 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

204 MHz

8

11.505 mm

8

PLUS20L8DA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

TTL

5

Chip Carrier

Combinatorial

4.75 V

1.27 mm

75 °C (167 °F)

14 Dedicated Inputs, 6 I/O

14

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

11.505 mm

6

PLS105AN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

30 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Dual

R-PDIP-T28

5.08 mm

15.24 mm

No

Programmable Logic Sequencer; 1 External Clock

12.5 MHz

36.51 mm

0

82S105/B3A-T

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

40 ns

Yes

5.5 V

TTL

5

Chip Carrier

Registered

4.5 V

125 °C (257 °F)

15 Dedicated Inputs, 0 I/O

15

-55 °C (-67 °F)

Quad

S-CQCC-N28

No

10.5 MHz

0

PLUS405/BXA

NXP Semiconductors

OT PLD

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

Bipolar

In-Line

16 Dedicated Inputs

16

Dual

R-CDIP-T28

No

30 MHz

P5Z22V10-DA

NXP Semiconductors

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

83 MHz

11.5062 mm

10

PLUS20R6DA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

TTL

5

Chip Carrier

Mixed

4.75 V

1.27 mm

75 °C (167 °F)

12 Dedicated Inputs, 2 I/O

12

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Power-Up Reset

60.6 MHz

11.505 mm

2

5962-9176008M3A

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

7.5 ns

Yes

5.25 V

BICMOS

MIL-STD-883 Class B

5

Chip Carrier

Macrocell

4.75 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

No

e0

71 MHz

10

PL22V10I15A

NXP Semiconductors

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

50 MHz

11.505 mm

10

5962-01-382-4960

Infineon Technologies

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 ns

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

No

e0

143 MHz

10

5962-01-382-7255

Infineon Technologies

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 ns

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

No

e0

143 MHz

10

5962-01-382-3824

Infineon Technologies

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 ns

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

No

e0

143 MHz

10

5962-01-382-3822

Infineon Technologies

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 ns

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

No

e0

143 MHz

10

5962-01-359-8984

Infineon Technologies

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic

No

CMOS

25

PAL-TYPE

5

5 V

In-Line

DIP28,.3

Programmable Logic Devices

192

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T28

No

23.8 MHz

12

5962-01-382-7170

Infineon Technologies

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 ns

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

No

e0

143 MHz

10

5962-01-349-7443

Infineon Technologies

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

CMOS

38535Q/M;38534H;883B

25

PAL-TYPE

5

5 V

In-Line

DIP28,.3

Programmable Logic Devices

192

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T28

No

14.2 MHz

12

5962-01-382-3838

Infineon Technologies

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 ns

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

No

e0

143 MHz

10

PEEL22CV10AJ-25

Diodes Incorporated

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.25 V

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

132

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

4.369 mm

11.5062 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock

e0

33.3 MHz

10

11.5062 mm

10

PA7536SI-15

Diodes Incorporated

EE PLD

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

26

5

5 V

Small Outline

SOP28,.4

Field Programmable Gate Arrays

Mixed

4.5 V

1.27 mm

85 °C (185 °F)

12 Dedicated Inputs, 12 I/O

12

-40 °C (-40 °F)

Dual

R-PDSO-G28

2.64 mm

7.5 mm

No

83.3 MHz

12

245 °C (473 °F)

17.9 mm

12

PEEL22CV10AJI-25L

Diodes Incorporated

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J28

3

4.369 mm

11.5062 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock

e3

33.3 MHz

40 s

260 °C (500 °F)

11.5062 mm

10

PEEL22CV10AJI-15

Diodes Incorporated

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.5 V

132

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

4.369 mm

11.5062 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock

e0

62.5 MHz

10

11.5062 mm

10

PEEL22CV10AJI-25

Diodes Incorporated

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.5 V

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.5 V

132

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

4.369 mm

11.5062 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock

e0

33.3 MHz

10

11.5062 mm

10

PEEL22CV10AZJI-25L

Diodes Incorporated

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.5 V

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.5 V

133

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J28

3

4.369 mm

11.5062 mm

No

e3

33.3 MHz

10

260 °C (500 °F)

11.5062 mm

10

PA7536JI-15

Diodes Incorporated

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

26

5

5 V

Chip Carrier

LDCC28,.5SQ

Field Programmable Gate Arrays

Mixed

4.5 V

1.27 mm

85 °C (185 °F)

12 Dedicated Inputs, 12 I/O

12

-40 °C (-40 °F)

Quad

S-PQCC-J28

4.369 mm

11.5062 mm

No

83.3 MHz

12

245 °C (473 °F)

11.5062 mm

12

PEEL22CV10AJ-15

Diodes Incorporated

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

132

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

4.369 mm

11.5062 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock

e0

62.5 MHz

10

11.5062 mm

10

PA7536J-15

Diodes Incorporated

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

26

5

5 V

Chip Carrier

LDCC28,.5SQ

Field Programmable Gate Arrays

Mixed

4.75 V

1.27 mm

70 °C (158 °F)

12 Dedicated Inputs, 12 I/O

12

0 °C (32 °F)

Quad

S-PQCC-J28

4.369 mm

11.5062 mm

No

83.3 MHz

12

245 °C (473 °F)

11.5062 mm

12

PA7540JNI-15L

Diodes Incorporated

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

22

5

5 V

Chip Carrier

LDCC28,.5SQ

Field Programmable Gate Arrays

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 20 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J28

3

4.369 mm

11.5062 mm

No

e3

71.4 MHz

22

260 °C (500 °F)

11.5062 mm

20

PEEL22CV10AJ-7

Diodes Incorporated

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

132

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

4.369 mm

11.5062 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock

e0

117 MHz

10

11.5062 mm

10

PEEL22CV10AJ-15L

Diodes Incorporated

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

3

4.369 mm

11.5062 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock

e3

62.5 MHz

40 s

260 °C (500 °F)

11.5062 mm

10

PA7536P-15

Diodes Incorporated

EE PLD

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

CMOS

26

5

5 V

In-Line

DIP28,.3

Field Programmable Gate Arrays

Mixed

4.75 V

2.54 mm

70 °C (158 °F)

12 Dedicated Inputs, 12 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T28

7.62 mm

No

83.3 MHz

12

245 °C (473 °F)

34.925 mm

12

PA7536SI-15L

Diodes Incorporated

EE PLD

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

26

5

5 V

Small Outline

SOP28,.4

Field Programmable Gate Arrays

Mixed

4.5 V

1.27 mm

85 °C (185 °F)

12 Dedicated Inputs, 12 I/O

12

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

3

2.64 mm

7.5 mm

No

e3

83.3 MHz

12

260 °C (500 °F)

17.9 mm

12

PA7540JN-15

Diodes Incorporated

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

22

5

5 V

Chip Carrier

LDCC28,.5SQ

Field Programmable Gate Arrays

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 20 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

4.369 mm

11.5062 mm

No

e0

71.4 MHz

22

11.5062 mm

20

PEEL22LV10AZJ-25L

Diodes Incorporated

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

3.6 V

CMOS

22

PAL-TYPE

3

3/3.3 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

2.7 V

133

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

3

4.369 mm

11.5062 mm

No

e3

25 MHz

10

260 °C (500 °F)

11.5062 mm

10

PA7540JI-15L

Diodes Incorporated

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

22

5

5 V

Chip Carrier

LDCC28,.5SQ

Field Programmable Gate Arrays

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 20 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J28

3

4.369 mm

11.5062 mm

No

e3

71.4 MHz

22

260 °C (500 °F)

11.5062 mm

20

PEEL22CV10AJ-10L

Diodes Incorporated

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

3

4.369 mm

11.5062 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock

e3

90.9 MHz

260 °C (500 °F)

11.5062 mm

10

PEEL22CV10AZJ-25L

Diodes Incorporated

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.25 V

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

133

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

3

4.369 mm

11.5062 mm

No

e3

33.3 MHz

10

260 °C (500 °F)

11.5062 mm

10

PEEL22CV10AZJ-25

Diodes Incorporated

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.25 V

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

133

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J28

4.369 mm

11.5062 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock

e0

33.3 MHz

10 s

10

235 °C (455 °F)

11.5062 mm

10

PEEL22CV10AJI-7L

Diodes Incorporated

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J28

3

4.369 mm

11.5062 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock

e3

117 MHz

260 °C (500 °F)

11.5062 mm

10

PA7536PI-15

Diodes Incorporated

EE PLD

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.5 V

CMOS

26

5

5 V

In-Line

DIP28,.3

Field Programmable Gate Arrays

Mixed

4.5 V

2.54 mm

85 °C (185 °F)

12 Dedicated Inputs, 12 I/O

12

-40 °C (-40 °F)

Dual

R-PDIP-T28

7.62 mm

No

83.3 MHz

12

245 °C (473 °F)

34.925 mm

12

PA7540JN-15L

Diodes Incorporated

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

22

5

5 V

Chip Carrier

LDCC28,.5SQ

Field Programmable Gate Arrays

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 20 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

3

4.369 mm

11.5062 mm

No

e3

71.4 MHz

22

260 °C (500 °F)

11.5062 mm

20

PEEL22LV10AZJ-25

Diodes Incorporated

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

3.6 V

CMOS

22

PAL-TYPE

3

3/3.3 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

2.7 V

133

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

4.369 mm

11.5062 mm

No

e0

25 MHz

10

11.5062 mm

10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.