28 Programmable Logic Devices (PLD) 916

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

M38510/50201BXA

NXP Semiconductors

OT PLD

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

5.5 V

Bipolar

MIL-M-38510 Class B

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-CDIP-T28

No

0

P3Q20V8-7A

NXP Semiconductors

OT PLD

J Bend

28

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

BICMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

12 Dedicated Inputs, 9 I/O

12

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

8 Macrocells; 1 External Clock; 5 V compatile Inputs & I/O; Register Preload; Power-up reset

105 MHz

11.505 mm

9

ABT22V10A5A-T

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

8 ns

Yes

5.25 V

BICMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

10 Macrocells; Variable Product Terms; Power-Up Reset; 1 External Clock; Shared Input/Clock

167 MHz

11.5062 mm

10

5962-8670901YX

NXP Semiconductors

OT PLD

Military

Flat

28

DFP

Rectangular

Ceramic, Glass-Sealed

35 ns

Yes

5.5 V

Bipolar

MIL-STD-883

5

Flatpack

Registered

4.5 V

125 °C (257 °F)

15 Dedicated Inputs, 0 I/O

15

-55 °C (-67 °F)

Dual

R-GDFP-F28

No

0

PLS101A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

50 ns

Yes

5.25 V

TTL

16

PLA-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

4.75 V

48

1.27 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Open Collector Output

8

11.505 mm

0

82S100/BYA-T

NXP Semiconductors

OT PLD

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

80 ns

Yes

5.5 V

TTL

5

Flatpack

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-CDFP-F28

No

0

PLS101N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

50 ns

No

5.25 V

TTL

16

PLA-TYPE

5

5 V

In-Line

DIP28,.6

Programmable Logic Devices

Combinatorial

4.75 V

48

2.54 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Dual

R-PDIP-T28

No

Open Collector Output

8

0

P5Z22V10-7A

NXP Semiconductors

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

9 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

103 MHz

11.5062 mm

10

PL22V10-15A

NXP Semiconductors

EE PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

50 MHz

11.505 mm

10

N82S103N

NXP Semiconductors

OT PLD

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

TTL

16

PAD-TYPE

5

5 V

In-Line

DIP28,.6

Programmable Logic Devices

9

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

9

LVT22V10-BA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

3.6 V

BICMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

50 MHz

11.5062 mm

10

LVT22V10BDA-T

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

BICMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

75 °C (167 °F)

10 Dedicated Inputs, 10 I/O

10

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

Programmable Output Polarity; Shared Input/Clock

74 MHz

11.5062 mm

10

PLUS405/BYA

NXP Semiconductors

OT PLD

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

Yes

Bipolar

Flatpack

16 Dedicated Inputs

16

Dual

R-CDFP-F28

No

30 MHz

LVT20V8-7A

NXP Semiconductors

OT PLD

J Bend

28

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

BICMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

12 Dedicated Inputs, 8 I/O

12

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock

110 MHz

11.505 mm

8

PLS105A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

30 ns

Yes

5.25 V

TTL

5

Chip Carrier

Registered

4.75 V

1.27 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Programmable Logic Sequencer; 1 External Clock

9.8 MHz

11.505 mm

0

ABT22V10A5A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

8 ns

Yes

5.25 V

BICMOS

22

PLA-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

132

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

10 Macrocells; Variable Product Terms; Power-Up Reset; 1 External Clock; Shared Input/Clock

167 MHz

10

11.5062 mm

10

5962-8670901XA

NXP Semiconductors

OT PLD

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

35 ns

No

5.5 V

Bipolar

MIL-STD-883

5

In-Line

Registered

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

No

e0

0

PLS168AA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

30 ns

Yes

5.25 V

TTL

5

Chip Carrier

Registered

4.75 V

1.27 mm

75 °C (167 °F)

12 Dedicated Inputs, 0 I/O

12

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Programmable Logic Sequencer; 1 External Clock

12.5 MHz

11.505 mm

0

PLS179A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

35 ns

Yes

5.25 V

TTL

5

Chip Carrier

Mixed

4.75 V

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 12 I/O

8

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Programmable Logic Sequencer; 1 External Clock

18.2 MHz

11.505 mm

12

PLUS405-55N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

8 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

15 Dedicated Inputs, 0 I/O

15

0 °C (32 °F)

Dual

R-PDIP-T28

5.08 mm

15.24 mm

No

Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock

38.5 MHz

36.51 mm

0

82S101/B3A-T

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

80 ns

Yes

5.5 V

TTL

5

Chip Carrier

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Quad

S-CQCC-N28

No

0

82S100/B3A-T

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

80 ns

Yes

5.5 V

TTL

5

Chip Carrier

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Quad

S-CQCC-N28

No

0

PLUS173DA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

12 ns

Yes

5.25 V

TTL

22

PLA-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

4.75 V

42

1.27 mm

75 °C (167 °F)

12 Dedicated Inputs, 10 I/O

12

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Programmable Output Polarity

10

11.505 mm

10

P3Z22V10-DA

NXP Semiconductors

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

CMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

83 MHz

11.5062 mm

10

N82S100I

NXP Semiconductors

OT PLD

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic

No

TTL

16

PLA-TYPE

5

5 V

In-Line

DIP28,.6

Programmable Logic Devices

48

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

8

PL22V10-10A

NXP Semiconductors

EE PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

66.6 MHz

11.505 mm

10

PLS100A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

50 ns

Yes

5.25 V

TTL

16

PLA-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

4.75 V

48

1.27 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Tri-State Output

8

11.505 mm

0

LVT22V10-DA-T

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

BICMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

74 MHz

11.5062 mm

10

PL22V10-12A

NXP Semiconductors

EE PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

12 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

58.8 MHz

11.505 mm

10

PLUS105-55N3

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

8 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Dual

R-PDIP-T28

5.33 mm

7.62 mm

No

Programmable Logic Sequencer; 1 External Clock

35.7 MHz

35.505 mm

0

PLQ20R6-5A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

8 ns

Yes

5.25 V

BICMOS

5

Chip Carrier

Mixed

4.75 V

75 °C (167 °F)

12 Dedicated Inputs, 2 I/O

12

0 °C (32 °F)

Quad

S-PQCC-J28

No

Register Preload; Power-Up Reset

118 MHz

2

P3Z22V10IBA

NXP Semiconductors

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

3.6 V

CMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

65 MHz

11.5062 mm

10

82S101/BYA-T

NXP Semiconductors

OT PLD

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

80 ns

Yes

5.5 V

TTL

5

Flatpack

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-CDFP-F28

No

0

P5Z22V10-7A-T

NXP Semiconductors

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

9 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

103 MHz

11.5062 mm

10

PLS168A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

30 ns

Yes

5.25 V

TTL

5

Chip Carrier

Registered

4.75 V

1.27 mm

75 °C (167 °F)

12 Dedicated Inputs, 0 I/O

12

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Programmable Logic Sequencer; 1 External Clock

9.8 MHz

11.505 mm

0

PLC415-16FA

NXP Semiconductors

UV PLD

Commercial Extended

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

40 ns

No

5.25 V

CMOS

5

In-Line

Registered

4.75 V

75 °C (167 °F)

15 Dedicated Inputs, 0 I/O

15

0 °C (32 °F)

Dual

R-GDIP-T28

No

Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock

13.3 MHz

0

PLUS105-70A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

6.5 ns

Yes

5.25 V

TTL

5

Chip Carrier

Registered

4.75 V

1.27 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Programmable Logic Sequencer; 1 External Clock

47.6 MHz

11.505 mm

0

PLS167A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

30 ns

Yes

5.25 V

TTL

5

Chip Carrier

Registered

4.75 V

1.27 mm

75 °C (167 °F)

14 Dedicated Inputs, 0 I/O

14

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Programmable Logic Sequencer; 1 External Clock

9.8 MHz

11.505 mm

0

PLUS20R8-7A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

8 ns

Yes

5.25 V

TTL

5

Chip Carrier

Registered

4.75 V

1.27 mm

75 °C (167 °F)

12 Dedicated Inputs, 0 I/O

12

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Power-Up Reset

74 MHz

11.505 mm

0

ABT22V10A7A-T

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

8 ns

Yes

5.25 V

BICMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

10 Macrocells; Variable Product Terms; Power-Up Reset; 1 External Clock; Shared Input/Clock

111 MHz

11.5062 mm

10

LVT22V10-BA-T

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

3.6 V

BICMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

50 MHz

11.5062 mm

10

5962-86709013C

NXP Semiconductors

OT PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

35 ns

Yes

5.5 V

Bipolar

MIL-STD-883

5

Chip Carrier

Registered

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

No

e0

0

LVT22V10B7A-T

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

BICMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

Programmable Output Polarity

95 MHz

11.5062 mm

10

PLUS173-10A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

TTL

5

Chip Carrier

Combinatorial

4.75 V

1.27 mm

75 °C (167 °F)

12 Dedicated Inputs, 10 I/O

12

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Programmable Output Polarity

11.505 mm

10

M38510/50202BXA

NXP Semiconductors

OT PLD

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

5.5 V

Bipolar

MIL-M-38510 Class B

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-CDIP-T28

No

0

N82S105N

NXP Semiconductors

OT PLD

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

TTL

16

PLS-TYPE

5

5 V

In-Line

DIP28,.6

Programmable Logic Devices

48

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

9.8 MHz

8

M38510/50201BXX

NXP Semiconductors

OT PLD

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

5.5 V

Bipolar

MIL-M-38510 Class B

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-CDIP-T28

No

0

LVT22V10BBA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

3.6 V

BICMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

75 °C (167 °F)

10 Dedicated Inputs, 10 I/O

10

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

Programmable Output Polarity; Shared Input/Clock

50 MHz

11.5062 mm

10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.