28 Programmable Logic Devices (PLD) 916

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

PA7540JI-15

Diodes Incorporated

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

22

5

5 V

Chip Carrier

LDCC28,.5SQ

Field Programmable Gate Arrays

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 20 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

4.369 mm

11.5062 mm

No

e0

71.4 MHz

22

11.5062 mm

20

PA7536PI-15L

Diodes Incorporated

EE PLD

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.5 V

CMOS

26

5

5 V

In-Line

DIP28,.3

Field Programmable Gate Arrays

Mixed

4.5 V

2.54 mm

85 °C (185 °F)

12 Dedicated Inputs, 12 I/O

12

-40 °C (-40 °F)

Tin

Dual

R-PDIP-T28

3

7.62 mm

No

e3

83.3 MHz

30 s

12

260 °C (500 °F)

34.925 mm

12

PEEL22CV10AZJI-25

Diodes Incorporated

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.5 V

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.5 V

133

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

4.369 mm

11.5062 mm

No

e0

33.3 MHz

10

11.5062 mm

10

PEEL22CV10AJ-25L

Diodes Incorporated

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

3

4.369 mm

11.5062 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock

e3

33.3 MHz

40 s

260 °C (500 °F)

11.5062 mm

10

PEEL22CV10AJ-10

Diodes Incorporated

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

132

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

4.369 mm

11.5062 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock

e0

90.9 MHz

10

11.5062 mm

10

PA7540J-15

Diodes Incorporated

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

22

5

5 V

Chip Carrier

LDCC28,.5SQ

Field Programmable Gate Arrays

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 20 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

4.369 mm

11.5062 mm

No

e0

71.4 MHz

22

11.5062 mm

20

PA7540JNI-15

Diodes Incorporated

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

22

5

5 V

Chip Carrier

LDCC28,.5SQ

Field Programmable Gate Arrays

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 20 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

4.369 mm

11.5062 mm

No

e0

71.4 MHz

22

11.5062 mm

20

PEEL22CV10AJI-15L

Diodes Incorporated

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J28

3

4.369 mm

11.5062 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock

e3

62.5 MHz

40 s

260 °C (500 °F)

11.5062 mm

10

PA7536S-15

Diodes Incorporated

EE PLD

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

26

5

5 V

Small Outline

SOP28,.4

Field Programmable Gate Arrays

Mixed

4.75 V

1.27 mm

70 °C (158 °F)

12 Dedicated Inputs, 12 I/O

12

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G28

2.64 mm

7.5 mm

No

e0

83.3 MHz

12

17.9 mm

12

PA7536P-15L

Diodes Incorporated

EE PLD

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

CMOS

26

5

5 V

In-Line

DIP28,.3

Field Programmable Gate Arrays

Mixed

4.75 V

2.54 mm

70 °C (158 °F)

12 Dedicated Inputs, 12 I/O

12

0 °C (32 °F)

Tin

Dual

R-PDIP-T28

3

7.62 mm

No

e3

83.3 MHz

30 s

12

260 °C (500 °F)

34.925 mm

12

PEEL22CV10AJ-7L

Diodes Incorporated

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

3

4.369 mm

11.5062 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock

e3

117 MHz

260 °C (500 °F)

11.5062 mm

10

PA7536S-15L

Diodes Incorporated

EE PLD

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

26

5

5 V

Small Outline

SOP28,.4

Field Programmable Gate Arrays

Mixed

4.75 V

1.27 mm

70 °C (158 °F)

12 Dedicated Inputs, 12 I/O

12

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G28

3

2.64 mm

7.5 mm

No

e3

83.3 MHz

12

260 °C (500 °F)

17.9 mm

12

PA7536J-15L

Diodes Incorporated

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

26

5

5 V

Chip Carrier

LDCC28,.5SQ

Field Programmable Gate Arrays

Mixed

4.75 V

1.27 mm

70 °C (158 °F)

12 Dedicated Inputs, 12 I/O

12

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

3

4.369 mm

11.5062 mm

No

e3

83.3 MHz

40 s

12

260 °C (500 °F)

11.5062 mm

12

PEEL22CV10AJI-7

Diodes Incorporated

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.5 V

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.5 V

132

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

4.369 mm

11.5062 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock

e0

117 MHz

10

11.5062 mm

10

PA7540J-15L

Diodes Incorporated

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

22

5

5 V

Chip Carrier

LDCC28,.5SQ

Field Programmable Gate Arrays

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 20 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

3

4.369 mm

11.5062 mm

No

e3

71.4 MHz

22

260 °C (500 °F)

11.5062 mm

20

PEEL22CV10AJI-10

Diodes Incorporated

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.5 V

132

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

4.369 mm

11.5062 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock

e0

90.9 MHz

10

11.5062 mm

10

PA7536JI-15L

Diodes Incorporated

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

26

5

5 V

Chip Carrier

LDCC28,.5SQ

Field Programmable Gate Arrays

Mixed

4.5 V

1.27 mm

85 °C (185 °F)

12 Dedicated Inputs, 12 I/O

12

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J28

3

4.369 mm

11.5062 mm

No

e3

83.3 MHz

12

260 °C (500 °F)

11.5062 mm

12

PEEL22CV10AJI-10L

Diodes Incorporated

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J28

3

4.369 mm

11.5062 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock

e3

90.9 MHz

260 °C (500 °F)

11.5062 mm

10

XCR22LV10-15PC28C

Xilinx

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

3.6 V

CMOS

22

PAL-TYPE

3.3

3.3 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

3 V

132

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

1

4.572 mm

11.5062 mm

No

95 MHz

10

11.5062 mm

10

XCR22V10-10PC28C

Xilinx

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.572 mm

11.5062 mm

No

83 MHz

11.5062 mm

10

XCR22V10-7PC28C

Xilinx

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

132

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

1

4.572 mm

11.5062 mm

No

103 MHz

10

11.5062 mm

10

XCR22LV10-10PC28C

Xilinx

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

CMOS

22

PAL-TYPE

3.3

3.3 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

3 V

132

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

1

4.572 mm

11.5062 mm

No

125 MHz

10

11.5062 mm

10

XCR22V10-10PC28I

Xilinx

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Quad

S-PQCC-J28

4.572 mm

11.5062 mm

No

74 MHz

11.5062 mm

10

XCR22LV10-15PC28I

Xilinx

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

3.6 V

CMOS

22

PAL-TYPE

3.3

3.3 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

3 V

132

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

1

4.572 mm

11.5062 mm

No

e0

65 MHz

10

11.5062 mm

10

SLG46517M

Renesas Electronics

OT PLD

No Lead

28

VQCCN

Rectangular

Yes

5 V

17

16

PLA-TYPE

3.3

Chip Carrier, Very Thin Profile

LCC28,.08X.12,16

No

Macrocell

1.8 V

.4 mm

85 °C (185 °F)

0 Dedicated Inputs, 16 I/O

0

-40 °C (-40 °F)

Quad

R-XQCC-N28

1

.6 mm

2 mm

Can also be operated at 5 V

16

3 mm

No

16

SLG46517MTR

Renesas Electronics

OT PLD

No Lead

28

VQCCN

Rectangular

Yes

5 V

17

16

PLA-TYPE

3.3

Box, Tape and Reel, 7 in

Chip Carrier, Very Thin Profile

LCC28,.08X.12,16

No

Macrocell

1.8 V

.4 mm

85 °C (185 °F)

0 Dedicated Inputs, 16 I/O

0

-40 °C (-40 °F)

Quad

R-XQCC-N28

.6 mm

2 mm

Can also be operated at 5 V

16

3 mm

No

16

PLX448JC-45

Broadcom

OT PLD

Commercial

J Bend

28

QCCJ

Square

Ceramic, Metal-Sealed Cofired

45 ns

Yes

5.25 V

8

CMOS

26

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

88

1.27 mm

70 °C (158 °F)

9 Dedicated Inputs, 8 I/O

9

0 °C (32 °F)

Tin Lead

Quad

S-CQCC-J28

5.59 mm

11.6332 mm

No

PAL with Macrocells; 8 Macrocells; 2 External Clocks; Shared Input/Clock

e0

16.7 MHz

8

11.6332 mm

8

PLX464WJC-25

Broadcom

Commercial

J Bend

28

QCCJ

Square

Ceramic

Yes

8

CMOS

26

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

88

1.27 mm

70 °C (158 °F)

9 Dedicated Inputs, 8 I/O

9

0 °C (32 °F)

Tin/Lead

Quad

S-XQCC-J28

11.638 mm

No

e0

28.5 MHz

8

11.638 mm

8

PLX448JC-25

Broadcom

Commercial

J Bend

28

QCCJ

Square

Ceramic

Yes

8

CMOS

26

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

88

1.27 mm

70 °C (158 °F)

9 Dedicated Inputs, 8 I/O

9

0 °C (32 °F)

Tin/Lead

Quad

S-XQCC-J28

11.638 mm

No

e0

28.5 MHz

8

11.638 mm

8

PLX464WJC-45

Broadcom

UV PLD

Commercial

J Bend

28

WQCCJ

Square

Ceramic, Metal-Sealed Cofired

45 ns

Yes

5.25 V

8

CMOS

26

PAL-TYPE

5

5 V

Chip Carrier, Window

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

88

1.27 mm

70 °C (158 °F)

9 Dedicated Inputs, 8 I/O

9

0 °C (32 °F)

Tin Lead

Quad

S-CQCC-J28

5.59 mm

11.6332 mm

No

PAL with Macrocells; 8 Macrocells; 2 External Clocks; Shared Input/Clock

e0

16.7 MHz

8

11.6332 mm

8

PLX448JC-35

Broadcom

Commercial

J Bend

28

QCCJ

Square

Ceramic

Yes

8

CMOS

26

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

88

1.27 mm

70 °C (158 °F)

9 Dedicated Inputs, 8 I/O

9

0 °C (32 °F)

Tin/Lead

Quad

S-XQCC-J28

11.638 mm

No

e0

18 MHz

8

11.638 mm

8

PLX464WJC-35

Broadcom

Commercial

J Bend

28

QCCJ

Square

Ceramic

Yes

8

CMOS

26

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

88

1.27 mm

70 °C (158 °F)

9 Dedicated Inputs, 8 I/O

9

0 °C (32 °F)

Tin/Lead

Quad

S-XQCC-J28

11.638 mm

No

e0

18 MHz

8

11.638 mm

8

CPL20R6L25PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

28.5 MHz

8

CPL20R4L-20NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

60

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

33.3 MHz

8

CPL20R6-35NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

35 ns

Yes

CMOS

14

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20L8-20NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

CMOS

12

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20V8L-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

28.5 MHz

8

CPL20R8L-35NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

18 MHz

8

CPL20L8L-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

12

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20L8L-20NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

CMOS

12

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20R4-20NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

60

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

33.3 MHz

8

CPL20R8L25PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

28.5 MHz

8

CPL20R6L-20NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

CMOS

14

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20L10-30NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

30 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

40

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

10

CPL20R4L-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

60

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

28.5 MHz

8

CPL22V10-35NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

18 MHz

10

CPL20L8-15NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

CMOS

12

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20R6-15NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

CMOS

14

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.