28 Programmable Logic Devices (PLD) 916

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

CPL20R4L-35NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

60

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

18 MHz

8

CPL20L8L-15NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

CMOS

12

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20R8-15NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

41.6 MHz

8

CPL20R4-15NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

60

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

41.6 MHz

8

CPL20R6-25PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

28.5 MHz

8

CPL20L10L25PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

28.5 MHz

10

CPL20R6-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

14

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20R8L-20NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

33.3 MHz

8

CPL22V10-25PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

10

CPL20R4-25PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

28.5 MHz

8

CPL20R4L-15NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

60

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

41.6 MHz

8

CPL20R8-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

28.5 MHz

8

CPL20L10-15NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

40

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

10

CPL20R8L35PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

35 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

18 MHz

8

CPL20R6L-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

14

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20R6L-15NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

CMOS

14

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20L10-25PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

28.5 MHz

10

CPL20R6-20NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

CMOS

14

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20R4-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

60

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

28.5 MHz

8

CPL20L10-35PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

35 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

40

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

10

CPL20L10L-20NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

40

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

10

CPL20L8-35NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

35 ns

Yes

CMOS

12

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20R8-35NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

18 MHz

8

CPL22V10-35PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

10

CPL20R6L-35NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

35 ns

Yes

CMOS

14

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20R6L35PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

35 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

18 MHz

8

CPL20L10L-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

40

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

10

CPL22V10L-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

33.3 MHz

10

CPL20L10L-15NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

40

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

10

CPL20L10-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

40

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

10

CPL20R8-20NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

33.3 MHz

8

CPL20R8L-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

28.5 MHz

8

CPL20R8-25PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

28.5 MHz

8

CPL20L8-25PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

28.5 MHz

8

CPL20R4-35NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

60

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

18 MHz

8

CPL20V8-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

28.5 MHz

8

CPL22V10-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

33.3 MHz

10

CPL20R8L-15NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

41.6 MHz

8

CPL20L10L-30NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

30 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

40

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

10

CPL20V8L-30NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

22.2 MHz

8

CPL20V8-20NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

33.3 MHz

8

CPL20L8-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

12

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20L10-20NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

40

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

10

CPL20L8L-35NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

35 ns

Yes

CMOS

12

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL22V10L-35NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

18 MHz

10

EP610LM-35

Altera

OT PLD

Military

J Bend

28

QCCJ

Square

Plastic/Epoxy

37 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

125 °C (257 °F)

4 Dedicated Inputs, 16 I/O

4

-55 °C (-67 °F)

Quad

S-PQCC-J28

4.572 mm

11.5062 mm

No

Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks

28.6 MHz

11.5062 mm

16

EP610AJC-15

Altera

Commercial

J Bend

28

QCCJ

Square

Ceramic

15 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

160

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-J28

No

e0

71.4 MHz

16

220 °C (428 °F)

EP610LC-20T

Altera

OT PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

22 ns

Yes

5.25 V

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

160

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 16 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks

e0

55.6 MHz

16

220 °C (428 °F)

11.5062 mm

16

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.