28 Programmable Logic Devices (PLD) 916

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

CPL20R4L-35NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

60

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

18 MHz

8

CPL20L8L-15NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

CMOS

12

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20R8-15NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

41.6 MHz

8

CPL20R4-15NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

60

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

41.6 MHz

8

CPL20R6-25PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

28.5 MHz

8

CPL20L10L25PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

28.5 MHz

10

CPL20R6-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

14

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20R8L-20NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

33.3 MHz

8

CPL22V10-25PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

10

CPL20R4-25PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

28.5 MHz

8

CPL20R4L-15NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

60

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

41.6 MHz

8

CPL20R8-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

28.5 MHz

8

CPL20L10-15NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

40

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

10

CPL20R8L35PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

35 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

18 MHz

8

CPL20R6L-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

14

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20R6L-15NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

CMOS

14

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20L10-25PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

28.5 MHz

10

CPL20R6-20NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

CMOS

14

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20R4-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

60

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

28.5 MHz

8

CPL20L10-35PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

35 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

40

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

10

CPL20L10L-20NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

40

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

10

CPL20L8-35NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

35 ns

Yes

CMOS

12

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20R8-35NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

18 MHz

8

CPL22V10-35PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

10

CPL20R6L-35NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

35 ns

Yes

CMOS

14

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20R6L35PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

35 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

18 MHz

8

CPL20L10L-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

40

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

10

CPL22V10L-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

33.3 MHz

10

CPL20L10L-15NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

40

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

10

CPL20L10-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

40

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

10

CPL20R8-20NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

33.3 MHz

8

CPL20R8L-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

28.5 MHz

8

CPL20R8-25PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

28.5 MHz

8

CPL20L8-25PLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

No

28.5 MHz

8

CPL20R4-35NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

16

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

60

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

18 MHz

8

CPL20V8-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

28.5 MHz

8

CPL22V10-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

33.3 MHz

10

CPL20R8L-15NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Registered

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

41.6 MHz

8

CPL20L10L-30NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

30 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

40

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

10

CPL20V8L-30NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

22.2 MHz

8

CPL20V8-20NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

64

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

33.3 MHz

8

CPL20L8-25NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

CMOS

12

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL20L10-20NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

20 ns

Yes

CMOS

20

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

40

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

10

CPL20L8L-35NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

35 ns

Yes

CMOS

12

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

72

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

8

CPL22V10L-35NLC

Samsung

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

132

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

3

No

e0

18 MHz

10

EPS448LI-20

Altera

OT PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

5.5 V

CMOS

5

Chip Carrier

Registered

4.5 V

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 0 I/O

8

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

4.572 mm

11.5062 mm

No

Stand-Alone Microsequencer

e0

20 MHz

220 °C (428 °F)

11.5062 mm

0

EP22V10LC-15

Altera

OT PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

22

PAL-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

4.75 V

132

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Macrocells Interconnected By Global Bus; 10 Macrocells; 1 External Clock

e0

64.5 MHz

10

220 °C (428 °F)

11.505 mm

10

EP610LC-25N

Altera

OT PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

27 ns

Yes

5.25 V

CMOS

PAL-TYPE

5

Chip Carrier

Macrocell

4.75 V

70 °C (158 °F)

4 Dedicated Inputs, 16 I/O

4

0 °C (32 °F)

Quad

S-PQCC-J28

No

Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks

40 MHz

16

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.