Rectangular Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	No. of I/O Lines
PLC415-16FA	NXP Semiconductors	UV PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.25 V	CMOS				5		In-Line			Registered	4.75 V			75 °C (167 °F)	15 Dedicated Inputs, 0 I/O	15	0 °C (32 °F)		Dual	R-GDIP-T28			No	Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock		13.3 MHz			0
PZ3128-S10BB1-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	13 ns	Yes	3.6 V	CMOS				3.3		Flatpack			Macrocell	3 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100	3.4 mm	14 mm	No			74 MHz		20 mm	80
PLC18V8ZID	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes	5.5 V	CMOS				5		Small Outline			Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20	2.65 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		18 MHz		12.8 mm	8
5962-9176014NXX	NXP Semiconductors	OT PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.25 V	BICMOS	MIL-PRF-38535			5		In-Line			Macrocell	4.75 V			85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	71 MHz			10
5962-8850701LX	NXP Semiconductors	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V	Bipolar	MIL-STD-883			5		In-Line			Mixed	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 12 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T24			No			20 MHz			12
PZ3064I15BB	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	3.63 V	CMOS				3.3		Flatpack			Macrocell	2.97 V		.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G100	3.4 mm	14 mm	No					20 mm	64
LVT16V8-7D	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	9 ns	Yes	3.6 V	BICMOS				3.3		Small Outline			Macrocell	3 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20	2.65 mm	7.5 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		91 MHz		12.8 mm	8
PZ5064-7BB	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	12.5 ns	Yes	5.25 V	CMOS				5		Flatpack			Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100	3.4 mm	14 mm	No			105 MHz		19.6 mm	64
PLUS153DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	12 ns	No	5.25 V	TTL		18	PLA-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Combinatorial	4.75 V	42	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 10 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20			No	Programmable Output Polarity			10		10
LVT16V8-6N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	7 ns	No	3.6 V	BICMOS				3.3		In-Line			Macrocell	3 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20	4.2 mm	7.62 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		111 MHz		26.73 mm	8
PZ3128IS15BB1	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	17.5 ns	Yes	3.6 V	CMOS				3.3		Flatpack			Macrocell	3 V		.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 80 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G100	3.4 mm	14 mm	No			59 MHz		20 mm	80
PLC18V8ZID-T	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes	5.5 V	CMOS				5		Small Outline			Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20	2.65 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		18 MHz		12.8 mm	8
P3C18V8Z40D	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes	3.6 V	CMOS				3.3		Small Outline			Macrocell	3 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20	2.65 mm	7.5 mm	No	Programmable Output Polarity		22 MHz		12.8 mm	8
PZ3128-S12BE-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	3.6 V	CMOS				3.3		Flatpack, Low Profile, Fine Pitch			Macrocell	3 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128	1.6 mm	14 mm	No			66 MHz		20 mm	96
M38510/50202BXA	NXP Semiconductors	OT PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic, Metal-Sealed Cofired		No	5.5 V	Bipolar	MIL-M-38510 Class B			5		In-Line			Combinatorial	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Dual	R-CDIP-T28			No						0
LVT22V10-DD	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	12 ns	Yes	3.6 V	BICMOS				3.3		Small Outline			Macrocell	3 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24	2.65 mm	7.5 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		74 MHz		15.4 mm	10
N82S105N	NXP Semiconductors	OT PLD	Commercial	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy		No		TTL		16	PLS-TYPE	5	5 V	In-Line	DIP28,.6	Programmable Logic Devices			48	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T28			No		e0	9.8 MHz	8
PLC18V8Z/BRA	NXP Semiconductors	UV PLD	Military	Through-Hole	20	WDIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	CMOS				5		In-Line, Window			Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20	5.08 mm	7.62 mm	No			25 MHz			8
PZ5064I10BB1-S	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	12.5 ns	Yes	5.5 V	CMOS				5		Flatpack			Macrocell	4.5 V		.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G100	3.4 mm	14 mm	No			77 MHz		20 mm	64
P3C18V8ZIADH-T	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	45 ns	Yes	3.6 V	CMOS				3.3		Small Outline, Thin Profile, Shrink Pitch			Macrocell	3 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20	1.1 mm	4.4 mm	No	Programmable Output Polarity		18 MHz		6.5 mm	8
LVT22V10-7N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	8.5 ns	No	3.6 V	BICMOS		22	PAL-TYPE	3.3	3.3 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	3 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		95 MHz	10	31.7 mm	10
M38510/50201BXX	NXP Semiconductors	OT PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic, Metal-Sealed Cofired		No	5.5 V	Bipolar	MIL-M-38510 Class B			5		In-Line			Combinatorial	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Dual	R-CDIP-T28			No						0
PZ3128-S12BB1-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	3.6 V	CMOS				3.3		Flatpack			Macrocell	3 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100	3.4 mm	14 mm	No			66 MHz		20 mm	80
PLC18V8Z35D	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	35 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline	SOP20,.4	Programmable Logic Devices	Macrocell	4.75 V	74	1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20	2.65 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		21 MHz	8	12.8 mm	8
PZ5128CS12BE	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	5.25 V	CMOS				5		Flatpack, Low Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128	1.6 mm	14 mm	No	128 Macrocells		63 MHz		20 mm	96
PZ5128CS7BE	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	9.5 ns	Yes	5.25 V	CMOS				5		Flatpack, Low Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128	1.6 mm	14 mm	No	128 Macrocells		95 MHz		20 mm	96
LVT22V10-7D-T	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	8.5 ns	Yes	3.6 V	BICMOS				3.3		Small Outline			Macrocell	3 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24	2.65 mm	7.5 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		95 MHz		15.4 mm	10
PZ3128DS10BE	NXP Semiconductors	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	12 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Low Profile, Fine Pitch			Macrocell	2.97 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128	1.6 mm	14 mm	No	128 Macrocells		66 MHz		20 mm	96
PZ3128AS7BE	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	9.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Low Profile, Fine Pitch			Macrocell	2.97 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128	1.6 mm	14 mm	No	128 Macrocells		95 MHz		20 mm	96
5962-8670901YA	NXP Semiconductors	OT PLD	Military	Flat	28	DFP	Rectangular	Ceramic, Glass-Sealed	35 ns	Yes	5.5 V	Bipolar	MIL-STD-883			5		Flatpack			Registered	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)	Tin Lead	Dual	R-GDFP-F28			No		e0				0
PLUS16R6DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL				5		In-Line			Mixed	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 2 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20	4.06 mm	7.62 mm	No	Power-Up Reset		60.6 MHz		26.695 mm	2
PLUS405-45N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	TTL		16	PLS-TYPE	5	5 V	In-Line	DIP28,.6	Programmable Logic Devices	Registered	4.75 V	64	2.54 mm	75 °C (167 °F)	15 Dedicated Inputs, 8 I/O	15	0 °C (32 °F)		Dual	R-PDIP-T28	5.08 mm	15.24 mm	No	Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock		29.4 MHz	8	36.51 mm	8
PLUS173BN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	TTL		22	PLA-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Combinatorial	4.75 V	42	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 10 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Programmable Output Polarity			10	31.7 mm	10
PZ5128-S12BE-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	CMOS				5		Flatpack, Low Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128	1.6 mm	14 mm	No			63 MHz		20 mm	96
PZ3128IS15BE-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	17.5 ns	Yes	3.6 V	CMOS				3.3		Flatpack, Low Profile, Fine Pitch			Macrocell	3 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128	1.6 mm	14 mm	No			59 MHz		20 mm	96
PZ5128-S10BB1	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	12 ns	Yes	5.25 V	CMOS				5		Flatpack			Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100	3.4 mm	14 mm	No			71 MHz		20 mm	80
PZ5064I12BB1-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	5.5 V	CMOS				5		Flatpack			Macrocell	4.5 V		.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G100	3.4 mm	14 mm	No			67 MHz		20 mm	64
PZ3064I12BB	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.63 V	CMOS				3.3		Flatpack			Macrocell	2.97 V		.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G100	3.4 mm	14 mm	No			67 MHz		20 mm	64
PZ5064-10BB	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	CMOS				5		Flatpack			Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100	3.4 mm	14 mm	No			67 MHz		19.6 mm	64
PZ5064I12BB	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.5 V	CMOS				5		Flatpack			Macrocell	4.5 V		.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G100	3.4 mm	14 mm	No					19.6 mm	64
PZ5064-10BB1	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	12.5 ns	Yes	5.25 V	CMOS				5		Flatpack			Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100	3.4 mm	14 mm	No			77 MHz		20 mm	64
PLC18V8Z25DH-T	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.25 V	CMOS				5		Small Outline, Thin Profile, Shrink Pitch			Macrocell	4.75 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20	1.1 mm	4.4 mm	No	8 Macrocell; Power Up Reset; Shared Input/Clock		30 MHz		6.5 mm	8
PLC18V8ZIDH	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	40 ns	Yes	5.5 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline, Thin Profile, Shrink Pitch	DIP20,.3	Programmable Logic Devices	Macrocell	4.5 V	74	.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20	1.1 mm	4.4 mm	No			18 MHz	8	6.5 mm	8
PLUS153BN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	TTL		18	PLA-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Combinatorial	4.75 V	42	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 10 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20			No	Programmable Output Polarity			10		10
P3Q20V8-7D	NXP Semiconductors	OT PLD		Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	3.6 V	BICMOS				3.3		Small Outline			Macrocell	3 V		1.27 mm		12 Dedicated Inputs, 9 I/O	12			Dual	R-PDSO-G24	2.65 mm	7.5 mm	No	8 Macrocells; 1 External Clock; 5 V compatile Inputs & I/O; Register Preload; Power-up reset		105 MHz		15.4 mm	9
PLC18V8Z25N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V	CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.75 V	74	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20	4.2 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		30 MHz	8	26.73 mm	8
82S101/BXA	NXP Semiconductors	OT PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed	80 ns	No	5.5 V	TTL				5		In-Line			Combinatorial	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Dual	R-GDIP-T28			No						0
PZ3064-10BB1-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack			Macrocell	2.97 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100	3.4 mm	14 mm	No			80 MHz		20 mm	64

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.