Rectangular Programmable Logic Devices (PLD) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	JTAG Boundary Scan Test	No. of I/O Lines
PZ5128IS15BB1-S	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	17.5 ns	Yes	5.5 V		CMOS				5		Flatpack				Macrocell	4.5 V		.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 80 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			63 MHz		20 mm		80
PL22V10-12D	NXP Semiconductors	EE PLD	Commercial Extended	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	12 ns	Yes	5.25 V		CMOS				5		Small Outline				Macrocell	4.75 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset		58.8 MHz		15.4 mm		10
PZ3128-S12BE-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	3.6 V		CMOS				3.3		Flatpack, Low Profile, Fine Pitch				Macrocell	3 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			66 MHz		20 mm		96
PLC18V8Z35DH	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	35 ns	Yes	5.25 V		CMOS		18	PAL-TYPE	5	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.75 V	74	.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Nickel Palladium Gold	Dual	R-PDSO-G20		1.1 mm	4.4 mm	No		e4	21 MHz	8	6.5 mm		8
PLUS405/BXA	NXP Semiconductors	OT PLD		Through-Hole	28	DIP	Rectangular	Ceramic, Metal-Sealed Cofired		No			Bipolar						In-Line									16 Dedicated Inputs	16			Dual	R-CDIP-T28				No			30 MHz
PLUS16L8DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V		TTL				5		In-Line				Combinatorial	4.75 V		2.54 mm	75 °C (167 °F)	10 Dedicated Inputs, 6 I/O	10	0 °C (32 °F)		Dual	R-PDIP-T20		4.06 mm	7.62 mm	No					26.695 mm		6
PLC42VA12FA	NXP Semiconductors	UV PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	55 ns	No	5.25 V		CMOS		42	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	105	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 12 I/O	8	0 °C (32 °F)		Dual	R-GDIP-T24	1			No	Programmable Multi-Function Pld; 1 External Clock; Shared Input/Clock; Register Preload		14.9 MHz	12			12
P5Z22V10IDDH-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	11 ns	Yes	5.5 V		CMOS				5		Small Outline, Thin Profile, Shrink Pitch				Macrocell	4.5 V		.65 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDSO-G24		1.1 mm	4.4 mm	No			74 MHz		7.8 mm		10
5962-8850402LX	NXP Semiconductors	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V		Bipolar	MIL-STD-883			5		In-Line				Combinatorial	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 10 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24				No							10
PZ5128IS10BE	NXP Semiconductors	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS				5		Flatpack, Low Profile, Fine Pitch				Macrocell	4.5 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			66 MHz		20 mm		96
PLQ20R4-5N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V		BICMOS				5		In-Line				Mixed	4.75 V			75 °C (167 °F)	12 Dedicated Inputs, 4 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24				No	Register Preload; Power-Up Reset		118 MHz				4
P3Q22V10-7D	NXP Semiconductors	OT PLD		Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	3.6 V		BICMOS				3.3		Small Outline				Macrocell	3 V		1.27 mm		11 Dedicated Inputs, 10 I/O	11			Dual	R-PDSO-G24		2.65 mm	7.5 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock 5 V compatible inputs & I/O; Register preload		105 MHz		15.4 mm		10
PZ5128-S7BE-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS				5		Flatpack, Low Profile, Fine Pitch				Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			87 MHz		20 mm		96
PLC18V8ZZID	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes	5.5 V		CMOS		18	PAL-TYPE	5	5 V	Small Outline	SOP20,.4	Programmable Logic Devices		Macrocell	4.5 V	74	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.65 mm	7.5 mm	No	8 Macrocell; Power Up Reset; Shared Input/Clock		18 MHz	8	12.8 mm		8
PLQ20R8-5N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	6 ns	No	5.25 V		BICMOS				5		In-Line				Registered	4.75 V			75 °C (167 °F)	12 Dedicated Inputs, 0 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24				No	Register Preload; Power-Up Reset		118 MHz				0
5962-9201201MLX	NXP Semiconductors	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	35 ns	No	5.5 V		Bipolar	MIL-STD-883			5		In-Line				Registered	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 0 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24				No			10.5 MHz				0
P5Z22V10-7DH-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	9 ns	Yes	5.25 V		CMOS				5		Small Outline, Thin Profile, Shrink Pitch				Macrocell	4.75 V		.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		1.1 mm	4.4 mm	No			103 MHz		7.8 mm		10
PLQ16R8-5N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	6 ns	No	5.25 V		BICMOS				5		In-Line				Registered	4.75 V			75 °C (167 °F)	8 Dedicated Inputs, 0 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20				No	Register Preload; Power-Up Reset		118 MHz				0
P3C18V8ZIADH	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	45 ns	Yes	3.6 V		CMOS				3.3		Small Outline, Thin Profile, Shrink Pitch				Macrocell	3 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No	Programmable Output Polarity		18 MHz		6.5 mm		8
PZ5128IS15BE	NXP Semiconductors	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	17.5 ns	Yes	5.5 V		CMOS				5		Flatpack, Low Profile, Fine Pitch				Macrocell	4.5 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			63 MHz		20 mm		96
PZ3128-S15BB1-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	17.5 ns	Yes	3.6 V		CMOS				3.3		Flatpack				Macrocell	3 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			59 MHz		20 mm		80
5962-8850701LA	NXP Semiconductors	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V		Bipolar	MIL-STD-883			5		In-Line				Mixed	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 12 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24				No		e0	20 MHz				12
P3Z22V10-DD	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	3.6 V		CMOS				3.3		Small Outline				Macrocell	3 V		1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No			83 MHz		15.4 mm		10
P3Z22V10IBD-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS				3.3		Small Outline				Macrocell	3 V		1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No			65 MHz		15.4 mm		10
PLD20G10C-15PC	Infineon Technologies	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		BICMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	90	2.54 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O		0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T24				No		e0	60 MHz	10
5962-01-379-9524	Infineon Technologies	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No			CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	1			No		e0	100 MHz	10
CY37064VP48-143BAI	Infineon Technologies	EE PLD	Industrial	Ball	48	FBGA	Rectangular	Plastic/Epoxy	8.5 ns	Yes		64	CMOS				3.3	3.3 V	Grid Array, Fine Pitch	BGA48,6X8,32	Programmable Logic Devices	Yes				.8 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	R-PBGA-B48				No		e0				Yes
5962-01-382-7225	Infineon Technologies	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No			CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	1			No		e0	100 MHz	10
M38510/50802BLA	Infineon Technologies	OT PLD	Military	Through-Hole	24	DIP	Rectangular		25 ns	No	5.5 V		CMOS	MIL-M-38510 Class B			5		In-Line				Combinatorial	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24				No		e0	30 MHz				10
5962-01-302-9835	Infineon Technologies	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No			CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		90	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	1			No		e0	25 MHz	10
5962-01-302-9836	Infineon Technologies	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No			CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		90	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	1			No		e0	25 MHz	10
5962-01-394-3671	Infineon Technologies	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	30 ns	No			CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20				No				8
5962-01-350-4918	Infineon Technologies		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No			CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24				No			18.1 MHz	10
5962-01-359-8984	Infineon Technologies		Commercial	Through-Hole	28	DIP	Rectangular	Ceramic		No			CMOS		25	PAL-TYPE	5	5 V	In-Line	DIP28,.3	Programmable Logic Devices				192	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T28				No			23.8 MHz	12
5962-01-382-3312	Infineon Technologies		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No			CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24				No			18.1 MHz	10
5962-01-305-5393	Infineon Technologies	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No			CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		90	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	1			No		e0	25 MHz	10
5962-01-385-4552	Infineon Technologies		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No			CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24				No			18.1 MHz	10
5962-01-349-2199	Infineon Technologies		Military	Through-Hole	24	DIP	Rectangular	Ceramic	40 ns	No			CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		132	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24				No			18.1 MHz	10
5962-01-385-4477	Infineon Technologies		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No			CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24				No			18.1 MHz	10
M38510/50801BLA	Infineon Technologies	OT PLD	Military	Through-Hole	24	DIP	Rectangular		30 ns	No	5.5 V		CMOS	MIL-M-38510 Class B			5		In-Line				Combinatorial	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24				No		e0	25 MHz				10
5962-01-382-8760	Infineon Technologies	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	40 ns	No			CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20				No				8
5962-01-360-1553	Infineon Technologies	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	30 ns	No			CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20				No				8
5962-01-382-8715	Infineon Technologies	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	40 ns	No			CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20				No				8
5962-01-277-6831	Infineon Technologies	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	40 ns	No			CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20				No			16.5 MHz	4
5962-01-360-4028	Infineon Technologies	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	40 ns	No			CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T20				No			16.5 MHz	6
5962-01-349-7443	Infineon Technologies		Military	Through-Hole	28	DIP	Rectangular	Ceramic		No			CMOS	38535Q/M;38534H;883B	25	PAL-TYPE	5	5 V	In-Line	DIP28,.3	Programmable Logic Devices				192	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T28				No			14.2 MHz	12
5962-01-364-5424	Infineon Technologies	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No			CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T20				No				8
5962-01-354-5490	Infineon Technologies	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No			CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		90	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	1			No		e0	25 MHz	10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.