Rectangular Programmable Logic Devices (PLD) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

P5Z22V10-7D

NXP Semiconductors

EE PLD

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

9 ns

Yes

5.25 V

CMOS

5

Small Outline

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDSO-G24

2.65 mm

7.5 mm

No

103 MHz

15.4 mm

10

PZ3128IS12BE-S

NXP Semiconductors

EE PLD

Industrial

Gull Wing

128

LFQFP

Rectangular

Plastic/Epoxy

14.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Low Profile, Fine Pitch

Macrocell

3 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 96 I/O

2

-40 °C (-40 °F)

Quad

R-PQFP-G128

1.6 mm

14 mm

No

66 MHz

20 mm

96

PLC18V8ZIDB-T

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

40 ns

Yes

5.5 V

CMOS

5

Small Outline, Shrink Pitch

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

18 MHz

7.2 mm

8

PLC18V8Z35D-T

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

35 ns

Yes

5.25 V

CMOS

5

Small Outline

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDSO-G20

2.65 mm

7.5 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

21 MHz

12.8 mm

8

P5Z22V10-DDH

NXP Semiconductors

EE PLD

Commercial

Gull Wing

24

TSSOP

Rectangular

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Small Outline, Thin Profile, Shrink Pitch

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDSO-G24

1.1 mm

4.4 mm

No

83 MHz

7.8 mm

10

PLQ16R6-5N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8 ns

No

5.25 V

BICMOS

5

In-Line

Mixed

4.75 V

75 °C (167 °F)

8 Dedicated Inputs, 2 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T20

No

Register Preload; Power-Up Reset

118 MHz

2

PLC18V8Z/BRA(OT)

NXP Semiconductors

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 8 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

25 MHz

8

PLUS20R6DN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Mixed

4.75 V

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 2 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Power-Up Reset

60.6 MHz

31.7 mm

2

PLQ22V10-7N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

9 ns

No

5.25 V

BICMOS

5

In-Line

Macrocell

4.75 V

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDIP-T24

No

PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock

87 MHz

10

PZ3128IS12BE

NXP Semiconductors

EE PLD

Industrial

Gull Wing

128

LFQFP

Rectangular

Plastic/Epoxy

14.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Low Profile, Fine Pitch

Macrocell

3 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 96 I/O

2

-40 °C (-40 °F)

Quad

R-PQFP-G128

1.6 mm

14 mm

No

66 MHz

20 mm

96

5962-8984105LX

NXP Semiconductors

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

50 MHz

10

PZ5128-S12BB1

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

5

Flatpack

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

2 Dedicated Inputs, 80 I/O

2

0 °C (32 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

63 MHz

20 mm

80

PL22V10-10N

NXP Semiconductors

EE PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

CMOS

5

In-Line

Macrocell

4.75 V

2.54 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

66.6 MHz

31.7 mm

10

P3C18V8Z35FA

NXP Semiconductors

UV PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

45 ns

No

3.6 V

CMOS

3.3

In-Line

Macrocell

2.7 V

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

21 MHz

24.305 mm

8

5962-8984101LX

NXP Semiconductors

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

22 MHz

10

PLS155N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

55 ns

No

5.25 V

TTL

5

In-Line

Mixed

4.75 V

75 °C (167 °F)

4 Dedicated Inputs, 12 I/O

4

0 °C (32 °F)

Dual

R-PDIP-T20

No

Programmable Logic Sequencer; 1 External Clock

14 MHz

12

PL22V10-10D

NXP Semiconductors

EE PLD

Commercial Extended

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Small Outline

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDSO-G24

2.65 mm

7.5 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

66.6 MHz

15.4 mm

10

10H20EV8-4F

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

4.7 ns

No

ECL

20

PAL-TYPE

-5.2 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

90

2.54 mm

75 °C (167 °F)

11 Dedicated Inputs, 8 I/O

11

0 °C (32 °F)

Dual

R-GDIP-T24

1

5.08 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

204 MHz

8

31.955 mm

8

ABT22V10-7N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

7.5 ns

No

5.25 V

BICMOS

5

In-Line

Macrocell

4.75 V

2.54 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

10 Macrocells; Variable Product Terms; Power-Up Reset; 1 External Clock; Shared Input/Clock

87 MHz

31.7 mm

10

PZ5064I10BB

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

5

Flatpack

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

67 MHz

19.6 mm

64

PLHS18P8A/BSA

NXP Semiconductors

OT PLD

Flat

20

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

30 ns

Yes

Flatpack

Combinatorial

10 Dedicated Inputs, 8 I/O

10

Dual

R-CDFP-F20

No

8

PLS105N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

30 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Dual

R-PDIP-T28

5.08 mm

15.24 mm

No

Programmable Logic Sequencer; 1 External Clock

9.8 MHz

36.51 mm

0

PLQ16L8-5N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8 ns

No

5.25 V

BICMOS

5

In-Line

Combinatorial

4.75 V

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Dual

R-PDIP-T20

No

6

22V10-15/BLA

NXP Semiconductors

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

50 MHz

10

PLUS20R4-7N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Mixed

4.75 V

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 4 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Power-Up Reset

74 MHz

31.7 mm

4

PLUS16L8-7N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Combinatorial

4.75 V

2.54 mm

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Dual

R-PDIP-T20

4.06 mm

7.62 mm

No

26.695 mm

6

5962-9176012NXX

NXP Semiconductors

OT PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

BICMOS

MIL-PRF-38535

5

In-Line

Macrocell

4.75 V

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

55 MHz

10

PLC18V8Z35DH-T

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

35 ns

Yes

5.25 V

CMOS

5

Small Outline, Thin Profile, Shrink Pitch

Macrocell

4.75 V

.65 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Nickel Palladium Gold

Dual

R-PDSO-G20

1.1 mm

4.4 mm

No

e4

21 MHz

6.5 mm

8

PL22V10-15D

NXP Semiconductors

EE PLD

Commercial Extended

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

5

Small Outline

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDSO-G24

2.65 mm

7.5 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

50 MHz

15.4 mm

10

5962-8768201MRX

NXP Semiconductors

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

45 ns

No

5.5 V

Bipolar

MIL-STD-883

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 10 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

No

10

PZ3128-S15BB1

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

17.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack

Macrocell

3 V

.65 mm

70 °C (158 °F)

2 Dedicated Inputs, 80 I/O

2

0 °C (32 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

59 MHz

20 mm

80

PZ3128-S10BE-S

NXP Semiconductors

EE PLD

Commercial

Gull Wing

128

LFQFP

Rectangular

Plastic/Epoxy

13 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Low Profile, Fine Pitch

Macrocell

3 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 96 I/O

2

0 °C (32 °F)

Quad

R-PQFP-G128

1.6 mm

14 mm

No

74 MHz

20 mm

96

PZ5128IS10BB1

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

5

Flatpack

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

2 Dedicated Inputs, 80 I/O

2

-40 °C (-40 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

66 MHz

20 mm

80

PLS153N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

40 ns

No

5.25 V

TTL

5

In-Line

Combinatorial

4.75 V

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 10 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T20

4.06 mm

7.62 mm

No

Programmable Output Polarity

26.695 mm

10

5962-8670901XX

NXP Semiconductors

OT PLD

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

35 ns

No

5.5 V

Bipolar

MIL-STD-883

5

In-Line

Registered

4.5 V

125 °C (257 °F)

15 Dedicated Inputs, 0 I/O

15

-55 °C (-67 °F)

Dual

R-GDIP-T28

No

0

82S100/BYA

NXP Semiconductors

OT PLD

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

80 ns

Yes

5.5 V

TTL

5

Flatpack

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-CDFP-F28

No

0

PZ5128IS15BB1-T

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

17.5 ns

Yes

5.5 V

CMOS

5

Flatpack

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

2 Dedicated Inputs, 80 I/O

2

-40 °C (-40 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

63 MHz

20 mm

80

PLUS173DN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

12 ns

No

5.25 V

TTL

22

PLA-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

4.75 V

42

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 10 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Programmable Output Polarity

10

31.7 mm

10

PLUS20R6-7N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Mixed

4.75 V

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 2 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Power-Up Reset

74 MHz

31.7 mm

2

P3C18V8Z40DB

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

40 ns

Yes

3.6 V

CMOS

3.3

Small Outline, Shrink Pitch

Macrocell

3 V

.65 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

Programmable Output Polarity

22 MHz

7.2 mm

8

P3C18V8ZIADB

NXP Semiconductors

OT PLD

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

45 ns

Yes

3.6 V

CMOS

3.3

Small Outline, Shrink Pitch

Macrocell

3 V

.65 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDSO-G20

2 mm

5.3 mm

No

Programmable Output Polarity

18 MHz

7.2 mm

8

5962-9176014NXA

NXP Semiconductors

OT PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

7.5 ns

No

5.25 V

BICMOS

MIL-PRF-38535

5

In-Line

Macrocell

4.75 V

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

71 MHz

10

PLS157N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

55 ns

No

5.25 V

TTL

5

In-Line

Mixed

4.75 V

2.54 mm

75 °C (167 °F)

4 Dedicated Inputs, 12 I/O

4

0 °C (32 °F)

Dual

R-PDIP-T20

4.06 mm

7.62 mm

No

Programmable Logic Sequencer; 1 External Clock

14 MHz

26.695 mm

12

PZ3128IS15BE

NXP Semiconductors

EE PLD

Industrial

Gull Wing

128

LFQFP

Rectangular

Plastic/Epoxy

17.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Low Profile, Fine Pitch

Macrocell

3 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 96 I/O

2

-40 °C (-40 °F)

Quad

R-PQFP-G128

1.6 mm

14 mm

No

59 MHz

20 mm

96

5962-8768201RA

NXP Semiconductors

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

45 ns

No

5.5 V

Bipolar

18

PLA-TYPE

5

In-Line

No

Combinatorial

4.5 V

42

125 °C (257 °F)

8 Dedicated Inputs, 10 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

No

10

No

10

PLS179N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

35 ns

No

5.25 V

TTL

5

In-Line

Mixed

4.75 V

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 12 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Programmable Logic Sequencer; 1 External Clock

18.2 MHz

31.7 mm

12

PLS105AN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

30 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Dual

R-PDIP-T28

5.08 mm

15.24 mm

No

Programmable Logic Sequencer; 1 External Clock

12.5 MHz

36.51 mm

0

P3Z22V10-DD-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

10 ns

Yes

3.6 V

CMOS

3.3

Small Outline

Macrocell

3 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDSO-G24

2.65 mm

7.5 mm

No

83 MHz

15.4 mm

10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.