Rectangular Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	No. of I/O Lines
PLUS405-55N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	TTL				5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	15 Dedicated Inputs, 0 I/O	15	0 °C (32 °F)		Dual	R-PDIP-T28		5.08 mm	15.24 mm	No	Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock		38.5 MHz		36.51 mm	0
5962-8768201RX	NXP Semiconductors	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Metal-Sealed Cofired	45 ns	No	5.5 V	Bipolar	MIL-STD-883			5		In-Line			Combinatorial	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 10 I/O	8	-55 °C (-67 °F)		Dual	R-CDIP-T20				No						10
LVT20V8-7D	NXP Semiconductors	OT PLD		Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	3.6 V	BICMOS				3.3		Small Outline			Macrocell	3 V		1.27 mm		12 Dedicated Inputs, 8 I/O	12			Dual	R-PDSO-G24		2.65 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock		110 MHz		15.4 mm	8
PZ3064-10BB1	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack			Macrocell	2.97 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			80 MHz		20 mm	64
P5Z22V10-DD	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS				5		Small Outline			Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No			83 MHz		15.4 mm	10
PZ3128IS12BE-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	3.6 V	CMOS				3.3		Flatpack, Low Profile, Fine Pitch			Macrocell	3 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			66 MHz		20 mm	96
PZ5128-S12BE-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	CMOS				5		Flatpack, Low Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			63 MHz		20 mm	96
PZ3064-12BB1-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack			Macrocell	2.97 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			67 MHz		20 mm	64
PZ5128-S12BE	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	CMOS				5		Flatpack, Low Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			63 MHz		20 mm	96
PZ3064I15BB1-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	17.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack			Macrocell	2.97 V		.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			58 MHz		20 mm	64
P5Z22V10-DD-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS				5		Small Outline			Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No			83 MHz		15.4 mm	10
PLC18V8ZIADH	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices	Macrocell	4.5 V	74	.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No	8 Macrocell; Power Up Reset; Shared Input/Clock		30 MHz	8	6.5 mm	8
PLC18V8Z25DB-T	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.25 V	CMOS				5		Small Outline, Shrink Pitch			Macrocell	4.75 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20		2 mm	5.3 mm	No	8 Macrocell; Power Up Reset; Shared Input/Clock		30 MHz		7.2 mm	8
PZ5064I10BB1-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	12.5 ns	Yes	5.5 V	CMOS				5		Flatpack			Macrocell	4.5 V		.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			77 MHz		20 mm	64
P3C18V8ZIADB-T	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	45 ns	Yes	3.6 V	CMOS				3.3		Small Outline, Shrink Pitch			Macrocell	3 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2 mm	5.3 mm	No	Programmable Output Polarity		18 MHz		7.2 mm	8
PZ5128-S10BE-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	12 ns	Yes	5.25 V	CMOS				5		Flatpack, Low Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			71 MHz		20 mm	96
PLC18V8ZIN	NXP Semiconductors	OT PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	40 ns	No	5.5 V	CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.5 V	74	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDIP-T20		4.2 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		18 MHz	8	26.73 mm	8
PZ5128-S7BB1-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS				5		Flatpack			Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			87 MHz		20 mm	80
N82S100I	NXP Semiconductors	OT PLD	Commercial	Through-Hole	28	DIP	Rectangular	Ceramic		No		TTL		16	PLA-TYPE	5	5 V	In-Line	DIP28,.6	Programmable Logic Devices			48	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead	Dual	R-XDIP-T28				No		e0		8
PLQ16R4-5N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	BICMOS				5		In-Line			Mixed	4.75 V			75 °C (167 °F)	8 Dedicated Inputs, 4 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20				No	Register Preload; Power-Up Reset		118 MHz			4
10020EV8-4F	NXP Semiconductors	OT PLD	Other	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	4.7 ns	No		ECL		20	PAL-TYPE		-4.5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		90	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 8 I/O	11	0 °C (32 °F)		Dual	R-GDIP-T24	1	5.08 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset		204 MHz	8	31.955 mm	8
PZ5128NS15BE	NXP Semiconductors	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	17.5 ns	Yes	5.5 V	CMOS				5		Flatpack, Low Profile, Fine Pitch			Macrocell	4.5 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No	128 Macrocells		63 MHz		20 mm	96
PLC18V8Z35N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	35 ns	No	5.25 V	CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.75 V	74	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20		4.2 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		21 MHz	8	26.73 mm	8
PZ5064-7BB1	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS				5		Flatpack			Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			105 MHz		20 mm	64
P5Z22V10IDD	NXP Semiconductors	EE PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	11 ns	Yes	5.5 V	CMOS				5		Small Outline			Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No			74 MHz		15.4 mm	10
PZ3128DS15BE-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	17.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Low Profile, Fine Pitch			Macrocell	2.97 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No	128 Macrocells		63 MHz		20 mm	96
PLUS16R8DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL				5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 0 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20		4.06 mm	7.62 mm	No	Power-Up Reset		60.6 MHz		26.695 mm	0
P3Z22V10-BDH-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V	CMOS				3.3		Small Outline, Thin Profile, Shrink Pitch			Macrocell	3 V		.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		1.1 mm	4.4 mm	No			69 MHz		7.8 mm	10
P3C18V8Z35N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	45 ns	No	3.6 V	CMOS				3.3		In-Line			Macrocell	2.7 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20		4.2 mm	7.62 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		21 MHz		26.73 mm	8
PZ3128-S10BE-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	13 ns	Yes	3.6 V	CMOS				3.3		Flatpack, Low Profile, Fine Pitch			Macrocell	3 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			74 MHz		20 mm	96
PLC18V8ZIDB	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	40 ns	Yes	5.5 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline, Shrink Pitch	DIP20,.3	Programmable Logic Devices	Macrocell	4.5 V	74	.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2 mm	5.3 mm	No			18 MHz	8	7.2 mm	8
PZ3128-S15BE	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	17.5 ns	Yes	3.6 V	CMOS				3.3		Flatpack, Low Profile, Fine Pitch			Macrocell	3 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			59 MHz		20 mm	96
LVT22V10-7D	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	8.5 ns	Yes	3.6 V	BICMOS		22	PAL-TYPE	3.3	3.3 V	Small Outline	SOP24,.4	Programmable Logic Devices	Macrocell	3 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		95 MHz	10	15.4 mm	10
PZ3128IS12BB1	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	3.6 V	CMOS				3.3		Flatpack			Macrocell	3 V		.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 80 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			66 MHz		20 mm	80
P3C18V8ZIFA	NXP Semiconductors	UV PLD	Industrial	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	50 ns	No	3.6 V	CMOS				3.3		In-Line			Macrocell	2.7 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		17 MHz		24.305 mm	8
PZ3128-S10BB1	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	13 ns	Yes	3.6 V	CMOS				3.3		Flatpack			Macrocell	3 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			74 MHz		20 mm	80
P5Z22V10-7DH	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	9 ns	Yes	5.25 V	CMOS				5		Small Outline, Thin Profile, Shrink Pitch			Macrocell	4.75 V		.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		1.1 mm	4.4 mm	No			103 MHz		7.8 mm	10
PLUS105-55N3	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	TTL				5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Dual	R-PDIP-T28		5.33 mm	7.62 mm	No	Programmable Logic Sequencer; 1 External Clock		35.7 MHz		35.505 mm	0
PZ3128-S12BB1-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	3.6 V	CMOS				3.3		Flatpack			Macrocell	3 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			66 MHz		20 mm	80
PLC18V8ZIADH-T	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V	CMOS				5		Small Outline, Thin Profile, Shrink Pitch			Macrocell	4.5 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No	8 Macrocell; Power Up Reset; Shared Input/Clock		30 MHz		6.5 mm	8
PZ5128IS10BE-S	NXP Semiconductors	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V	CMOS				5		Flatpack, Low Profile, Fine Pitch			Macrocell	4.5 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			66 MHz		20 mm	96
LVT16V8-7DB	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	9 ns	Yes	3.6 V	BICMOS				3.3		Small Outline, Shrink Pitch			Macrocell	3 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20		2 mm	5.3 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		91 MHz		7.2 mm	8
P3C18V8ZIAD-T	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	45 ns	Yes	3.6 V	CMOS				3.3		Small Outline			Macrocell	3 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.65 mm	7.5 mm	No	Programmable Output Polarity		18 MHz		12.8 mm	8
82S101/BYA-T	NXP Semiconductors	OT PLD	Military	Flat	28	DFP	Rectangular	Ceramic, Metal-Sealed Cofired	80 ns	Yes	5.5 V	TTL				5		Flatpack			Combinatorial	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Dual	R-CDFP-F28				No						0
82S153A/BRA	NXP Semiconductors	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	45 ns	No	5.5 V	TTL				5		In-Line			Combinatorial	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 10 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20				No						10
PZ5128CS12BE-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	5.25 V	CMOS				5		Flatpack, Low Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No	128 Macrocells		63 MHz		20 mm	96
PZ5128CS7BE-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	9.5 ns	Yes	5.25 V	CMOS				5		Flatpack, Low Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No	128 Macrocells		95 MHz		20 mm	96
ABT22V10A/BLA	NXP Semiconductors	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V	BICMOS				5		In-Line			Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDIP-T24		5.08 mm	7.62 mm	No			55 MHz			10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.