NXP Semiconductors Programmable Logic Devices (PLD) 886

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	No. of I/O Lines
PML2552-35KA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	68	QCCJ	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	CMOS				5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	9 Dedicated Inputs, 24 I/O	9	0 °C (32 °F)		Quad	S-CQCC-J68		4.83 mm	24.065 mm	No			50 MHz		24.065 mm	24
5962-8984101LA	NXP Semiconductors	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	CMOS				5		In-Line			Macrocell	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24				No		e0	22 MHz			10
82S100/BXA	NXP Semiconductors	OT PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed	80 ns	No	5.5 V	TTL				5		In-Line			Combinatorial	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Dual	R-GDIP-T28				No						0
PZ5032CS10BC	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12.5 ns	Yes	5.25 V	CMOS				5		Flatpack, Thin Profile			Macrocell	4.75 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	32 Macrocells		59 MHz		10 mm	32
PLS100N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	50 ns	No	5.25 V	TTL		16	PLA-TYPE	5	5 V	In-Line	DIP28,.6	Programmable Logic Devices	Combinatorial	4.75 V	48	2.54 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Dual	R-PDIP-T28				No	Tri-State Output			8		0
5962-8984102LA	NXP Semiconductors	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V	CMOS				5		In-Line			Macrocell	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24				No		e0	31.2 MHz			10
PZ3128AS7BE-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	9.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Low Profile, Fine Pitch			Macrocell	2.97 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No	128 Macrocells		95 MHz		20 mm	96
PZ5064C10A44	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	5.25 V	CMOS				5		Chip Carrier			Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	64 Macrocells		77 MHz		16.5862 mm	32
PZ5128NS10BE-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	12 ns	Yes	5.5 V	CMOS				5		Flatpack, Low Profile, Fine Pitch			Macrocell	4.5 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No	128 Macrocells		66 MHz		20 mm	96
P3C18V8ZIDH	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	50 ns	Yes	3.6 V	CMOS				3.3		Small Outline, Thin Profile, Shrink Pitch			Macrocell	2.7 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		17 MHz		6.5 mm	8
PLC18V8ZIADB-T	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V	CMOS				5		Small Outline, Shrink Pitch			Macrocell	4.5 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2 mm	5.3 mm	No	8 Macrocell; Power Up Reset; Shared Input/Clock		30 MHz		7.2 mm	8
PZ5128NS10BP-S	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	12 ns	Yes	5.5 V	CMOS				5		Flatpack, Thin Profile, Fine Pitch			Macrocell	4.5 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 80 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No	128 Macrocells		66 MHz		14 mm	80
PLUS405-45A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	TTL		16	PLS-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Registered	4.75 V	64	1.27 mm	75 °C (167 °F)	15 Dedicated Inputs, 8 I/O	15	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No	Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock		29.4 MHz	8	11.5062 mm	8
5962-9176012NXA	NXP Semiconductors	OT PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	BICMOS	MIL-PRF-38535			5		In-Line			Macrocell	4.75 V			85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24				No		e0	55 MHz			10
5962-9176011NXA	NXP Semiconductors	OT PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	BICMOS	MIL-PRF-38535			5		In-Line			Macrocell	4.75 V			85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24				No		e0	55 MHz			10
PZ3128AS12BE	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Low Profile, Fine Pitch			Macrocell	2.97 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No	128 Macrocells		63 MHz		20 mm	96
PZ3064I12BC	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	14.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Thin Profile			Macrocell	2.97 V		.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No			67 MHz		10 mm	32
PZ3032DS10A44-T	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	32 Macrocells		59 MHz		16.5862 mm	32
PZ5128NS15BP-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	17.5 ns	Yes	5.5 V	CMOS				5		Flatpack, Thin Profile, Fine Pitch			Macrocell	4.5 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 80 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No	128 Macrocells		63 MHz		14 mm	80
PZ5064I10BB1	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	12.5 ns	Yes	5.5 V	CMOS				5		Flatpack			Macrocell	4.5 V		.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			77 MHz		20 mm	64
5962-9176008M3X	NXP Semiconductors	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	7.5 ns	Yes	5.25 V	BICMOS	MIL-STD-883 Class B			5		Chip Carrier			Macrocell	4.75 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N28				No		e0	71 MHz			10
PZ5128-S10BB2-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	CMOS				5		Flatpack			Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G160		4.07 mm	28 mm	No			71 MHz		28 mm	96
PZ5128-S10BP-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	CMOS				5		Flatpack, Thin Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No			71 MHz		14 mm	80
PLS155A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	55 ns	Yes	5.25 V	TTL				5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	4 Dedicated Inputs, 12 I/O	4	0 °C (32 °F)		Quad	S-PQCC-J20		4.57 mm	8.965 mm	No	Programmable Logic Sequencer; 1 External Clock		14 MHz		8.965 mm	12
P3C18V8ZIN	NXP Semiconductors	OT PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	50 ns	No	3.6 V	CMOS				3.3		In-Line			Macrocell	2.7 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDIP-T20		4.2 mm	7.62 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		17 MHz		26.73 mm	8
PZ5064I12A68-T	NXP Semiconductors	EE PLD	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	14.5 ns	Yes	5.5 V	CMOS				5		Chip Carrier			Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 48 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J68		4.57 mm	24.2316 mm	No			67 MHz		24.2316 mm	48
PZ3128IS15A84	NXP Semiconductors	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	17.5 ns	Yes	3.6 V	CMOS				3.3		Chip Carrier			Macrocell	3 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J84		4.57 mm	29.3116 mm	No			59 MHz		29.3116 mm	64
PZ3064AS7A44	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	9 ns	Yes	3.6 V	CMOS				3.3		Chip Carrier			Macrocell	3 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No			111 MHz		16.5862 mm	32
PL22V10-15N	NXP Semiconductors	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	CMOS				5		In-Line			Macrocell	4.75 V		2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDIP-T24		4.7 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset		50 MHz		31.7 mm	10
PZ3064A7BP-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	9.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Thin Profile, Fine Pitch			Macrocell	2.97 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No	64 Macrocells		105 MHz		14 mm	64
PLS105AA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	30 ns	Yes	5.25 V	TTL				5		Chip Carrier			Registered	4.75 V		1.27 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.505 mm	No	Programmable Logic Sequencer; 1 External Clock		12.5 MHz		11.505 mm	0
5962-9176008MLX	NXP Semiconductors	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	9 ns	No	5.5 V	BICMOS	MIL-STD-883			5		In-Line			Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDIP-T24		5.08 mm	7.62 mm	No			71 MHz			10
PZ5032-7BC	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12.5 ns	Yes	5.25 V	CMOS				5		Flatpack, Thin Profile			Macrocell	4.75 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No			80 MHz		10 mm	32
LVT22V10-DA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	BICMOS				3.3		Chip Carrier			Macrocell	3 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		74 MHz		11.5062 mm	10
PLHS501A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	52	QCCJ	Square	Plastic/Epoxy	17.5 ns	Yes	5.25 V	TTL		32	PLE-TYPE	5	5 V	Chip Carrier	LDCC52,.8SQ	Programmable Logic Devices	Combinatorial	4.75 V		1.27 mm	75 °C (167 °F)	24 Dedicated Inputs, 8 I/O	24	0 °C (32 °F)		Quad	S-PQCC-J52	1	4.57 mm	19.1262 mm	No			30 MHz	24	19.1262 mm	8
PZ3064-12A44	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	14.5 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No			67 MHz		16.5862 mm	32
PZ3064-12A84-T	NXP Semiconductors	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	14.5 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J84		4.57 mm	29.3116 mm	No			67 MHz		29.3116 mm	64
PZ3064-10BC-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Thin Profile			Macrocell	2.97 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No			80 MHz		10 mm	32
PLS173N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	30 ns	No	5.25 V	TTL		22	PLA-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Combinatorial	4.75 V	42	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 10 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24		4.7 mm	7.62 mm	No	Programmable Output Polarity			10	31.7 mm	10
PZ5128CS10BP-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	CMOS				5		Flatpack, Thin Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No	128 Macrocells		71 MHz		14 mm	80
P3C18V8Z40DH-T	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	40 ns	Yes	3.6 V	CMOS				3.3		Small Outline, Thin Profile, Shrink Pitch			Macrocell	3 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No	Programmable Output Polarity		22 MHz		6.5 mm	8
PZ5064-7A68-T	NXP Semiconductors	EE PLD	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS				5		Chip Carrier			Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 48 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J68		4.57 mm	24.2316 mm	No			105 MHz		24.2316 mm	48
PML2552-35KA-T	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	68	QCCJ	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	CMOS				5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	9 Dedicated Inputs, 24 I/O	9	0 °C (32 °F)		Quad	S-CQCC-J68		4.83 mm	24.065 mm	No			50 MHz		24.065 mm	24
PZ5032CS6A44-T	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	8 ns	Yes	5.25 V	CMOS				5		Chip Carrier			Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	32 Macrocells		111 MHz		16.5862 mm	32
PZ5064CS7A44	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	9 ns	Yes	5.25 V	CMOS				5		Chip Carrier			Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	64 Macrocells		105 MHz		16.5862 mm	32
LVT22V10-DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	12 ns	No	3.6 V	BICMOS				3.3		In-Line			Macrocell	3 V		2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDIP-T24		4.7 mm	7.62 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		74 MHz		31.7 mm	10
5962-8984104LA	NXP Semiconductors	Flash PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V	CMOS				5		In-Line			Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	30.3 MHz		31.877 mm	10
PZ3128AS12BE-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Low Profile, Fine Pitch			Macrocell	2.97 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No	128 Macrocells		63 MHz		20 mm	96

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.