Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 80 I/O |
2 |
0 °C (32 °F) |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
63 MHz |
20 mm |
80 |
|||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.25 V |
TTL |
5 |
In-Line |
Mixed |
4.75 V |
2.54 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 4 I/O |
12 |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
4.7 mm |
7.62 mm |
No |
Power-Up Reset |
60.6 MHz |
31.7 mm |
4 |
||||||||||||||||||||
NXP Semiconductors |
UV PLD |
Commercial Extended |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
40 ns |
No |
3.6 V |
CMOS |
3.3 |
In-Line |
Macrocell |
3 V |
2.54 mm |
75 °C (167 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Dual |
R-CDIP-T20 |
5.08 mm |
7.62 mm |
No |
Programmable Output Polarity |
22 MHz |
24.305 mm |
8 |
||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
105 MHz |
16.5862 mm |
32 |
|||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Military |
Flat |
28 |
DFP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
40 ns |
Yes |
5.5 V |
TTL |
5 |
Flatpack |
Registered |
4.5 V |
125 °C (257 °F) |
15 Dedicated Inputs, 0 I/O |
15 |
-55 °C (-67 °F) |
Dual |
R-CDFP-F28 |
No |
10.5 MHz |
0 |
|||||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
6 ns |
Yes |
5.25 V |
BICMOS |
5 |
Chip Carrier |
Registered |
4.75 V |
75 °C (167 °F) |
12 Dedicated Inputs, 0 I/O |
12 |
0 °C (32 °F) |
Quad |
S-PQCC-J28 |
No |
Register Preload; Power-Up Reset |
118 MHz |
0 |
||||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
9 ns |
No |
5.25 V |
TTL |
5 |
In-Line |
Registered |
4.75 V |
2.54 mm |
75 °C (167 °F) |
16 Dedicated Inputs, 0 I/O |
16 |
0 °C (32 °F) |
Dual |
R-PDIP-T28 |
5.08 mm |
15.24 mm |
No |
Programmable Logic Sequencer; 1 External Clock |
31.3 MHz |
36.51 mm |
0 |
||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.25 V |
TTL |
5 |
In-Line |
Registered |
4.75 V |
2.54 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 0 I/O |
12 |
0 °C (32 °F) |
Dual |
R-PDIP-T24 |
4.7 mm |
7.62 mm |
No |
Power-Up Reset |
60.6 MHz |
31.7 mm |
0 |
||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
14.5 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Thin Profile, Fine Pitch |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 80 I/O |
2 |
-40 °C (-40 °F) |
Quad |
S-PQFP-G100 |
1.2 mm |
14 mm |
No |
66 MHz |
14 mm |
80 |
|||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
40 ns |
Yes |
5.25 V |
TTL |
5 |
Chip Carrier |
Combinatorial |
4.75 V |
1.27 mm |
75 °C (167 °F) |
8 Dedicated Inputs, 10 I/O |
8 |
0 °C (32 °F) |
Quad |
S-PQCC-J20 |
4.57 mm |
8.965 mm |
No |
Programmable Output Polarity |
8.965 mm |
10 |
|||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
14.5 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Thin Profile, Fine Pitch |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 64 I/O |
2 |
-40 °C (-40 °F) |
Quad |
S-PQFP-G100 |
1.2 mm |
14 mm |
No |
64 Macrocells |
67 MHz |
14 mm |
64 |
||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
30 ns |
No |
In-Line |
10 Dedicated Inputs, 8 I/O |
10 |
Dual |
R-CDIP-T20 |
No |
8 |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.25 V |
TTL |
5 |
In-Line |
Combinatorial |
4.75 V |
75 °C (167 °F) |
10 Dedicated Inputs, 6 I/O |
10 |
0 °C (32 °F) |
Dual |
R-PDIP-T20 |
No |
High Speed Decoder |
6 |
|||||||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
14.5 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Chip Carrier |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 64 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQCC-J84 |
4.57 mm |
29.3116 mm |
No |
66 MHz |
29.3116 mm |
64 |
|||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.63 V |
CMOS |
3.3 |
Flatpack, Thin Profile |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
No |
32 Macrocells |
91 MHz |
10 mm |
32 |
||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
19 ns |
Yes |
3.63 V |
CMOS |
3.3 |
Flatpack, Thin Profile |
Macrocell |
2.97 V |
.8 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
-40 °C (-40 °F) |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
No |
47 MHz |
10 mm |
32 |
|||||||||||||||||||||
NXP Semiconductors |
Flash PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T24 |
No |
10 |
|||||||||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
59 MHz |
16.5862 mm |
32 |
|||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
7.5 ns |
No |
5.25 V |
BICMOS |
MIL-STD-883 Class B |
5 |
In-Line |
Macrocell |
4.75 V |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
No |
e0 |
71 MHz |
10 |
||||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
17.5 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack |
Macrocell |
3 V |
.65 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 96 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
59 MHz |
28 mm |
96 |
|||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
40 ns |
Yes |
5.5 V |
CMOS |
5 |
Small Outline |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-40 °C (-40 °F) |
Dual |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
No |
8 Macrocell; Power Up Reset; Shared Input/Clock |
18 MHz |
12.8 mm |
8 |
||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
30 ns |
Yes |
5.25 V |
TTL |
22 |
PLA-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Combinatorial |
4.75 V |
42 |
1.27 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 10 I/O |
12 |
0 °C (32 °F) |
Quad |
S-PQCC-J28 |
4.57 mm |
11.505 mm |
No |
Programmable Output Polarity |
10 |
11.505 mm |
10 |
||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
5 |
Small Outline, Thin Profile, Shrink Pitch |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Dual |
R-PDSO-G24 |
1.1 mm |
4.4 mm |
No |
83 MHz |
7.8 mm |
10 |
|||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
12.5 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Thin Profile, Fine Pitch |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 64 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQFP-G100 |
1.2 mm |
14 mm |
No |
64 Macrocells |
77 MHz |
14 mm |
64 |
||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
17.5 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack |
Macrocell |
3 V |
.65 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 80 I/O |
2 |
-40 °C (-40 °F) |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
59 MHz |
20 mm |
80 |
|||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
3.63 V |
CMOS |
3.3 |
Flatpack |
Macrocell |
2.97 V |
.65 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 64 I/O |
2 |
0 °C (32 °F) |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
67 MHz |
20 mm |
64 |
|||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Military |
Through-Hole |
20 |
Rectangular |
Ceramic, Metal-Sealed Cofired |
12 ns |
No |
5.5 V |
TTL |
5 |
In-Line |
Combinatorial |
4.5 V |
125 °C (257 °F) |
10 Dedicated Inputs, 6 I/O |
10 |
-55 °C (-67 °F) |
Dual |
R-CDIP-T20 |
No |
Security Fuse |
6 |
||||||||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Small Outline, Thin Profile, Shrink Pitch |
Macrocell |
3 V |
.65 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Dual |
R-PDSO-G24 |
1.1 mm |
4.4 mm |
No |
65 MHz |
7.8 mm |
10 |
|||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
8 ns |
Yes |
3.63 V |
CMOS |
3.3 |
Chip Carrier |
Macrocell |
2.97 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
32 Macrocells |
111 MHz |
16.5862 mm |
32 |
||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Thin Profile |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
No |
59 MHz |
10 mm |
32 |
|||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
17.5 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack |
Macrocell |
3 V |
.65 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 80 I/O |
2 |
0 °C (32 °F) |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
59 MHz |
20 mm |
80 |
|||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 96 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
71 MHz |
28 mm |
96 |
|||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
12.5 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
77 MHz |
16.5862 mm |
32 |
|||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
9.5 ns |
Yes |
3.63 V |
CMOS |
3.3 |
Flatpack, Thin Profile |
Macrocell |
2.97 V |
.8 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
No |
32 Macrocells |
105 MHz |
10 mm |
32 |
||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
14.5 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 64 I/O |
2 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J84 |
4.57 mm |
29.3116 mm |
No |
67 MHz |
29.3116 mm |
64 |
|||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 96 I/O |
2 |
-40 °C (-40 °F) |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
66 MHz |
28 mm |
96 |
|||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
8 ns |
Yes |
5.25 V |
TTL |
5 |
Chip Carrier |
Registered |
4.75 V |
1.27 mm |
75 °C (167 °F) |
8 Dedicated Inputs, 0 I/O |
8 |
0 °C (32 °F) |
Quad |
S-PQCC-J20 |
4.57 mm |
8.965 mm |
No |
Power-Up Reset |
74 MHz |
8.965 mm |
0 |
||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Small Outline |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Dual |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
No |
69 MHz |
15.4 mm |
10 |
|||||||||||||||||||||
NXP Semiconductors |
UV PLD |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
45 ns |
No |
3.6 V |
CMOS |
3.3 |
In-Line |
Macrocell |
3 V |
2.54 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-40 °C (-40 °F) |
Dual |
R-CDIP-T20 |
5.08 mm |
7.62 mm |
No |
Programmable Output Polarity |
18 MHz |
24.305 mm |
8 |
||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
17.5 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 64 I/O |
2 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J84 |
4.57 mm |
29.3116 mm |
No |
63 MHz |
29.3116 mm |
64 |
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NXP Semiconductors |
OT PLD |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
45 ns |
Yes |
5.5 V |
Bipolar |
MIL-STD-883 |
5 |
Chip Carrier |
Combinatorial |
4.5 V |
125 °C (257 °F) |
8 Dedicated Inputs, 10 I/O |
8 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N20 |
No |
e0 |
10 |
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NXP Semiconductors |
EE PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
17.5 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Thin Profile, Fine Pitch |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 80 I/O |
2 |
-40 °C (-40 °F) |
Quad |
S-PQFP-G100 |
1.2 mm |
14 mm |
No |
128 Macrocells |
63 MHz |
14 mm |
80 |
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NXP Semiconductors |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
45 ns |
No |
5.5 V |
TTL |
18 |
PLA-TYPE |
5 |
In-Line |
DIP20,.3 |
No |
4.5 V |
42 |
125 °C (257 °F) |
0 Dedicated Inputs, 10 I/O |
0 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T20 |
e0 |
10 |
No |
10 |
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NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 80 I/O |
2 |
0 °C (32 °F) |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
87 MHz |
20 mm |
80 |
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NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
40 ns |
No |
5.25 V |
CMOS |
5 |
In-Line |
Registered |
4.75 V |
2.54 mm |
75 °C (167 °F) |
15 Dedicated Inputs, 0 I/O |
15 |
0 °C (32 °F) |
Dual |
R-PDIP-T28 |
5.08 mm |
15.24 mm |
No |
Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock |
13.3 MHz |
36.51 mm |
0 |
||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
12.5 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.75 V |
.65 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 64 I/O |
2 |
0 °C (32 °F) |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
77 MHz |
20 mm |
64 |
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NXP Semiconductors |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
14.5 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack |
Macrocell |
3 V |
.65 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 80 I/O |
2 |
-40 °C (-40 °F) |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
66 MHz |
20 mm |
80 |
|||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Thin Profile |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
No |
59 MHz |
10 mm |
32 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.