NXP Semiconductors Programmable Logic Devices (PLD) 886

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	No. of I/O Lines
PZ3128IS15BB2	NXP Semiconductors	EE PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	17.5 ns	Yes	3.6 V	CMOS			3.3		Flatpack			Macrocell	3 V		.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G160		4.07 mm	28 mm	No			59 MHz		28 mm	96
PZ5128-S7BB1-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS			5		Flatpack			Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			87 MHz		20 mm	80
N82S100I	NXP Semiconductors	OT PLD	Commercial	Through-Hole	28	DIP	Rectangular	Ceramic		No		TTL	16	PLA-TYPE	5	5 V	In-Line	DIP28,.6	Programmable Logic Devices			48	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead	Dual	R-XDIP-T28				No		e0		8
PLQ16R4-5N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	BICMOS			5		In-Line			Mixed	4.75 V			75 °C (167 °F)	8 Dedicated Inputs, 4 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20				No	Register Preload; Power-Up Reset		118 MHz			4
PZ3064AS10EC	NXP Semiconductors	EE PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	11.5 ns	Yes	3.6 V	CMOS			3.3		Grid Array, Low Profile, Fine Pitch			Macrocell	3 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 44 I/O	2	0 °C (32 °F)		Bottom	S-PBGA-B56		1.35 mm	6 mm	No			83 MHz		6 mm	44
PZ5064C7BP-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	9.5 ns	Yes	5.25 V	CMOS			5		Flatpack, Thin Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No	64 Macrocells		105 MHz		14 mm	64
PZ3064AS10BC	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	11.5 ns	Yes	3.6 V	CMOS			3.3		Flatpack, Thin Profile			Macrocell	3 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No			83 MHz		10 mm	32
PL22V10-10A	NXP Semiconductors	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS			5		Chip Carrier			Macrocell	4.75 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.505 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset		66.6 MHz		11.505 mm	10
10020EV8-4F	NXP Semiconductors	OT PLD	Other	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	4.7 ns	No		ECL	20	PAL-TYPE		-4.5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		90	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 8 I/O	11	0 °C (32 °F)		Dual	R-GDIP-T24	1	5.08 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset		204 MHz	8	31.955 mm	8
PZ5128NS15BE	NXP Semiconductors	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	17.5 ns	Yes	5.5 V	CMOS			5		Flatpack, Low Profile, Fine Pitch			Macrocell	4.5 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No	128 Macrocells		63 MHz		20 mm	96
PLC18V8Z35N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	35 ns	No	5.25 V	CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.75 V	74	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20		4.2 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		21 MHz	8	26.73 mm	8
PZ5032-7A44-T	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	5.25 V	CMOS			5		Chip Carrier			Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No			80 MHz		16.5862 mm	32
PZ3064A7BP	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	9.5 ns	Yes	3.63 V	CMOS			3.3		Flatpack, Thin Profile, Fine Pitch			Macrocell	2.97 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No	64 Macrocells		105 MHz		14 mm	64
PZ5064-7BB1	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS			5		Flatpack			Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			105 MHz		20 mm	64
PZ3128IS12A84-T	NXP Semiconductors	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	14.5 ns	Yes	3.6 V	CMOS			3.3		Chip Carrier			Macrocell	3 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J84		4.57 mm	29.3116 mm	No			66 MHz		29.3116 mm	64
PZ5128IS15A84	NXP Semiconductors	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	17.5 ns	Yes	5.5 V	CMOS			5		Chip Carrier			Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J84		4.57 mm	29.3116 mm	No			63 MHz		29.3116 mm	64
P5Z22V10IDD	NXP Semiconductors	EE PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	11 ns	Yes	5.5 V	CMOS			5		Small Outline			Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No			74 MHz		15.4 mm	10
PLS100A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	50 ns	Yes	5.25 V	TTL	16	PLA-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Combinatorial	4.75 V	48	1.27 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.505 mm	No	Tri-State Output			8	11.505 mm	0
PZ3128DS15BE-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	17.5 ns	Yes	3.63 V	CMOS			3.3		Flatpack, Low Profile, Fine Pitch			Macrocell	2.97 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No	128 Macrocells		63 MHz		20 mm	96
PLUS16R8DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL			5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 0 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20		4.06 mm	7.62 mm	No	Power-Up Reset		60.6 MHz		26.695 mm	0
PZ3032NS10BC	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS			3.3		Flatpack, Thin Profile			Macrocell	3 V		.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	32 Macrocells		58.8 MHz		10 mm	32
P3Z22V10-BDH-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V	CMOS			3.3		Small Outline, Thin Profile, Shrink Pitch			Macrocell	3 V		.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		1.1 mm	4.4 mm	No			69 MHz		7.8 mm	10
P3C18V8Z35N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	45 ns	No	3.6 V	CMOS			3.3		In-Line			Macrocell	2.7 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20		4.2 mm	7.62 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		21 MHz		26.73 mm	8
PZ3128-S10BE-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	13 ns	Yes	3.6 V	CMOS			3.3		Flatpack, Low Profile, Fine Pitch			Macrocell	3 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			74 MHz		20 mm	96
PLC18V8ZIDB	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	40 ns	Yes	5.5 V	CMOS	18	PAL-TYPE	5	5 V	Small Outline, Shrink Pitch	DIP20,.3	Programmable Logic Devices	Macrocell	4.5 V	74	.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2 mm	5.3 mm	No			18 MHz	8	7.2 mm	8
PZ3128-S15BE	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	17.5 ns	Yes	3.6 V	CMOS			3.3		Flatpack, Low Profile, Fine Pitch			Macrocell	3 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			59 MHz		20 mm	96
LVT22V10-7D	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	8.5 ns	Yes	3.6 V	BICMOS	22	PAL-TYPE	3.3	3.3 V	Small Outline	SOP24,.4	Programmable Logic Devices	Macrocell	3 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		95 MHz	10	15.4 mm	10
PZ5128CS7BP-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	9.5 ns	Yes	5.25 V	CMOS			5		Flatpack, Thin Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No	128 Macrocells		95 MHz		14 mm	80
LVT22V10-DA-T	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	BICMOS			3.3		Chip Carrier			Macrocell	3 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		74 MHz		11.5062 mm	10
PZ3128IS12BB1	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	3.6 V	CMOS			3.3		Flatpack			Macrocell	3 V		.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 80 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			66 MHz		20 mm	80
PZ3064A7BC	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	9.5 ns	Yes	3.63 V	CMOS			3.3		Flatpack, Thin Profile			Macrocell	2.97 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	32 Macrocells		105 MHz		10 mm	32
P3C18V8ZIFA	NXP Semiconductors	UV PLD	Industrial	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	50 ns	No	3.6 V	CMOS			3.3		In-Line			Macrocell	2.7 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		17 MHz		24.305 mm	8
PZ3128-S10BB1	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	13 ns	Yes	3.6 V	CMOS			3.3		Flatpack			Macrocell	3 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			74 MHz		20 mm	80
PZ3032I10BC-S	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	16 ns	Yes	3.63 V	CMOS			3.3		Flatpack, Thin Profile			Macrocell	2.97 V		.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No			58.8 MHz		10 mm	32
PL22V10-12A	NXP Semiconductors	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	CMOS			5		Chip Carrier			Macrocell	4.75 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.505 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset		58.8 MHz		11.505 mm	10
P5Z22V10-7DH	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	9 ns	Yes	5.25 V	CMOS			5		Small Outline, Thin Profile, Shrink Pitch			Macrocell	4.75 V		.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		1.1 mm	4.4 mm	No			103 MHz		7.8 mm	10
PLUS105-55N3	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	TTL			5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Dual	R-PDIP-T28		5.33 mm	7.62 mm	No	Programmable Logic Sequencer; 1 External Clock		35.7 MHz		35.505 mm	0
PZ3064A10A44-T	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS			3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	32 Macrocells		77 MHz		16.5862 mm	32
PZ3128-S12BB1-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	3.6 V	CMOS			3.3		Flatpack			Macrocell	3 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			66 MHz		20 mm	80
PZ3032NS10BC-S	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS			3.3		Flatpack, Thin Profile			Macrocell	3 V		.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	32 Macrocells		58.8 MHz		10 mm	32
PLQ20R6-5A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	8 ns	Yes	5.25 V	BICMOS			5		Chip Carrier			Mixed	4.75 V			75 °C (167 °F)	12 Dedicated Inputs, 2 I/O	12	0 °C (32 °F)		Quad	S-PQCC-J28				No	Register Preload; Power-Up Reset		118 MHz			2
PZ3064I15A68	NXP Semiconductors	EE PLD	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	17.5 ns	Yes	3.63 V	CMOS			3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 48 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J68		4.57 mm	24.2316 mm	No			58 MHz		24.2316 mm	48
PML2852-50KA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	84	QCCJ	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	CMOS			5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	29 Dedicated Inputs, 24 I/O	29	0 °C (32 °F)		Quad	S-CQCC-J84		4.83 mm	29.145 mm	No	52 Flip Flops				29.145 mm	24
PLC18V8ZIADH-T	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V	CMOS			5		Small Outline, Thin Profile, Shrink Pitch			Macrocell	4.5 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No	8 Macrocell; Power Up Reset; Shared Input/Clock		30 MHz		6.5 mm	8
PZ3032I10A44	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	16 ns	Yes	3.63 V	CMOS			3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No			58.8 MHz		16.5862 mm	32
PZ3128-S12BB2-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	14.5 ns	Yes	3.6 V	CMOS			3.3		Flatpack			Macrocell	3 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G160		4.07 mm	28 mm	No			66 MHz		28 mm	96
PZ3128-S12BP-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	14.5 ns	Yes	3.6 V	CMOS			3.3		Flatpack, Thin Profile, Fine Pitch			Macrocell	3 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No			66 MHz		14 mm	80
PLC18V8Z35A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	35 ns	Yes	5.25 V	CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Macrocell	4.75 V	74	1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J20		4.57 mm	8.965 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		21 MHz	8	8.965 mm	8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.