NXP Semiconductors Programmable Logic Devices (PLD) 886

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

PZ5128-S12BB2

NXP Semiconductors

EE PLD

Commercial

Gull Wing

160

QFP

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

5

Flatpack

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

2 Dedicated Inputs, 96 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G160

4.07 mm

28 mm

No

63 MHz

28 mm

96

PLC18V8Z25N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

25 ns

No

5.25 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.75 V

74

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T20

4.2 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

30 MHz

8

26.73 mm

8

PZ5064N10BC

NXP Semiconductors

EE PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

12.5 ns

Yes

5.5 V

CMOS

5

Flatpack, Thin Profile

Macrocell

4.5 V

.8 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

64 Macrocells

77 MHz

10 mm

32

82S101/BXA

NXP Semiconductors

OT PLD

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

80 ns

No

5.5 V

TTL

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-GDIP-T28

No

0

PZ3064-10BB1-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

12.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack

Macrocell

2.97 V

.65 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

80 MHz

20 mm

64

PZ3032AS10BC

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

12.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

2.97 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

32 Macrocells

59 MHz

10 mm

32

PML2852-35A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

84

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

CMOS

5

Chip Carrier

Mixed

4.75 V

1.27 mm

75 °C (167 °F)

29 Dedicated Inputs, 24 I/O

29

0 °C (32 °F)

Quad

S-PQCC-J84

4.57 mm

29.3116 mm

No

52 Flip Flops

29.3116 mm

24

PML2852-35KA-T

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

84

QCCJ

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

CMOS

5

Chip Carrier

Mixed

4.75 V

1.27 mm

75 °C (167 °F)

29 Dedicated Inputs, 24 I/O

29

0 °C (32 °F)

Quad

S-CQCC-J84

4.83 mm

29.145 mm

No

52 Flip Flops

29.145 mm

24

PZ5064CS7BC

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

9 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

64 Macrocells

105 MHz

10 mm

32

P3Z22V10-DDH-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

24

TSSOP

Rectangular

Plastic/Epoxy

10 ns

Yes

3.6 V

CMOS

3.3

Small Outline, Thin Profile, Shrink Pitch

Macrocell

3 V

.65 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDSO-G24

1.1 mm

4.4 mm

No

83 MHz

7.8 mm

10

PZ3128DS15BE

NXP Semiconductors

EE PLD

Industrial

Gull Wing

128

LFQFP

Rectangular

Plastic/Epoxy

17.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Low Profile, Fine Pitch

Macrocell

2.97 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 96 I/O

2

-40 °C (-40 °F)

Quad

R-PQFP-G128

1.6 mm

14 mm

No

128 Macrocells

63 MHz

20 mm

96

PZ3064-10A44

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

12.5 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

80 MHz

16.5862 mm

32

PLC18V8ZIA

NXP Semiconductors

OT PLD

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.5 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

DIP20,.3

Programmable Logic Devices

Macrocell

4.5 V

74

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

18 MHz

8

8.965 mm

8

PZ3128IS15BP

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

17.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Thin Profile, Fine Pitch

Macrocell

3 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 80 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

59 MHz

14 mm

80

5962-9201201MLA

NXP Semiconductors

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

35 ns

No

5.5 V

Bipolar

MIL-STD-883

5

In-Line

Registered

4.5 V

125 °C (257 °F)

12 Dedicated Inputs, 0 I/O

12

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

No

e0

10.5 MHz

0

PZ3064I12A84-T

NXP Semiconductors

EE PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

14.5 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J84

4.57 mm

29.3116 mm

No

67 MHz

29.3116 mm

64

PZ5064-7BC

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

105 MHz

10 mm

32

PLUS20L8DN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Combinatorial

4.75 V

2.54 mm

75 °C (167 °F)

14 Dedicated Inputs, 6 I/O

14

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

31.7 mm

6

PML2852-50KA-T

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

84

QCCJ

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

CMOS

5

Chip Carrier

Mixed

4.75 V

1.27 mm

75 °C (167 °F)

29 Dedicated Inputs, 24 I/O

29

0 °C (32 °F)

Quad

S-CQCC-J84

4.83 mm

29.145 mm

No

52 Flip Flops

29.145 mm

24

PZ3064-10A68

NXP Semiconductors

EE PLD

Commercial

J Bend

68

QCCJ

Square

Plastic/Epoxy

12.5 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 48 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J68

4.57 mm

24.2316 mm

No

80 MHz

24.2316 mm

48

P5Z22V10-DA-T

NXP Semiconductors

EE PLD

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

83 MHz

11.5062 mm

10

ABT22V10-7A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

BICMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

10 Macrocells; Variable Product Terms; Power-Up Reset; 1 External Clock; Shared Input/Clock

83 MHz

11.5062 mm

10

P3Q16V8-7D

NXP Semiconductors

OT PLD

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

7.5 ns

Yes

3.6 V

BICMOS

3.3

Small Outline

Macrocell

3 V

1.27 mm

8 Dedicated Inputs, 9 I/O

8

Dual

R-PDSO-G20

2.65 mm

7.5 mm

No

8 Macrocells; 1 External Clock; 5 V compatile Inputs & I/O; Register Preload; Power-up reset

105 MHz

12.8 mm

9

PZ5064I12BB1-S

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

14.5 ns

Yes

5.5 V

CMOS

5

Flatpack

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

67 MHz

20 mm

64

PML2552-50A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

68

QCCJ

Square

Plastic/Epoxy

Yes

5.25 V

CMOS

5

Chip Carrier

Mixed

4.75 V

1.27 mm

75 °C (167 °F)

9 Dedicated Inputs, 24 I/O

9

0 °C (32 °F)

Quad

S-PQCC-J68

4.57 mm

24.23 mm

No

35 MHz

24.23 mm

24

PZ5128CS10BE

NXP Semiconductors

EE PLD

Commercial

Gull Wing

128

LFQFP

Rectangular

Plastic/Epoxy

12 ns

Yes

5.25 V

CMOS

5

Flatpack, Low Profile, Fine Pitch

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 96 I/O

2

0 °C (32 °F)

Quad

R-PQFP-G128

1.6 mm

14 mm

No

128 Macrocells

71 MHz

20 mm

96

PZ5064-7A84

NXP Semiconductors

EE PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J84

4.57 mm

29.3116 mm

No

105 MHz

29.3116 mm

64

PZ3032NS12BC-S

NXP Semiconductors

EE PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

15 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

3 V

.8 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

32 Macrocells

47 MHz

10 mm

32

PLUS153-10N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Combinatorial

4.75 V

75 °C (167 °F)

8 Dedicated Inputs, 10 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T20

No

Programmable Output Polarity

10

PZ3128IS15A84-T

NXP Semiconductors

EE PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

17.5 ns

Yes

3.6 V

CMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J84

4.57 mm

29.3116 mm

No

59 MHz

29.3116 mm

64

PZ5064N12A84

NXP Semiconductors

EE PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

14.5 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J84

4.57 mm

29.3116 mm

No

64 Macrocell; In-System Programmable

67 MHz

29.3116 mm

64

PLUS153-10A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

TTL

5

Chip Carrier

Combinatorial

4.75 V

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 10 I/O

8

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

Programmable Output Polarity

8.965 mm

10

PZ5032CS7BC-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

32 Macrocells

80 MHz

10 mm

32

PZ5032CS10BC-S

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

12.5 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

32 Macrocells

59 MHz

10 mm

32

PZ3128AS7BP-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

9.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile, Fine Pitch

Macrocell

2.97 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 80 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

128 Macrocells

95 MHz

14 mm

80

PZ5128-S7BB1

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Flatpack

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

2 Dedicated Inputs, 80 I/O

2

0 °C (32 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

87 MHz

20 mm

80

PLUS16R8/BRA

NXP Semiconductors

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

TTL

38535Q/M;38534H;883B

8

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T20

No

e0

50 MHz

8

5962-8984105LA

NXP Semiconductors

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

CMOS

MIL-STD-883

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

e0

42 MHz

10

PZ3064I12A68-T

NXP Semiconductors

EE PLD

Industrial

J Bend

68

QCCJ

Square

Plastic/Epoxy

14.5 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 48 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J68

4.57 mm

24.2316 mm

No

67 MHz

24.2316 mm

48

PZ5032I10BC-S

NXP Semiconductors

EE PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

5

Flatpack, Thin Profile

Macrocell

4.5 V

.8 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

59 MHz

10 mm

32

PZ3128DS15BP-T

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

17.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile, Fine Pitch

Macrocell

2.97 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 80 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

128 Macrocells

63 MHz

14 mm

80

P5Z22V10IDDH

NXP Semiconductors

EE PLD

Industrial

Gull Wing

24

TSSOP

Rectangular

Plastic/Epoxy

11 ns

Yes

5.5 V

CMOS

5

Small Outline, Thin Profile, Shrink Pitch

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Dual

R-PDSO-G24

1.1 mm

4.4 mm

No

74 MHz

7.8 mm

10

P5Z22V10IDA

NXP Semiconductors

EE PLD

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

11 ns

Yes

5.5 V

CMOS

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

74 MHz

11.5062 mm

10

PLUS105-70N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

6.5 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Dual

R-PDIP-T28

5.08 mm

15.24 mm

No

Programmable Logic Sequencer; 1 External Clock

47.6 MHz

36.51 mm

0

LVT22V10-BN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

3.6 V

BICMOS

3.3

In-Line

Macrocell

3 V

2.54 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

50 MHz

31.7 mm

10

PZ5032I10BC

NXP Semiconductors

EE PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

5

Flatpack, Thin Profile

Macrocell

4.5 V

.8 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

59 MHz

10 mm

32

5962-8768201M2X

NXP Semiconductors

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

45 ns

Yes

5.5 V

Bipolar

MIL-STD-883

5

Chip Carrier

Combinatorial

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 10 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

No

10

PZ5032NS7BC-S

NXP Semiconductors

EE PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

9.5 ns

Yes

5.5 V

CMOS

5

Flatpack, Thin Profile

Macrocell

4.5 V

.8 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

32 Macrocells

91 MHz

10 mm

32

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.