NXP Semiconductors Programmable Logic Devices (PLD) 886

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	No. of I/O Lines
PZ5064-7BB	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	12.5 ns	Yes	5.25 V	CMOS				5		Flatpack			Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			105 MHz		19.6 mm	64
LVT22V10B7A-T	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	BICMOS				3.3		Chip Carrier			Macrocell	3 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No	Programmable Output Polarity		95 MHz		11.5062 mm	10
PZ5064-7BC-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS				5		Flatpack, Thin Profile			Macrocell	4.75 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No			105 MHz		10 mm	32
PZ3064D10BC-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Thin Profile			Macrocell	2.97 V		.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	32 Macrocells		77 MHz		10 mm	32
PLUS153DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	12 ns	No	5.25 V	TTL		18	PLA-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Combinatorial	4.75 V	42	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 10 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20				No	Programmable Output Polarity			10		10
PZ3032-12A44-T	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	19 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No			47 MHz		16.5862 mm	32
PLUS173-10A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	TTL				5		Chip Carrier			Combinatorial	4.75 V		1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 10 I/O	12	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.505 mm	No	Programmable Output Polarity				11.505 mm	10
LVT16V8-6N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	7 ns	No	3.6 V	BICMOS				3.3		In-Line			Macrocell	3 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20		4.2 mm	7.62 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		111 MHz		26.73 mm	8
PZ3064I12BC-S	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	14.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Thin Profile			Macrocell	2.97 V		.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No			67 MHz		10 mm	32
PZ3064-12BC	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	14.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Thin Profile			Macrocell	2.97 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No			67 MHz		10 mm	32
PZ3128-S10BP-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	13 ns	Yes	3.6 V	CMOS				3.3		Flatpack, Thin Profile, Fine Pitch			Macrocell	3 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No			74 MHz		14 mm	80
PZ3032-8A44	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No			74 MHz		16.5862 mm	32
PZ3064-12A68	NXP Semiconductors	EE PLD	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	14.5 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 48 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J68		4.57 mm	24.2316 mm	No			67 MHz		24.2316 mm	48
PZ3128IS15BB1	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	17.5 ns	Yes	3.6 V	CMOS				3.3		Flatpack			Macrocell	3 V		.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 80 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			59 MHz		20 mm	80
PZ3032CS12A44	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	3 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	32 Macrocells		47 MHz		16.5862 mm	32
PLC18V8ZID-T	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes	5.5 V	CMOS				5		Small Outline			Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.65 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		18 MHz		12.8 mm	8
P3C18V8Z40D	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes	3.6 V	CMOS				3.3		Small Outline			Macrocell	3 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20		2.65 mm	7.5 mm	No	Programmable Output Polarity		22 MHz		12.8 mm	8
PZ3128-S12BE-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	3.6 V	CMOS				3.3		Flatpack, Low Profile, Fine Pitch			Macrocell	3 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			66 MHz		20 mm	96
M38510/50202BXA	NXP Semiconductors	OT PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic, Metal-Sealed Cofired		No	5.5 V	Bipolar	MIL-M-38510 Class B			5		In-Line			Combinatorial	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Dual	R-CDIP-T28				No						0
PZ3032-10BC-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	17 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Thin Profile			Macrocell	2.97 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No			57 MHz		10 mm	32
PZ5064N10BP-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	12.5 ns	Yes	5.5 V	CMOS				5		Flatpack, Thin Profile, Fine Pitch			Macrocell	4.5 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No	64 Macrocells		77 MHz		14 mm	64
LVT22V10-DD	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	12 ns	Yes	3.6 V	BICMOS				3.3		Small Outline			Macrocell	3 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		74 MHz		15.4 mm	10
PZ5064CS10A44	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	CMOS				5		Chip Carrier			Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	64 Macrocells		80 MHz		16.5862 mm	64
N82S105N	NXP Semiconductors	OT PLD	Commercial	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy		No		TTL		16	PLS-TYPE	5	5 V	In-Line	DIP28,.6	Programmable Logic Devices			48	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T28				No		e0	9.8 MHz	8
PLC18V8Z/BRA	NXP Semiconductors	UV PLD	Military	Through-Hole	20	WDIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	CMOS				5		In-Line, Window			Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No			25 MHz			8
PZ3064AS10BP	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	11.5 ns	Yes	3.6 V	CMOS				3.3		Flatpack, Thin Profile, Fine Pitch			Macrocell	3 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No			83 MHz		14 mm	64
PZ5064I10BB1-S	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	12.5 ns	Yes	5.5 V	CMOS				5		Flatpack			Macrocell	4.5 V		.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			77 MHz		20 mm	64
PZ3064D10A44	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	32 Macrocells		77 MHz		16.5862 mm	32
PZ5128-S12A84-T	NXP Semiconductors	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	CMOS				5		Chip Carrier			Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J84		4.57 mm	29.3116 mm	No			63 MHz		29.3116 mm	64
PZ3128DS10BP-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	12 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Thin Profile, Fine Pitch			Macrocell	2.97 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 80 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No	128 Macrocells		66 MHz		14 mm	80
PZ3032CS12BC-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	15 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Thin Profile			Macrocell	3 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	32 Macrocells		47 MHz		10 mm	32
PZ3032-8BC	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	15 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Thin Profile			Macrocell	2.97 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No			74 MHz		10 mm	32
P3C18V8ZIADH-T	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	45 ns	Yes	3.6 V	CMOS				3.3		Small Outline, Thin Profile, Shrink Pitch			Macrocell	3 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No	Programmable Output Polarity		18 MHz		6.5 mm	8
PZ3064-10A84	NXP Semiconductors	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J84		4.57 mm	29.3116 mm	No			80 MHz		29.3116 mm	64
LVT22V10-7N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	8.5 ns	No	3.6 V	BICMOS		22	PAL-TYPE	3.3	3.3 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	3 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDIP-T24		4.7 mm	7.62 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		95 MHz	10	31.7 mm	10
PZ3128-S15BP	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	17.5 ns	Yes	3.6 V	CMOS				3.3		Flatpack, Thin Profile, Fine Pitch			Macrocell	3 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No			59 MHz		14 mm	80
PZ3032-10A44-T	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	17 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No			57 MHz		16.5862 mm	32
M38510/50201BXX	NXP Semiconductors	OT PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic, Metal-Sealed Cofired		No	5.5 V	Bipolar	MIL-M-38510 Class B			5		In-Line			Combinatorial	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Dual	R-CDIP-T28				No						0
PZ3128-S12BB1-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	3.6 V	CMOS				3.3		Flatpack			Macrocell	3 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			66 MHz		20 mm	80
PZ5064N10BC-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12.5 ns	Yes	5.5 V	CMOS				5		Flatpack, Thin Profile			Macrocell	4.5 V		.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	64 Macrocells		77 MHz		10 mm	32
PLC18V8Z35D	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	35 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline	SOP20,.4	Programmable Logic Devices	Macrocell	4.75 V	74	1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20		2.65 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		21 MHz	8	12.8 mm	8
LVT22V10BBA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.6 V	BICMOS				3.3		Chip Carrier			Macrocell	3 V		1.27 mm	75 °C (167 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No	Programmable Output Polarity; Shared Input/Clock		50 MHz		11.5062 mm	10
PLHS501IA	NXP Semiconductors	OT PLD	Industrial	J Bend	52	QCCJ	Square	Plastic/Epoxy	17.5 ns	Yes	5.5 V	TTL		32	PLE-TYPE	5	5 V	Chip Carrier	LDCC52,.8SQ	Programmable Logic Devices	Combinatorial	4.5 V		1.27 mm	85 °C (185 °F)	24 Dedicated Inputs, 8 I/O	24	-40 °C (-40 °F)		Quad	S-PQCC-J52	1	4.57 mm	19.1262 mm	No			30 MHz	24	19.1262 mm	8
PZ5032CS6BC	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	8 ns	Yes	5.25 V	CMOS				5		Flatpack, Thin Profile			Macrocell	4.75 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	32 Macrocells		111 MHz		10 mm	32
PZ5032NS10BC	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12.5 ns	Yes	5.5 V	CMOS				5		Flatpack, Thin Profile			Macrocell	4.5 V		.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	32 Macrocells		59 MHz		10 mm	32
PZ5128CS12BE	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	5.25 V	CMOS				5		Flatpack, Low Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No	128 Macrocells		63 MHz		20 mm	96
PZ5064-10A84	NXP Semiconductors	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	5.25 V	CMOS				5		Chip Carrier			Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J84		4.57 mm	29.3116 mm	No			77 MHz		29.3116 mm	64
PZ3064I15A68-T	NXP Semiconductors	EE PLD	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	17.5 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 48 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J68		4.57 mm	24.2316 mm	No			58 MHz		24.2316 mm	48

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.