NXP Semiconductors Programmable Logic Devices (PLD) 886

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	Nominal Supply Voltage (V)	Package Style (Meter)	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Length	No. of I/O Lines
PZ5032-10BC	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	CMOS		5	Flatpack, Thin Profile	Macrocell	4.75 V	.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44	1.2 mm	10 mm	No			59 MHz	10 mm	32
PLQ20R8-5N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	6 ns	No	5.25 V	BICMOS		5	In-Line	Registered	4.75 V		75 °C (167 °F)	12 Dedicated Inputs, 0 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24			No	Register Preload; Power-Up Reset		118 MHz		0
PZ3064A7A44-T	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	9.5 ns	Yes	3.63 V	CMOS		3.3	Chip Carrier	Macrocell	2.97 V	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No	32 Macrocells		105 MHz	16.5862 mm	32
5962-9176008M3A	NXP Semiconductors	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	7.5 ns	Yes	5.25 V	BICMOS	MIL-STD-883 Class B	5	Chip Carrier	Macrocell	4.75 V		125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N28			No		e0	71 MHz		10
5962-9201201MLX	NXP Semiconductors	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	35 ns	No	5.5 V	Bipolar	MIL-STD-883	5	In-Line	Registered	4.5 V		125 °C (257 °F)	12 Dedicated Inputs, 0 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24			No			10.5 MHz		0
P5Z22V10-7DH-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	9 ns	Yes	5.25 V	CMOS		5	Small Outline, Thin Profile, Shrink Pitch	Macrocell	4.75 V	.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24	1.1 mm	4.4 mm	No			103 MHz	7.8 mm	10
PZ5128-S7BP-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS		5	Flatpack, Thin Profile, Fine Pitch	Macrocell	4.75 V	.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No			87 MHz	14 mm	80
PZ3064DS10BC	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	11.5 ns	Yes	3.6 V	CMOS			Flatpack, Thin Profile	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44	1.2 mm	10 mm	No			90 MHz	10 mm	32
PLQ16R8-5N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	6 ns	No	5.25 V	BICMOS		5	In-Line	Registered	4.75 V		75 °C (167 °F)	8 Dedicated Inputs, 0 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20			No	Register Preload; Power-Up Reset		118 MHz		0
PZ3032I12A44-T	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	19 ns	Yes	3.63 V	CMOS		3.3	Chip Carrier	Macrocell	2.97 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No			47 MHz	16.5862 mm	32
P3C18V8ZIADH	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	45 ns	Yes	3.6 V	CMOS		3.3	Small Outline, Thin Profile, Shrink Pitch	Macrocell	3 V	.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20	1.1 mm	4.4 mm	No	Programmable Output Polarity		18 MHz	6.5 mm	8
PL22V10I15A	NXP Semiconductors	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	CMOS		5	Chip Carrier	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Quad	S-PQCC-J28	4.57 mm	11.505 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset		50 MHz	11.505 mm	10
PZ5128IS15BE	NXP Semiconductors	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	17.5 ns	Yes	5.5 V	CMOS		5	Flatpack, Low Profile, Fine Pitch	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128	1.6 mm	14 mm	No			63 MHz	20 mm	96
PML2852-50A-T	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	CMOS		5	Chip Carrier	Mixed	4.75 V	1.27 mm	75 °C (167 °F)	29 Dedicated Inputs, 24 I/O	29	0 °C (32 °F)		Quad	S-PQCC-J84	4.57 mm	29.3116 mm	No	52 Flip Flops			29.3116 mm	24
PZ5064I10BC-S	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12.5 ns	Yes	5.5 V	CMOS		5	Flatpack, Thin Profile	Macrocell	4.5 V	.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44	1.2 mm	10 mm	No			77 MHz	10 mm	32
PZ3128-S15BB1-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	17.5 ns	Yes	3.6 V	CMOS		3.3	Flatpack	Macrocell	3 V	.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100	3.4 mm	14 mm	No			59 MHz	20 mm	80
PZ5064N10A44	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	5.5 V	CMOS		5	Chip Carrier	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No	64 Macrocells		77 MHz	16.5862 mm	32
5962-8850701LA	NXP Semiconductors	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V	Bipolar	MIL-STD-883	5	In-Line	Mixed	4.5 V		125 °C (257 °F)	8 Dedicated Inputs, 12 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24			No		e0	20 MHz		12
PZ5064-10A84-T	NXP Semiconductors	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	5.25 V	CMOS		5	Chip Carrier	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J84	4.57 mm	29.3116 mm	No			77 MHz	29.3116 mm	64
P3Z22V10-DD	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	3.6 V	CMOS		3.3	Small Outline	Macrocell	3 V	1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24	2.65 mm	7.5 mm	No			83 MHz	15.4 mm	10
P3Z22V10IBD-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V	CMOS		3.3	Small Outline	Macrocell	3 V	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDSO-G24	2.65 mm	7.5 mm	No			65 MHz	15.4 mm	10
PZ5032I10A44	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	CMOS		5	Chip Carrier	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No			59 MHz	16.5862 mm	32

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.