NXP Semiconductors Programmable Logic Devices (PLD) 886

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	JTAG Boundary Scan Test	No. of I/O Lines
PZ5064NS12BC	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	14 ns	Yes	5.5 V	CMOS				5		Flatpack, Thin Profile				Macrocell	4.5 V		.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	64 Macrocells		67 MHz		10 mm		32
PZ5064N12A44-T	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	14.5 ns	Yes	5.5 V	CMOS				5		Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	64 Macrocells		67 MHz		16.5862 mm		32
PLUS173DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	12 ns	No	5.25 V	TTL		22	PLA-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial	4.75 V	42	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 10 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24		4.7 mm	7.62 mm	No	Programmable Output Polarity			10	31.7 mm		10
PLUS20R6-7N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL				5		In-Line				Mixed	4.75 V		2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 2 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24		4.7 mm	7.62 mm	No	Power-Up Reset		74 MHz		31.7 mm		2
PZ5128CS7BP-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	9.5 ns	Yes	5.25 V	CMOS				5		Flatpack, Thin Profile, Fine Pitch				Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No	128 Macrocells		95 MHz		14 mm		80
PZ5128IS15BP-S	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	17.5 ns	Yes	5.5 V	CMOS				5		Flatpack, Thin Profile, Fine Pitch				Macrocell	4.5 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 80 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No			63 MHz		14 mm		80
PLUS20L8DA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	TTL				5		Chip Carrier				Combinatorial	4.75 V		1.27 mm	75 °C (167 °F)	14 Dedicated Inputs, 6 I/O	14	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.505 mm	No					11.505 mm		6
PZ3032DS7A44-T	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	9.5 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier				Macrocell	2.97 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	32 Macrocells		91 MHz		16.5862 mm		32
P3C18V8Z40DB	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	40 ns	Yes	3.6 V	CMOS				3.3		Small Outline, Shrink Pitch				Macrocell	3 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20		2 mm	5.3 mm	No	Programmable Output Polarity		22 MHz		7.2 mm		8
P3C18V8ZIADB	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	45 ns	Yes	3.6 V	CMOS				3.3		Small Outline, Shrink Pitch				Macrocell	3 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2 mm	5.3 mm	No	Programmable Output Polarity		18 MHz		7.2 mm		8
5962-9176014NXA	NXP Semiconductors	OT PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.25 V	BICMOS	MIL-PRF-38535			5		In-Line				Macrocell	4.75 V			85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24				No		e0	71 MHz				10
PZ5064-10A68	NXP Semiconductors	EE PLD	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	5.25 V	CMOS				5		Chip Carrier				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 48 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J68		4.57 mm	24.2316 mm	No			77 MHz		24.2316 mm		48
PLS157N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	55 ns	No	5.25 V	TTL				5		In-Line				Mixed	4.75 V		2.54 mm	75 °C (167 °F)	4 Dedicated Inputs, 12 I/O	4	0 °C (32 °F)		Dual	R-PDIP-T20		4.06 mm	7.62 mm	No	Programmable Logic Sequencer; 1 External Clock		14 MHz		26.695 mm		12
PZ3128IS15BE	NXP Semiconductors	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	17.5 ns	Yes	3.6 V	CMOS				3.3		Flatpack, Low Profile, Fine Pitch				Macrocell	3 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			59 MHz		20 mm		96
PZ5064I10A44-T	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	5.5 V	CMOS				5		Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No			77 MHz		16.5862 mm		32
5962-8768201RA	NXP Semiconductors	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	45 ns	No	5.5 V	Bipolar		18	PLA-TYPE	5		In-Line			No	Combinatorial	4.5 V	42		125 °C (257 °F)	8 Dedicated Inputs, 10 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20				No				10		No	10
PLS179N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No	5.25 V	TTL				5		In-Line				Mixed	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 12 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T24		4.7 mm	7.62 mm	No	Programmable Logic Sequencer; 1 External Clock		18.2 MHz		31.7 mm		12
PZ3064-10A84-T	NXP Semiconductors	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier				Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J84		4.57 mm	29.3116 mm	No			80 MHz		29.3116 mm		64
PLS105AN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	30 ns	No	5.25 V	TTL				5		In-Line				Registered	4.75 V		2.54 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Dual	R-PDIP-T28		5.08 mm	15.24 mm	No	Programmable Logic Sequencer; 1 External Clock		12.5 MHz		36.51 mm		0
82S105/B3A-T	NXP Semiconductors	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	40 ns	Yes	5.5 V	TTL				5		Chip Carrier				Registered	4.5 V			125 °C (257 °F)	15 Dedicated Inputs, 0 I/O	15	-55 °C (-67 °F)		Quad	S-CQCC-N28				No			10.5 MHz				0
P3Z22V10-DD-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	3.6 V	CMOS				3.3		Small Outline				Macrocell	3 V		1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No			83 MHz		15.4 mm		10
PZ5064NS10BP	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	12 ns	Yes	5.5 V	CMOS				5		Flatpack, Thin Profile, Fine Pitch				Macrocell	4.5 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No	64 Macrocells		77 MHz		14 mm		64
PZ5128IS15BB1-S	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	17.5 ns	Yes	5.5 V	CMOS				5		Flatpack				Macrocell	4.5 V		.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 80 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			63 MHz		20 mm		80
PL22V10-12D	NXP Semiconductors	EE PLD	Commercial Extended	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	12 ns	Yes	5.25 V	CMOS				5		Small Outline				Macrocell	4.75 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset		58.8 MHz		15.4 mm		10
PZ3128IS12A84	NXP Semiconductors	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	14.5 ns	Yes	3.6 V	CMOS				3.3		Chip Carrier				Macrocell	3 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J84		4.57 mm	29.3116 mm	No			66 MHz		29.3116 mm		64
PZ3128AS12BP	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	14.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Thin Profile, Fine Pitch				Macrocell	2.97 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No	128 Macrocells		63 MHz		14 mm		80
PZ3128-S12BE-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	3.6 V	CMOS				3.3		Flatpack, Low Profile, Fine Pitch				Macrocell	3 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			66 MHz		20 mm		96
PZ3032-12A44	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	19 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier				Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No			47 MHz		16.5862 mm		32
PLC18V8Z35DH	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	35 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.75 V	74	.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Nickel Palladium Gold	Dual	R-PDSO-G20		1.1 mm	4.4 mm	No		e4	21 MHz	8	6.5 mm		8
PLUS405/BXA	NXP Semiconductors	OT PLD		Through-Hole	28	DIP	Rectangular	Ceramic, Metal-Sealed Cofired		No		Bipolar						In-Line									16 Dedicated Inputs	16			Dual	R-CDIP-T28				No			30 MHz
P5Z22V10-DA	NXP Semiconductors	EE PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS				5		Chip Carrier				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No			83 MHz		11.5062 mm		10
PLUS16L8DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL				5		In-Line				Combinatorial	4.75 V		2.54 mm	75 °C (167 °F)	10 Dedicated Inputs, 6 I/O	10	0 °C (32 °F)		Dual	R-PDIP-T20		4.06 mm	7.62 mm	No					26.695 mm		6
PLC42VA12FA	NXP Semiconductors	UV PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	55 ns	No	5.25 V	CMOS		42	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	105	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 12 I/O	8	0 °C (32 °F)		Dual	R-GDIP-T24	1			No	Programmable Multi-Function Pld; 1 External Clock; Shared Input/Clock; Register Preload		14.9 MHz	12			12
PZ5064C7BC-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	9.5 ns	Yes	5.25 V	CMOS				5		Flatpack, Thin Profile				Macrocell	4.75 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	64 Macrocells		105 MHz		10 mm		32
PLUS20R6DA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	TTL				5		Chip Carrier				Mixed	4.75 V		1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 2 I/O	12	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.505 mm	No	Power-Up Reset		60.6 MHz		11.505 mm		2
PZ3032-8BC-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	15 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Thin Profile				Macrocell	2.97 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No			74 MHz		10 mm		32
P5Z22V10IDDH-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	11 ns	Yes	5.5 V	CMOS				5		Small Outline, Thin Profile, Shrink Pitch				Macrocell	4.5 V		.65 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDSO-G24		1.1 mm	4.4 mm	No			74 MHz		7.8 mm		10
5962-8850402LX	NXP Semiconductors	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V	Bipolar	MIL-STD-883			5		In-Line				Combinatorial	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 10 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24				No							10
PZ5128IS10BE	NXP Semiconductors	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V	CMOS				5		Flatpack, Low Profile, Fine Pitch				Macrocell	4.5 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			66 MHz		20 mm		96
PLQ20R4-5N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	BICMOS				5		In-Line				Mixed	4.75 V			75 °C (167 °F)	12 Dedicated Inputs, 4 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24				No	Register Preload; Power-Up Reset		118 MHz				4
PZ5064C7A44-T	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	9.5 ns	Yes	5.25 V	CMOS				5		Chip Carrier				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	64 Macrocells		105 MHz		16.5862 mm		32
PZ5064I12A68	NXP Semiconductors	EE PLD	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	14.5 ns	Yes	5.5 V	CMOS				5		Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 48 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J68		4.57 mm	24.2316 mm	No			67 MHz		24.2316 mm		48
P3Q22V10-7D	NXP Semiconductors	OT PLD		Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	3.6 V	BICMOS				3.3		Small Outline				Macrocell	3 V		1.27 mm		11 Dedicated Inputs, 10 I/O	11			Dual	R-PDSO-G24		2.65 mm	7.5 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock 5 V compatible inputs & I/O; Register preload		105 MHz		15.4 mm		10
PZ5128-S7BE-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS				5		Flatpack, Low Profile, Fine Pitch				Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			87 MHz		20 mm		96
PZ3064DS12BP	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	13.5 ns	Yes	3.6 V	CMOS						Flatpack, Thin Profile, Fine Pitch				Macrocell	2.7 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No			77 MHz		14 mm		64
PZ5128-S12BB2-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	CMOS				5		Flatpack				Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G160		4.07 mm	28 mm	No			63 MHz		28 mm		96
PZ5064C7BC	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	9.5 ns	Yes	5.25 V	CMOS				5		Flatpack, Thin Profile				Macrocell	4.75 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	64 Macrocells		105 MHz		10 mm		32
PLC18V8ZZID	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes	5.5 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline	SOP20,.4	Programmable Logic Devices		Macrocell	4.5 V	74	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.65 mm	7.5 mm	No	8 Macrocell; Power Up Reset; Shared Input/Clock		18 MHz	8	12.8 mm		8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.