NXP Semiconductors Programmable Logic Devices (PLD) 886

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	No. of I/O Lines
PZ3064-12BC-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	14.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Thin Profile			Macrocell	2.97 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44	1.2 mm	10 mm	No			67 MHz		10 mm	32
PLC42VA12IN	NXP Semiconductors	OT PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	55 ns	No	5.5 V	CMOS				5		In-Line			Macrocell	4.5 V			85 °C (185 °F)	8 Dedicated Inputs, 12 I/O	8	-40 °C (-40 °F)		Dual	R-PDIP-T24			No	Programmable Multi-Function Pld; Register Preload; Shared Input/Clock		14.9 MHz			12
PLUS16R6-7A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	TTL				5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 2 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	Power-Up Reset		74 MHz		8.965 mm	2
PZ3064A10BP-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Thin Profile, Fine Pitch			Macrocell	2.97 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No	64 Macrocells		77 MHz		14 mm	64
PZ3032AS6A44-T	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	8 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No	32 Macrocells		111 MHz		16.5862 mm	32
PZ5128NS10BE-S	NXP Semiconductors	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	12 ns	Yes	5.5 V	CMOS				5		Flatpack, Low Profile, Fine Pitch			Macrocell	4.5 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128	1.6 mm	14 mm	No	128 Macrocells		66 MHz		20 mm	96
82S101/BYA	NXP Semiconductors	OT PLD	Military	Flat	28	DFP	Rectangular	Ceramic, Metal-Sealed Cofired	80 ns	Yes	5.5 V	TTL				5		Flatpack			Combinatorial	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Dual	R-CDFP-F28			No						0
PZ5128NS10BP-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	12 ns	Yes	5.5 V	CMOS				5		Flatpack, Thin Profile, Fine Pitch			Macrocell	4.5 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 80 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No	128 Macrocells		66 MHz		14 mm	80
PHD16N8-5A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	TTL				5		Chip Carrier			Combinatorial	4.75 V		1.27 mm	75 °C (167 °F)	10 Dedicated Inputs, 6 I/O	10	0 °C (32 °F)		Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	High Speed Decoder				8.965 mm	6
P5Z22V10IDA-T	NXP Semiconductors	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	11 ns	Yes	5.5 V	CMOS				5		Chip Carrier			Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No			74 MHz		11.5062 mm	10
PZ3128DS10BE-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	12 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Low Profile, Fine Pitch			Macrocell	2.97 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128	1.6 mm	14 mm	No	128 Macrocells		66 MHz		20 mm	96
PLC18V8Z35FA	NXP Semiconductors	UV PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	35 ns	No	5.25 V	CMOS				5		In-Line			Macrocell	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-GDIP-T20	5.08 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		21 MHz		24.305 mm	8
P3Q16V8-7N	NXP Semiconductors	OT PLD		Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	3.6 V	BICMOS				3.3		In-Line			Macrocell	3 V		2.54 mm		8 Dedicated Inputs, 9 I/O	8			Dual	R-PDIP-T20	4.06 mm	7.62 mm	No	8 Macrocells; 1 External Clock; 5 V compatile Inputs & I/O; Register Preload; Power-up reset		105 MHz		26.695 mm	9
PZ5032I7BC-S	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12 ns	Yes	5.5 V	CMOS				5		Flatpack, Thin Profile			Macrocell	4.5 V		.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44	1.2 mm	10 mm	No			91 MHz		10 mm	32
PLUS173BA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	TTL		22	PLA-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Combinatorial	4.75 V	42	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 10 I/O	12	0 °C (32 °F)		Quad	S-PQCC-J28	4.57 mm	11.505 mm	No	Programmable Output Polarity			10	11.505 mm	10
LVT22V10-DD-T	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	12 ns	Yes	3.6 V	BICMOS				3.3		Small Outline			Macrocell	3 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24	2.65 mm	7.5 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		74 MHz		15.4 mm	10
PLUS16R4DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL				5		In-Line			Mixed	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 4 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20	4.06 mm	7.62 mm	No	Power-Up Reset		60.6 MHz		26.695 mm	4
PLC18V8Z25D	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.25 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline	SOP20,.4	Programmable Logic Devices	Macrocell	4.75 V	74	1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20	2.65 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		30 MHz	8	12.8 mm	8
LVT20V8-7N	NXP Semiconductors	OT PLD		Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	3.6 V	BICMOS				3.3		In-Line			Macrocell	3 V		2.54 mm		12 Dedicated Inputs, 8 I/O	12			Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock		110 MHz		31.7 mm	8
PZ3064-12A84	NXP Semiconductors	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	14.5 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J84	4.57 mm	29.3116 mm	No			67 MHz		29.3116 mm	64
P3Q20V8-7N	NXP Semiconductors	OT PLD		Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	3.6 V	BICMOS				3.3		In-Line			Macrocell	3 V		2.54 mm		12 Dedicated Inputs, 9 I/O	12			Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	8 Macrocells; 1 External Clock; 5 V compatile Inputs & I/O; Register Preload; Power-up reset		105 MHz		31.7 mm	9
PZ5032I10A44-T	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	CMOS				5		Chip Carrier			Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No			59 MHz		16.5862 mm	32
PZ5064I12A84-T	NXP Semiconductors	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	14.5 ns	Yes	5.5 V	CMOS				5		Chip Carrier			Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J84	4.57 mm	29.3116 mm	No			67 MHz		29.3116 mm	64
PZ5128-S12BB1-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	CMOS				5		Flatpack			Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100	3.4 mm	14 mm	No			63 MHz		20 mm	80
PZ3960N8EB	NXP Semiconductors	Loadable PLD	Industrial	Ball	492	BGA	Square	Plastic/Epoxy	9.5 ns	Yes	3.63 V	CMOS				3.3		Grid Array			Macrocell	2.97 V		1.27 mm	85 °C (185 °F)	1 Dedicated Inputs, 384 I/O	1	-40 °C (-40 °F)		Bottom	S-PBGA-B492	2.54 mm	35 mm	No	960 Macrocells		91 MHz		35 mm	384
PLUS153BA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	TTL		18	PLA-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Combinatorial	4.75 V	42	1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 10 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	Programmable Output Polarity			10	8.965 mm	10
PLUS20L8-7N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL				5		In-Line			Combinatorial	4.75 V		2.54 mm	75 °C (167 °F)	14 Dedicated Inputs, 6 I/O	14	0 °C (32 °F)		Dual	R-PDIP-T24	4.7 mm	7.62 mm	No					31.7 mm	6
5962-9176007MLX	NXP Semiconductors	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V	BICMOS	MIL-STD-883			5		In-Line			Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDIP-T24	5.08 mm	7.62 mm	No			55 MHz			10
5962-8850402LA	NXP Semiconductors	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V	Bipolar	MIL-STD-883			5		In-Line			Combinatorial	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 10 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24			No		e0				10
PZ3032AS7A44-T	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No	32 Macrocells		80 MHz		16.5862 mm	32
PZ5128-S10BB1-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	12 ns	Yes	5.25 V	CMOS				5		Flatpack			Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100	3.4 mm	14 mm	No			71 MHz		20 mm	80
PZ3128-S10BP-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	13 ns	Yes	3.6 V	CMOS				3.3		Flatpack, Thin Profile, Fine Pitch			Macrocell	3 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No			74 MHz		14 mm	80
PZ3064I12A84	NXP Semiconductors	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	14.5 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J84	4.57 mm	29.3116 mm	No			67 MHz		29.3116 mm	64
PZ3128AS10BP	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	12 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Thin Profile, Fine Pitch			Macrocell	2.97 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No	128 Macrocells		71 MHz		14 mm	80
PLC18V8ZIAA	NXP Semiconductors	OT PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.5 V	CMOS		18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Macrocell	4.5 V	74	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		30 MHz	8	8.965 mm	8
5962-8984102LX	NXP Semiconductors	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V	CMOS				5		In-Line			Macrocell	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDIP-T24			No			31.2 MHz			10
PLQ22V10-7A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	9 ns	Yes	5.25 V	BICMOS				5		Chip Carrier			Macrocell	4.75 V			75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28			No	PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock		87 MHz			10
PZ3064-12BB1	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack			Macrocell	2.97 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100	3.4 mm	14 mm	No			67 MHz		20 mm	64
P3C18V8ZIAN	NXP Semiconductors	OT PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	45 ns	No	3.6 V	CMOS				3.3		In-Line			Macrocell	3 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDIP-T20	4.2 mm	7.62 mm	No	Programmable Output Polarity		18 MHz		26.73 mm	8
PZ5128NS15BP-S	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	17.5 ns	Yes	5.5 V	CMOS				5		Flatpack, Thin Profile, Fine Pitch			Macrocell	4.5 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 80 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No	128 Macrocells		63 MHz		14 mm	80
PZ3032I10A44-T	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	16 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No			58.8 MHz		16.5862 mm	32
5962-9176011NXX	NXP Semiconductors	OT PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	BICMOS	MIL-PRF-38535			5		In-Line			Macrocell	4.75 V			85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	55 MHz			10
PZ5032I7BC-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12 ns	Yes	5.5 V	CMOS				5		Flatpack, Thin Profile			Macrocell	4.5 V		.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44	1.2 mm	10 mm	No			91 MHz		10 mm	32
PZ5128CS12BP	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	14.5 ns	Yes	5.25 V	CMOS				5		Flatpack, Thin Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No	128 Macrocells		63 MHz		14 mm	80
LVT16V8-7N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	9 ns	No	3.6 V	BICMOS				3.3		In-Line			Macrocell	3 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20	4.2 mm	7.62 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		91 MHz		26.73 mm	8
PLHS18P8A/B2A	NXP Semiconductors	OT PLD		No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes								Chip Carrier								10 Dedicated Inputs, 8 I/O	10			Quad	S-CQCC-N20			No						8
P5Z22V10-7D	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	9 ns	Yes	5.25 V	CMOS				5		Small Outline			Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24	2.65 mm	7.5 mm	No			103 MHz		15.4 mm	10
PZ3064-12A68-T	NXP Semiconductors	EE PLD	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	14.5 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 48 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J68	4.57 mm	24.2316 mm	No			67 MHz		24.2316 mm	48

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.