NXP Semiconductors Programmable Logic Devices (PLD) 886

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	No. of I/O Lines
PZ3128IS12BE-S	NXP Semiconductors	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	3.6 V	CMOS				3.3		Flatpack, Low Profile, Fine Pitch			Macrocell	3 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			66 MHz		20 mm	96
PLC18V8ZIDB-T	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	40 ns	Yes	5.5 V	CMOS				5		Small Outline, Shrink Pitch			Macrocell	4.5 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2 mm	5.3 mm	No			18 MHz		7.2 mm	8
PZ5032CS10A44-T	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	5.25 V	CMOS				5		Chip Carrier			Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	32 Macrocells		59 MHz		16.5862 mm	32
5962-9176007M3X	NXP Semiconductors	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.25 V	BICMOS	MIL-STD-883 Class B			5		Chip Carrier			Macrocell	4.75 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-N28				No		e0	55 MHz			10
PHD48N22-7A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	68	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	TTL				5		Chip Carrier			Combinatorial	4.75 V		1.27 mm	75 °C (167 °F)	36 Dedicated Inputs, 12 I/O	36	0 °C (32 °F)		Quad	S-PQCC-J68		4.57 mm	24.23 mm	No	High Speed Decoder				24.23 mm	12
LVT16V8-7A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	9 ns	Yes	3.6 V	BICMOS				3.3		Chip Carrier			Macrocell	3 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J20		4.57 mm	8.9662 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		91 MHz		8.9662 mm	8
PLC18V8Z35D-T	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	35 ns	Yes	5.25 V	CMOS				5		Small Outline			Macrocell	4.75 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20		2.65 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		21 MHz		12.8 mm	8
PZ3032AS7A44	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	32 Macrocells		80 MHz		16.5862 mm	32
PZ5128CS10BP	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	CMOS				5		Flatpack, Thin Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No	128 Macrocells		71 MHz		14 mm	80
LVT16V8-6A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	7 ns	Yes	3.6 V	BICMOS				3.3		Chip Carrier			Macrocell	3 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J20		4.57 mm	8.9662 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		111 MHz		8.9662 mm	8
PLUS20R6-7A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	TTL				5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 2 I/O	12	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.505 mm	No	Power-Up Reset		74 MHz		11.505 mm	2
P5Z22V10-DDH	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS				5		Small Outline, Thin Profile, Shrink Pitch			Macrocell	4.75 V		.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		1.1 mm	4.4 mm	No			83 MHz		7.8 mm	10
PLQ16R6-5N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	BICMOS				5		In-Line			Mixed	4.75 V			75 °C (167 °F)	8 Dedicated Inputs, 2 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20				No	Register Preload; Power-Up Reset		118 MHz			2
PZ5032NS7A44	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	9.5 ns	Yes	5.5 V	CMOS				5		Chip Carrier			Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	32 Macrocells		91 MHz		16.5862 mm	32
PZ3032DS10BC-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Thin Profile			Macrocell	2.97 V		.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	32 Macrocells		59 MHz		10 mm	32
PLC18V8Z/BRA(OT)	NXP Semiconductors	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	CMOS				5		In-Line			Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No			25 MHz			8
PLC42VA12A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	55 ns	Yes	5.25 V	CMOS		42	PLS-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Macrocell	4.75 V	105	1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 12 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J28	1	4.57 mm	11.505 mm	No	Programmable Multi-Function Pld; 1 External Clock; Shared Input/Clock; Register Preload		14.9 MHz	12	11.505 mm	12
PZ3064D10BP-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Thin Profile, Fine Pitch			Macrocell	2.97 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No	64 Macrocells		77 MHz		14 mm	64
PLUS405-37A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	TTL		16	PLS-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Registered	4.75 V	64	1.27 mm	75 °C (167 °F)	15 Dedicated Inputs, 8 I/O	15	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No	Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock		25 MHz	8	11.5062 mm	8
PLUS20R6DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL				5		In-Line			Mixed	4.75 V		2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 2 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24		4.7 mm	7.62 mm	No	Power-Up Reset		60.6 MHz		31.7 mm	2
PLQ22V10-7N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	9 ns	No	5.25 V	BICMOS				5		In-Line			Macrocell	4.75 V			75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDIP-T24				No	PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock		87 MHz			10
PZ3032NS12A44	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	3 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	32 Macrocells		47 MHz		16.5862 mm	32
PZ5064N10A84	NXP Semiconductors	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	5.5 V	CMOS				5		Chip Carrier			Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J84		4.57 mm	29.3116 mm	No	64 Macrocell; In-System Programmable		77 MHz		29.3116 mm	64
PZ3128IS12BE	NXP Semiconductors	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	3.6 V	CMOS				3.3		Flatpack, Low Profile, Fine Pitch			Macrocell	3 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			66 MHz		20 mm	96
5962-8984105LX	NXP Semiconductors	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V	CMOS				5		In-Line			Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDIP-T24		5.08 mm	7.62 mm	No			50 MHz			10
PZ5032CS6A44	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	8 ns	Yes	5.25 V	CMOS				5		Chip Carrier			Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	32 Macrocells		111 MHz		16.5862 mm	32
LVT22V10BBA-T	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.6 V	BICMOS				3.3		Chip Carrier			Macrocell	3 V		1.27 mm	75 °C (167 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No	Programmable Output Polarity; Shared Input/Clock		50 MHz		11.5062 mm	10
PZ5128-S12BB1	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	CMOS				5		Flatpack			Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No			63 MHz		20 mm	80
PL22V10-10N	NXP Semiconductors	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	CMOS				5		In-Line			Macrocell	4.75 V		2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDIP-T24		4.7 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset		66.6 MHz		31.7 mm	10
P3C18V8Z35FA	NXP Semiconductors	UV PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	45 ns	No	3.6 V	CMOS				3.3		In-Line			Macrocell	2.7 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		21 MHz		24.305 mm	8
5962-86709013X	NXP Semiconductors	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	35 ns	Yes	5.5 V	Bipolar	MIL-STD-883			5		Chip Carrier			Registered	4.5 V			125 °C (257 °F)	15 Dedicated Inputs, 0 I/O	15	-55 °C (-67 °F)		Quad	S-CQCC-N28				No						0
5962-8984101LX	NXP Semiconductors	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	CMOS				5		In-Line			Macrocell	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDIP-T24				No			22 MHz			10
PZ5128-S12BP-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	CMOS				5		Flatpack, Thin Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100		1.2 mm	14 mm	No			63 MHz		14 mm	80
PZ3032CS8BC-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Thin Profile			Macrocell	3 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No	32 Macrocells		91 MHz		10 mm	32
PZ3960C7EB-S	NXP Semiconductors	Loadable PLD	Commercial	Ball	492	BGA	Square	Plastic/Epoxy	9 ns	Yes	3.63 V	CMOS				3.3		Grid Array			Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	1 Dedicated Inputs, 384 I/O	1	0 °C (32 °F)		Bottom	S-PBGA-B492		2.54 mm	35 mm	No	960 Macrocells		100 MHz		35 mm	384
LVT22V10B7A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	BICMOS		22	PAL-TYPE	3.3	3.3 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Macrocell	3 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No	Programmable Output Polarity		95 MHz	10	11.5062 mm	10
PZ5064I10A68	NXP Semiconductors	EE PLD	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	5.5 V	CMOS				5		Chip Carrier			Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 48 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J68		4.57 mm	24.2316 mm	No			77 MHz		24.2316 mm	48
PZ3128-S10A84	NXP Semiconductors	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	13 ns	Yes	3.6 V	CMOS				3.3		Chip Carrier			Macrocell	3 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J84		4.57 mm	29.3116 mm	No			74 MHz		29.3116 mm	64
PZ3064I15BC-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	17.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Thin Profile			Macrocell	2.97 V		.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No			58 MHz		10 mm	32
PLUS20L8-7A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	TTL				5		Chip Carrier			Combinatorial	4.75 V		1.27 mm	75 °C (167 °F)	14 Dedicated Inputs, 6 I/O	14	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.505 mm	No					11.505 mm	6
PLS155N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	55 ns	No	5.25 V	TTL				5		In-Line			Mixed	4.75 V			75 °C (167 °F)	4 Dedicated Inputs, 12 I/O	4	0 °C (32 °F)		Dual	R-PDIP-T20				No	Programmable Logic Sequencer; 1 External Clock		14 MHz			12
PL22V10-10D	NXP Semiconductors	EE PLD	Commercial Extended	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS				5		Small Outline			Macrocell	4.75 V		1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset		66.6 MHz		15.4 mm	10
PZ5064-7BC-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS				5		Flatpack, Thin Profile			Macrocell	4.75 V		.8 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No			105 MHz		10 mm	32
PZ5128IS10A84-T	NXP Semiconductors	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	CMOS				5		Chip Carrier			Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J84		4.57 mm	29.3116 mm	No			66 MHz		29.3116 mm	64
PLS159AA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	35 ns	Yes	5.25 V	TTL		16	PLS-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices	Mixed	4.75 V	45	1.27 mm	75 °C (167 °F)	4 Dedicated Inputs, 12 I/O	4	0 °C (32 °F)		Quad	S-PQCC-J20		4.57 mm	8.965 mm	No	Programmable Logic Sequencer; 1 External Clock		18 MHz	12	8.965 mm	12
10H20EV8-4F	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	4.7 ns	No		ECL		20	PAL-TYPE		-5.2 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		90	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 8 I/O	11	0 °C (32 °F)		Dual	R-GDIP-T24	1	5.08 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset		204 MHz	8	31.955 mm	8
PZ5064I10BC-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12.5 ns	Yes	5.5 V	CMOS				5		Flatpack, Thin Profile			Macrocell	4.5 V		.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No			77 MHz		10 mm	32
PML2552-50KA-T	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	68	QCCJ	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	CMOS				5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	9 Dedicated Inputs, 24 I/O	9	0 °C (32 °F)		Quad	S-CQCC-J68		4.83 mm	24.065 mm	No			35 MHz		24.065 mm	24

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.