NXP Semiconductors Programmable Logic Devices (PLD) 886

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	No. of I/O Lines
PZ3032-10A44	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	17 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No			57 MHz		16.5862 mm	32
PZ3064-10A44-T	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No			80 MHz		16.5862 mm	32
PZ5128-S7BBP	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	9.5 ns	Yes	5.25 V	CMOS				5		Flatpack, Thin Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No	128 Macrocells		95 MHz		14 mm	96
PLUS16R4-7N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL				5		In-Line			Mixed	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 4 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20	4.06 mm	7.62 mm	No	Power-Up Reset		74 MHz		26.695 mm	4
PZ3064D10BP	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Thin Profile, Fine Pitch			Macrocell	2.97 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No	64 Macrocells		77 MHz		14 mm	64
PML2852-50A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	CMOS				5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	29 Dedicated Inputs, 24 I/O	29	0 °C (32 °F)		Quad	S-PQCC-J84	4.57 mm	29.3116 mm	No	52 Flip Flops				29.3116 mm	24
PLQ20R6-5N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	BICMOS				5		In-Line			Mixed	4.75 V			75 °C (167 °F)	12 Dedicated Inputs, 2 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24			No	Register Preload; Power-Up Reset		118 MHz			2
PZ5064-7BB1-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS				5		Flatpack			Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100	3.4 mm	14 mm	No			105 MHz		20 mm	64
PLC18V8ZIFA	NXP Semiconductors	UV PLD	Industrial	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V	CMOS				5		In-Line			Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-GDIP-T20	5.08 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		18 MHz		24.305 mm	8
5962-8670901XA	NXP Semiconductors	OT PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed	35 ns	No	5.5 V	Bipolar	MIL-STD-883			5		In-Line			Registered	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T28			No		e0				0
PLUS16R8-7N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	TTL				5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 0 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20	4.06 mm	7.62 mm	No	Power-Up Reset		74 MHz		26.695 mm	0
PLS168AA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	30 ns	Yes	5.25 V	TTL				5		Chip Carrier			Registered	4.75 V		1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 0 I/O	12	0 °C (32 °F)		Quad	S-PQCC-J28	4.57 mm	11.505 mm	No	Programmable Logic Sequencer; 1 External Clock		12.5 MHz		11.505 mm	0
PLS179A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	35 ns	Yes	5.25 V	TTL				5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 12 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J28	4.57 mm	11.505 mm	No	Programmable Logic Sequencer; 1 External Clock		18.2 MHz		11.505 mm	12
PLC18V8Z35DB-T	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	35 ns	Yes	5.25 V	CMOS				5		Small Outline, Shrink Pitch			Macrocell	4.75 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20	2 mm	5.3 mm	No			21 MHz		7.2 mm	8
PLUS405-55N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	TTL				5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	15 Dedicated Inputs, 0 I/O	15	0 °C (32 °F)		Dual	R-PDIP-T28	5.08 mm	15.24 mm	No	Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock		38.5 MHz		36.51 mm	0
PZ3032DS7A44	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	9.5 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No	32 Macrocells		91 MHz		16.5862 mm	32
5962-8768201RX	NXP Semiconductors	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Metal-Sealed Cofired	45 ns	No	5.5 V	Bipolar	MIL-STD-883			5		In-Line			Combinatorial	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 10 I/O	8	-55 °C (-67 °F)		Dual	R-CDIP-T20			No						10
PZ3032AS10A44	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No	32 Macrocells		59 MHz		16.5862 mm	32
PZ3032CS12A44-T	NXP Semiconductors	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	3 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No	32 Macrocells		47 MHz		16.5862 mm	32
LVT20V8-7D	NXP Semiconductors	OT PLD		Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	3.6 V	BICMOS				3.3		Small Outline			Macrocell	3 V		1.27 mm		12 Dedicated Inputs, 8 I/O	12			Dual	R-PDSO-G24	2.65 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock		110 MHz		15.4 mm	8
82S101/B3A-T	NXP Semiconductors	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	80 ns	Yes	5.5 V	TTL				5		Chip Carrier			Combinatorial	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Quad	S-CQCC-N28			No						0
PZ3064-10BB1	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	12.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack			Macrocell	2.97 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100	3.4 mm	14 mm	No			80 MHz		20 mm	64
P5Z22V10-DD	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS				5		Small Outline			Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24	2.65 mm	7.5 mm	No			83 MHz		15.4 mm	10
PZ3128IS12BE-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	3.6 V	CMOS				3.3		Flatpack, Low Profile, Fine Pitch			Macrocell	3 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128	1.6 mm	14 mm	No			66 MHz		20 mm	96
PZ5128IS10BP	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	CMOS				5		Flatpack, Thin Profile, Fine Pitch			Macrocell	4.5 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 80 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No			66 MHz		14 mm	80
PZ5128CS7BP	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	9.5 ns	Yes	5.25 V	CMOS				5		Flatpack, Thin Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No	128 Macrocells		95 MHz		14 mm	80
82S100/B3A-T	NXP Semiconductors	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	80 ns	Yes	5.5 V	TTL				5		Chip Carrier			Combinatorial	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Quad	S-CQCC-N28			No						0
PLUS16R4-7A	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	TTL				5		Chip Carrier			Mixed	4.75 V		1.27 mm	75 °C (167 °F)	8 Dedicated Inputs, 4 I/O	8	0 °C (32 °F)		Quad	S-PQCC-J20	4.57 mm	8.965 mm	No	Power-Up Reset		74 MHz		8.965 mm	4
PZ5128-S12BE-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	CMOS				5		Flatpack, Low Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128	1.6 mm	14 mm	No			63 MHz		20 mm	96
PZ3064AS7BP	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	9 ns	Yes	3.6 V	CMOS				3.3		Flatpack, Thin Profile, Fine Pitch			Macrocell	3 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No			111 MHz		14 mm	64
PLUS173DA	NXP Semiconductors	OT PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	5.25 V	TTL		22	PLA-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices	Combinatorial	4.75 V	42	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 10 I/O	12	0 °C (32 °F)		Quad	S-PQCC-J28	4.57 mm	11.505 mm	No	Programmable Output Polarity			10	11.505 mm	10
PZ3064-12BB1-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	14.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack			Macrocell	2.97 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G100	3.4 mm	14 mm	No			67 MHz		20 mm	64
PZ5128-S12BE	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	CMOS				5		Flatpack, Low Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128	1.6 mm	14 mm	No			63 MHz		20 mm	96
PZ5128-S12BP-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	15 ns	Yes	5.25 V	CMOS				5		Flatpack, Thin Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No			63 MHz		14 mm	80
PZ5032I10BC-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	CMOS				5		Flatpack, Thin Profile			Macrocell	4.5 V		.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44	1.2 mm	10 mm	No			59 MHz		10 mm	32
PZ3064I15BB1-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	17.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack			Macrocell	2.97 V		.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G100	3.4 mm	14 mm	No			58 MHz		20 mm	64
P5Z22V10-DD-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS				5		Small Outline			Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24	2.65 mm	7.5 mm	No			83 MHz		15.4 mm	10
PLC18V8ZIADH	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V	CMOS		18	PAL-TYPE	5	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices	Macrocell	4.5 V	74	.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20	1.1 mm	4.4 mm	No	8 Macrocell; Power Up Reset; Shared Input/Clock		30 MHz	8	6.5 mm	8
PLC18V8Z25DB-T	NXP Semiconductors	OT PLD	Commercial Extended	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.25 V	CMOS				5		Small Outline, Shrink Pitch			Macrocell	4.75 V		.65 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDSO-G20	2 mm	5.3 mm	No	8 Macrocell; Power Up Reset; Shared Input/Clock		30 MHz		7.2 mm	8
PZ5128-S7BP-S	NXP Semiconductors	EE PLD	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS				5		Flatpack, Thin Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 80 I/O	2	0 °C (32 °F)		Quad	S-PQFP-G100	1.2 mm	14 mm	No			87 MHz		14 mm	80
PZ3032DS7BC	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	9.5 ns	Yes	3.63 V	CMOS				3.3		Flatpack, Thin Profile			Macrocell	2.97 V		.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44	1.2 mm	10 mm	No	32 Macrocells		91 MHz		10 mm	32
PZ5064I10BB1-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	12.5 ns	Yes	5.5 V	CMOS				5		Flatpack			Macrocell	4.5 V		.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G100	3.4 mm	14 mm	No			77 MHz		20 mm	64
PZ5064NS12A44	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	14 ns	Yes	5.5 V	CMOS				5		Chip Carrier			Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No	64 Macrocells		67 MHz		16.5862 mm	32
P3C18V8ZIADB-T	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	SSOP	Rectangular	Plastic/Epoxy	45 ns	Yes	3.6 V	CMOS				3.3		Small Outline, Shrink Pitch			Macrocell	3 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20	2 mm	5.3 mm	No	Programmable Output Polarity		18 MHz		7.2 mm	8
P3Z22V10-DA	NXP Semiconductors	EE PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	CMOS				3.3		Chip Carrier			Macrocell	3 V		1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28	4.57 mm	11.5062 mm	No			83 MHz		11.5062 mm	10
PZ3064I12A44	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	14.5 ns	Yes	3.63 V	CMOS				3.3		Chip Carrier			Macrocell	2.97 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44	4.57 mm	16.5862 mm	No			67 MHz		16.5862 mm	32
PZ5128-S10BE-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	12 ns	Yes	5.25 V	CMOS				5		Flatpack, Low Profile, Fine Pitch			Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 96 I/O	2	0 °C (32 °F)		Quad	R-PQFP-G128	1.6 mm	14 mm	No			71 MHz		20 mm	96
PLC18V8ZIN	NXP Semiconductors	OT PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	40 ns	No	5.5 V	CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.5 V	74	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDIP-T20	4.2 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		18 MHz	8	26.73 mm	8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.