NXP Semiconductors Programmable Logic Devices (PLD) 886

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

PLS159AN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

35 ns

No

5.25 V

TTL

5

In-Line

Mixed

4.75 V

75 °C (167 °F)

4 Dedicated Inputs, 12 I/O

4

0 °C (32 °F)

Dual

R-PDIP-T20

No

Programmable Logic Sequencer; 1 External Clock

18 MHz

12

PLS167AA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

30 ns

Yes

5.25 V

TTL

5

Chip Carrier

Registered

4.75 V

1.27 mm

75 °C (167 °F)

14 Dedicated Inputs, 0 I/O

14

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Programmable Logic Sequencer; 1 External Clock

12.5 MHz

11.505 mm

0

PZ5128IS15BB2-T

NXP Semiconductors

EE PLD

Industrial

Gull Wing

160

QFP

Square

Plastic/Epoxy

17.5 ns

Yes

5.5 V

CMOS

5

Flatpack

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

2 Dedicated Inputs, 96 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G160

4.07 mm

28 mm

No

63 MHz

28 mm

96

PLQ20R4-5A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

8 ns

Yes

5.25 V

BICMOS

5

Chip Carrier

Mixed

4.75 V

75 °C (167 °F)

12 Dedicated Inputs, 4 I/O

12

0 °C (32 °F)

Quad

S-PQCC-J28

No

Register Preload; Power-Up Reset

118 MHz

4

PZ3032AS7BC

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

10 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

2.97 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

32 Macrocells

80 MHz

10 mm

32

PLUS16L8-7A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

TTL

5

Chip Carrier

Combinatorial

4.75 V

1.27 mm

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

8.965 mm

6

PZ3064A7A44

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

9.5 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

32 Macrocells

105 MHz

16.5862 mm

32

PZ3032AS6BC

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

8 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

2.97 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

32 Macrocells

111 MHz

10 mm

32

PLUS405/B3A

NXP Semiconductors

OT PLD

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

Bipolar

Chip Carrier

16 Dedicated Inputs

16

Quad

S-CQCC-N28

No

30 MHz

PZ5064-7A68

NXP Semiconductors

EE PLD

Commercial

J Bend

68

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 48 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J68

4.57 mm

24.2316 mm

No

105 MHz

24.2316 mm

48

PZ5064I12BB1

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

14.5 ns

Yes

5.5 V

CMOS

5

Flatpack

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

67 MHz

20 mm

64

PZ3064-12BC-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

14.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

2.97 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

67 MHz

10 mm

32

P5Z22V10-7D-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

9 ns

Yes

5.25 V

CMOS

5

Small Outline

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDSO-G24

2.65 mm

7.5 mm

No

103 MHz

15.4 mm

10

PLUS105-70N3

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

6.5 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Dual

R-PDIP-T28

5.33 mm

7.62 mm

No

Programmable Logic Sequencer; 1 External Clock

47.6 MHz

35.505 mm

0

PZ3032-10BC-S

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

17 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

2.97 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

57 MHz

10 mm

32

M38510/50201BXA

NXP Semiconductors

OT PLD

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

5.5 V

Bipolar

MIL-M-38510 Class B

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-CDIP-T28

No

0

PML2852-35KA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

84

QCCJ

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

CMOS

5

Chip Carrier

Mixed

4.75 V

1.27 mm

75 °C (167 °F)

29 Dedicated Inputs, 24 I/O

29

0 °C (32 °F)

Quad

S-CQCC-J84

4.83 mm

29.145 mm

No

52 Flip Flops

29.145 mm

24

PZ5128NS15BE-T

NXP Semiconductors

EE PLD

Industrial

Gull Wing

128

LFQFP

Rectangular

Plastic/Epoxy

17.5 ns

Yes

5.5 V

CMOS

5

Flatpack, Low Profile, Fine Pitch

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 96 I/O

2

-40 °C (-40 °F)

Quad

R-PQFP-G128

1.6 mm

14 mm

No

128 Macrocells

63 MHz

20 mm

96

PZ5032-6BC

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

11 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

105 MHz

10 mm

32

PZ3064DS10EC

NXP Semiconductors

EE PLD

Industrial

Ball

56

LFBGA

Square

Plastic/Epoxy

11.5 ns

Yes

3.6 V

CMOS

Grid Array, Low Profile, Fine Pitch

Macrocell

2.7 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 44 I/O

2

-40 °C (-40 °F)

Bottom

S-PBGA-B56

1.35 mm

6 mm

No

90 MHz

6 mm

44

PLC18V8ZIAN

NXP Semiconductors

OT PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

25 ns

No

5.5 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.5 V

74

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDIP-T20

4.2 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

30 MHz

8

26.73 mm

8

ABT22V10B/BLA

NXP Semiconductors

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

9 ns

No

5.5 V

BICMOS

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

71 MHz

10

PZ3032-12BC-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

19 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

2.97 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

47 MHz

10 mm

32

PML2552-50KA

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

68

QCCJ

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

CMOS

5

Chip Carrier

Mixed

4.75 V

1.27 mm

75 °C (167 °F)

9 Dedicated Inputs, 24 I/O

9

0 °C (32 °F)

Quad

S-CQCC-J68

4.83 mm

24.065 mm

No

35 MHz

24.065 mm

24

PZ3128IS15BB1-T

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

17.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack

Macrocell

3 V

.65 mm

85 °C (185 °F)

2 Dedicated Inputs, 80 I/O

2

-40 °C (-40 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

59 MHz

20 mm

80

PZ3032AS10A44-T

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

12.5 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

32 Macrocells

59 MHz

16.5862 mm

32

PZ5032-7BC-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

12.5 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

80 MHz

10 mm

32

PZ3032NS10A44

NXP Semiconductors

EE PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

12.5 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

32 Macrocells

58.8 MHz

16.5862 mm

32

P3Q20V8-7A

NXP Semiconductors

OT PLD

J Bend

28

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

BICMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

12 Dedicated Inputs, 9 I/O

12

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

8 Macrocells; 1 External Clock; 5 V compatile Inputs & I/O; Register Preload; Power-up reset

105 MHz

11.505 mm

9

PZ3128-S12BE

NXP Semiconductors

EE PLD

Commercial

Gull Wing

128

LFQFP

Rectangular

Plastic/Epoxy

14.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Low Profile, Fine Pitch

Macrocell

3 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 96 I/O

2

0 °C (32 °F)

Quad

R-PQFP-G128

1.6 mm

14 mm

No

66 MHz

20 mm

96

ABT22V10A5A-T

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

8 ns

Yes

5.25 V

BICMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

10 Macrocells; Variable Product Terms; Power-Up Reset; 1 External Clock; Shared Input/Clock

167 MHz

11.5062 mm

10

PZ3064D12A44

NXP Semiconductors

EE PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

14.5 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

32 Macrocells

67 MHz

16.5862 mm

32

5962-8670901YX

NXP Semiconductors

OT PLD

Military

Flat

28

DFP

Rectangular

Ceramic, Glass-Sealed

35 ns

Yes

5.5 V

Bipolar

MIL-STD-883

5

Flatpack

Registered

4.5 V

125 °C (257 °F)

15 Dedicated Inputs, 0 I/O

15

-55 °C (-67 °F)

Dual

R-GDFP-F28

No

0

PZ5064N10BP

NXP Semiconductors

EE PLD

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

12.5 ns

Yes

5.5 V

CMOS

5

Flatpack, Thin Profile, Fine Pitch

Macrocell

4.5 V

.5 mm

85 °C (185 °F)

2 Dedicated Inputs, 64 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G100

1.2 mm

14 mm

No

64 Macrocells

77 MHz

14 mm

64

PZ3064-10BB1-S

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

12.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack

Macrocell

2.97 V

.65 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

80 MHz

20 mm

64

PLC18V8Z35A-T

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

20

QCCJ

Square

Plastic/Epoxy

35 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Quad

S-PQCC-J20

4.57 mm

8.965 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

21 MHz

8.965 mm

8

PZ3064I15A44

NXP Semiconductors

EE PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

17.5 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

2.97 V

1.27 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

58 MHz

16.5862 mm

32

PZ5064-7A44-T

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

105 MHz

16.5862 mm

32

PZ5064-7A84-T

NXP Semiconductors

EE PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 64 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J84

4.57 mm

29.3116 mm

No

105 MHz

29.3116 mm

64

PZ5128-S10BE-S

NXP Semiconductors

EE PLD

Commercial

Gull Wing

128

LFQFP

Rectangular

Plastic/Epoxy

12 ns

Yes

5.25 V

CMOS

5

Flatpack, Low Profile, Fine Pitch

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

2 Dedicated Inputs, 96 I/O

2

0 °C (32 °F)

Quad

R-PQFP-G128

1.6 mm

14 mm

No

71 MHz

20 mm

96

PLS101A

NXP Semiconductors

OT PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

50 ns

Yes

5.25 V

TTL

16

PLA-TYPE

5

5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Combinatorial

4.75 V

48

1.27 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.505 mm

No

Open Collector Output

8

11.505 mm

0

PZ3320C7XX

NXP Semiconductors

Loadable PLD

Commercial

Gull Wing

160

QFP

Square

Plastic/Epoxy

9 ns

Yes

3.63 V

CMOS

3.3

Flatpack

Macrocell

2.97 V

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQFP-G160

No

100 MHz

PZ5032CS6BC-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

8 ns

Yes

5.25 V

CMOS

5

Flatpack, Thin Profile

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

32 Macrocells

111 MHz

10 mm

32

82S100/BYA-T

NXP Semiconductors

OT PLD

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

80 ns

Yes

5.5 V

TTL

5

Flatpack

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-CDFP-F28

No

0

PZ3032CS10A44

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

13 ns

Yes

3.63 V

CMOS

3.3

Chip Carrier

Macrocell

3 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

32 Macrocells

57 MHz

16.5862 mm

32

PZ3128-S10BB1-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

13 ns

Yes

3.6 V

CMOS

3.3

Flatpack

Macrocell

3 V

.65 mm

70 °C (158 °F)

2 Dedicated Inputs, 80 I/O

2

0 °C (32 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

74 MHz

20 mm

80

PZ3064I12BC-T

NXP Semiconductors

EE PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

14.5 ns

Yes

3.63 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

2.97 V

.8 mm

85 °C (185 °F)

2 Dedicated Inputs, 32 I/O

2

-40 °C (-40 °F)

Quad

S-PQFP-G44

1.2 mm

10 mm

No

67 MHz

10 mm

32

PZ5032CS7A44-T

NXP Semiconductors

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Chip Carrier

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 32 I/O

2

0 °C (32 °F)

Quad

S-PQCC-J44

4.57 mm

16.5862 mm

No

32 Macrocells

80 MHz

16.5862 mm

32

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.