Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
35 ns |
No |
5.25 V |
TTL |
5 |
In-Line |
Mixed |
4.75 V |
75 °C (167 °F) |
4 Dedicated Inputs, 12 I/O |
4 |
0 °C (32 °F) |
Dual |
R-PDIP-T20 |
No |
Programmable Logic Sequencer; 1 External Clock |
18 MHz |
12 |
||||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
30 ns |
Yes |
5.25 V |
TTL |
5 |
Chip Carrier |
Registered |
4.75 V |
1.27 mm |
75 °C (167 °F) |
14 Dedicated Inputs, 0 I/O |
14 |
0 °C (32 °F) |
Quad |
S-PQCC-J28 |
4.57 mm |
11.505 mm |
No |
Programmable Logic Sequencer; 1 External Clock |
12.5 MHz |
11.505 mm |
0 |
||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
17.5 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 96 I/O |
2 |
-40 °C (-40 °F) |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
63 MHz |
28 mm |
96 |
|||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
8 ns |
Yes |
5.25 V |
BICMOS |
5 |
Chip Carrier |
Mixed |
4.75 V |
75 °C (167 °F) |
12 Dedicated Inputs, 4 I/O |
12 |
0 °C (32 °F) |
Quad |
S-PQCC-J28 |
No |
Register Preload; Power-Up Reset |
118 MHz |
4 |
||||||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.63 V |
CMOS |
3.3 |
Flatpack, Thin Profile |
Macrocell |
2.97 V |
.8 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
No |
32 Macrocells |
80 MHz |
10 mm |
32 |
||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
TTL |
5 |
Chip Carrier |
Combinatorial |
4.75 V |
1.27 mm |
75 °C (167 °F) |
10 Dedicated Inputs, 6 I/O |
10 |
0 °C (32 °F) |
Quad |
S-PQCC-J20 |
4.57 mm |
8.965 mm |
No |
8.965 mm |
6 |
||||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
9.5 ns |
Yes |
3.63 V |
CMOS |
3.3 |
Chip Carrier |
Macrocell |
2.97 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
32 Macrocells |
105 MHz |
16.5862 mm |
32 |
||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
8 ns |
Yes |
3.63 V |
CMOS |
3.3 |
Flatpack, Thin Profile |
Macrocell |
2.97 V |
.8 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
No |
32 Macrocells |
111 MHz |
10 mm |
32 |
||||||||||||||||||||
NXP Semiconductors |
OT PLD |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
Bipolar |
Chip Carrier |
16 Dedicated Inputs |
16 |
Quad |
S-CQCC-N28 |
No |
30 MHz |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 48 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQCC-J68 |
4.57 mm |
24.2316 mm |
No |
105 MHz |
24.2316 mm |
48 |
|||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
14.5 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 64 I/O |
2 |
-40 °C (-40 °F) |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
67 MHz |
20 mm |
64 |
|||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
14.5 ns |
Yes |
3.63 V |
CMOS |
3.3 |
Flatpack, Thin Profile |
Macrocell |
2.97 V |
.8 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
No |
67 MHz |
10 mm |
32 |
|||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
9 ns |
Yes |
5.25 V |
CMOS |
5 |
Small Outline |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Dual |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
No |
103 MHz |
15.4 mm |
10 |
|||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
6.5 ns |
No |
5.25 V |
TTL |
5 |
In-Line |
Registered |
4.75 V |
2.54 mm |
75 °C (167 °F) |
16 Dedicated Inputs, 0 I/O |
16 |
0 °C (32 °F) |
Dual |
R-PDIP-T28 |
5.33 mm |
7.62 mm |
No |
Programmable Logic Sequencer; 1 External Clock |
47.6 MHz |
35.505 mm |
0 |
||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
17 ns |
Yes |
3.63 V |
CMOS |
3.3 |
Flatpack, Thin Profile |
Macrocell |
2.97 V |
.8 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
No |
57 MHz |
10 mm |
32 |
|||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
Bipolar |
MIL-M-38510 Class B |
5 |
In-Line |
Combinatorial |
4.5 V |
125 °C (257 °F) |
16 Dedicated Inputs, 0 I/O |
16 |
-55 °C (-67 °F) |
Dual |
R-CDIP-T28 |
No |
0 |
||||||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
J Bend |
84 |
QCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Mixed |
4.75 V |
1.27 mm |
75 °C (167 °F) |
29 Dedicated Inputs, 24 I/O |
29 |
0 °C (32 °F) |
Quad |
S-CQCC-J84 |
4.83 mm |
29.145 mm |
No |
52 Flip Flops |
29.145 mm |
24 |
||||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Industrial |
Gull Wing |
128 |
LFQFP |
Rectangular |
Plastic/Epoxy |
17.5 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 96 I/O |
2 |
-40 °C (-40 °F) |
Quad |
R-PQFP-G128 |
1.6 mm |
14 mm |
No |
128 Macrocells |
63 MHz |
20 mm |
96 |
||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
11 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Thin Profile |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
No |
105 MHz |
10 mm |
32 |
|||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Industrial |
Ball |
56 |
LFBGA |
Square |
Plastic/Epoxy |
11.5 ns |
Yes |
3.6 V |
CMOS |
Grid Array, Low Profile, Fine Pitch |
Macrocell |
2.7 V |
.5 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 44 I/O |
2 |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B56 |
1.35 mm |
6 mm |
No |
90 MHz |
6 mm |
44 |
||||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
25 ns |
No |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
74 |
2.54 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-40 °C (-40 °F) |
Dual |
R-PDIP-T20 |
4.2 mm |
7.62 mm |
No |
8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset |
30 MHz |
8 |
26.73 mm |
8 |
|||||||||||||
NXP Semiconductors |
OT PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
9 ns |
No |
5.5 V |
BICMOS |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
71 MHz |
10 |
||||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
19 ns |
Yes |
3.63 V |
CMOS |
3.3 |
Flatpack, Thin Profile |
Macrocell |
2.97 V |
.8 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
No |
47 MHz |
10 mm |
32 |
|||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
J Bend |
68 |
QCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Mixed |
4.75 V |
1.27 mm |
75 °C (167 °F) |
9 Dedicated Inputs, 24 I/O |
9 |
0 °C (32 °F) |
Quad |
S-CQCC-J68 |
4.83 mm |
24.065 mm |
No |
35 MHz |
24.065 mm |
24 |
||||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
17.5 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack |
Macrocell |
3 V |
.65 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 80 I/O |
2 |
-40 °C (-40 °F) |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
59 MHz |
20 mm |
80 |
|||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
12.5 ns |
Yes |
3.63 V |
CMOS |
3.3 |
Chip Carrier |
Macrocell |
2.97 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
32 Macrocells |
59 MHz |
16.5862 mm |
32 |
||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
12.5 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Thin Profile |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
No |
80 MHz |
10 mm |
32 |
|||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
12.5 ns |
Yes |
3.63 V |
CMOS |
3.3 |
Chip Carrier |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
32 Macrocells |
58.8 MHz |
16.5862 mm |
32 |
||||||||||||||||||||
NXP Semiconductors |
OT PLD |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
BICMOS |
3.3 |
Chip Carrier |
Macrocell |
3 V |
1.27 mm |
12 Dedicated Inputs, 9 I/O |
12 |
Quad |
S-PQCC-J28 |
4.57 mm |
11.505 mm |
No |
8 Macrocells; 1 External Clock; 5 V compatile Inputs & I/O; Register Preload; Power-up reset |
105 MHz |
11.505 mm |
9 |
|||||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
128 |
LFQFP |
Rectangular |
Plastic/Epoxy |
14.5 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
3 V |
.5 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 96 I/O |
2 |
0 °C (32 °F) |
Quad |
R-PQFP-G128 |
1.6 mm |
14 mm |
No |
66 MHz |
20 mm |
96 |
|||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
8 ns |
Yes |
5.25 V |
BICMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Quad |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
No |
10 Macrocells; Variable Product Terms; Power-Up Reset; 1 External Clock; Shared Input/Clock |
167 MHz |
11.5062 mm |
10 |
||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
14.5 ns |
Yes |
3.63 V |
CMOS |
3.3 |
Chip Carrier |
Macrocell |
2.97 V |
1.27 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
32 Macrocells |
67 MHz |
16.5862 mm |
32 |
||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Military |
Flat |
28 |
DFP |
Rectangular |
Ceramic, Glass-Sealed |
35 ns |
Yes |
5.5 V |
Bipolar |
MIL-STD-883 |
5 |
Flatpack |
Registered |
4.5 V |
125 °C (257 °F) |
15 Dedicated Inputs, 0 I/O |
15 |
-55 °C (-67 °F) |
Dual |
R-GDFP-F28 |
No |
0 |
|||||||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
12.5 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Thin Profile, Fine Pitch |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 64 I/O |
2 |
-40 °C (-40 °F) |
Quad |
S-PQFP-G100 |
1.2 mm |
14 mm |
No |
64 Macrocells |
77 MHz |
14 mm |
64 |
||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
12.5 ns |
Yes |
3.63 V |
CMOS |
3.3 |
Flatpack |
Macrocell |
2.97 V |
.65 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 64 I/O |
2 |
0 °C (32 °F) |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
80 MHz |
20 mm |
64 |
|||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Commercial Extended |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
35 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
75 °C (167 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Quad |
S-PQCC-J20 |
4.57 mm |
8.965 mm |
No |
8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset |
21 MHz |
8.965 mm |
8 |
||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
17.5 ns |
Yes |
3.63 V |
CMOS |
3.3 |
Chip Carrier |
Macrocell |
2.97 V |
1.27 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
58 MHz |
16.5862 mm |
32 |
|||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
105 MHz |
16.5862 mm |
32 |
|||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 64 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQCC-J84 |
4.57 mm |
29.3116 mm |
No |
105 MHz |
29.3116 mm |
64 |
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NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
128 |
LFQFP |
Rectangular |
Plastic/Epoxy |
12 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 96 I/O |
2 |
0 °C (32 °F) |
Quad |
R-PQFP-G128 |
1.6 mm |
14 mm |
No |
71 MHz |
20 mm |
96 |
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NXP Semiconductors |
OT PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
50 ns |
Yes |
5.25 V |
TTL |
16 |
PLA-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Combinatorial |
4.75 V |
48 |
1.27 mm |
75 °C (167 °F) |
16 Dedicated Inputs, 0 I/O |
16 |
0 °C (32 °F) |
Quad |
S-PQCC-J28 |
4.57 mm |
11.505 mm |
No |
Open Collector Output |
8 |
11.505 mm |
0 |
||||||||||||||
NXP Semiconductors |
Loadable PLD |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
9 ns |
Yes |
3.63 V |
CMOS |
3.3 |
Flatpack |
Macrocell |
2.97 V |
70 °C (158 °F) |
0 °C (32 °F) |
Quad |
S-PQFP-G160 |
No |
100 MHz |
||||||||||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
8 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Thin Profile |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
No |
32 Macrocells |
111 MHz |
10 mm |
32 |
||||||||||||||||||||
NXP Semiconductors |
OT PLD |
Military |
Flat |
28 |
DFP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
80 ns |
Yes |
5.5 V |
TTL |
5 |
Flatpack |
Combinatorial |
4.5 V |
125 °C (257 °F) |
16 Dedicated Inputs, 0 I/O |
16 |
-55 °C (-67 °F) |
Dual |
R-CDFP-F28 |
No |
0 |
||||||||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
13 ns |
Yes |
3.63 V |
CMOS |
3.3 |
Chip Carrier |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
32 Macrocells |
57 MHz |
16.5862 mm |
32 |
||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
13 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack |
Macrocell |
3 V |
.65 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 80 I/O |
2 |
0 °C (32 °F) |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
74 MHz |
20 mm |
80 |
|||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
14.5 ns |
Yes |
3.63 V |
CMOS |
3.3 |
Flatpack, Thin Profile |
Macrocell |
2.97 V |
.8 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
-40 °C (-40 °F) |
Quad |
S-PQFP-G44 |
1.2 mm |
10 mm |
No |
67 MHz |
10 mm |
32 |
|||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 32 I/O |
2 |
0 °C (32 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
32 Macrocells |
80 MHz |
16.5862 mm |
32 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.