RECTANGULAR Cellphone ICs 530

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
NRF9160-SICA-B1A-R7	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		GRID ARRAY	LGA127,21X30,20		.5 mm	85 Cel	-40 Cel		BOTTOM	R-XBGA-N127		1.1 mm	10.5 mm						16 mm
NRF9160-SICA-B1A-R	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		GRID ARRAY	LGA127,21X30,20		.5 mm	85 Cel	-40 Cel		BOTTOM	R-XBGA-N127		1.1 mm	10.5 mm						16 mm
NRF9160-SIAA-B1A-R7	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		GRID ARRAY	LGA127,21X30,20		.5 mm	85 Cel	-40 Cel		BOTTOM	R-XBGA-N127		1.1 mm	10.5 mm						16 mm
NRF9160-SIAA-B1A-R	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		GRID ARRAY	LGA127,21X30,20		.5 mm	85 Cel	-40 Cel		BOTTOM	R-XBGA-N127		1.1 mm	10.5 mm						16 mm
NRF9160-SIBA-B1A-R7	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		GRID ARRAY	LGA127,21X30,20		.5 mm	85 Cel	-40 Cel		BOTTOM	R-XBGA-N127		1.1 mm	10.5 mm						16 mm
LMH2110TMX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1			5.5 mA	4.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B6	1	.675 mm	.84 mm			e1	30	260	1.24 mm
BG95M1LA-64-SGNS	Quectel Wireless Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	102	QMA	RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY				75 Cel	-35 Cel		QUAD	R-XQMA-N102		2.2 mm	19.9 mm		EXTENDED TEMP AVAILABLE WITH -40 TO 85				23.6 mm
BG77LA-64-SGNS	Quectel Wireless Solutions	BASEBAND CIRCUIT		NO LEAD	94		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V						75 Cel	-35 Cel		BOTTOM	R-XBGA-N94		1.7 mm	12.9 mm		Extended Temperature Range also available -40 to 85				14.9 mm
SARA-R410M-02B-01	U-blox Ag	RF AND BASEBAND CIRCUIT	COMMERCIAL	NO LEAD	96	LGA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		GRID ARRAY	LGA96(UNSPEC)			65 Cel	-20 Cel		BOTTOM	R-XLGA-N96	4	2.78 mm	16 mm		-40 to 85 extended operating temp available				26 mm
SARA-R410M-02B	U-blox Ag	RF AND BASEBAND CIRCUIT	COMMERCIAL	NO LEAD	96	LGA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		GRID ARRAY				65 Cel	-20 Cel		BOTTOM	R-XBGA-N96	4	2.78 mm	16 mm						26 mm
ME310G1WW04T050400	Telit Communications Plc	RF AND BASEBAND CIRCUIT		NO LEAD	94	XMA	RECTANGULAR	UNSPECIFIED	NO	1					3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	R-XXMA-N94		2.6 mm	15 mm						18 mm
EG91EXGA-128-SGNS	Quectel Wireless Solutions	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	102	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		MICROELECTRONIC ASSEMBLY				75 Cel	-35 Cel		UNSPECIFIED	R-XXMA-N102		2.3 mm	25 mm		Also has Extended temp from -40 Deg c to 85 Deg c				29 mm
OC2321VQFN8XTMA2	Infineon Technologies	RF AND BASEBAND CIRCUIT		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.24		1.27 mm	105 Cel	-40 Cel		DUAL	R-PDSO-N8	1	.9 mm	6 mm						5 mm
BGA725L6E6327FTSA1	Infineon Technologies	BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1					1.8 V		CHIP CARRIER			.2 mm	85 Cel	-40 Cel	GOLD	BOTTOM	R-XBCC-B6	1	.4 mm	.7 mm			e4			1.1 mm
BC66NB-04-STD	Quectel Wireless Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	58	QMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				75 Cel	-35 Cel		QUAD	R-XQMA-N58		2 mm	15.8 mm		EXTENDED TEMP AVAILABLE WITH -40 TO 85				17.7 mm
LMH2110TM/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1			5.5 mA	4.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B6	1	.675 mm	.84 mm			e1	30	260	1.24 mm
ST25R3912-AWLT	STMicroelectronics	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	BALL	30	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel		BOTTOM	R-PBGA-B30		.68 mm	2.865 mm				NOT SPECIFIED	NOT SPECIFIED	3.065 mm
ME310G1WW01T010100	Telit Communications Plc	RF AND BASEBAND CIRCUIT		NO LEAD	94	XMA	RECTANGULAR	UNSPECIFIED	NO	1					3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	R-XXMA-N94		2.6 mm	15 mm						18 mm
BALF-NRG-02D3	STMicroelectronics	RF AND BASEBAND CIRCUIT		BALL	4	VBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA4,2X2,40/16		1 mm	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B4		.69 mm	.855 mm			e1	30	260	1.385 mm
SARA-R410M-02B-04	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	96	LGA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		GRID ARRAY	LGA96(UNSPEC)			65 Cel	-20 Cel		BOTTOM	R-XBGA-N96	4	2.78 mm	16 mm		-40 to 85 extended operating temp available				26 mm
BGA7H1BN6E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					2.8 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	TIN	BOTTOM	R-PBCC-N6	1	.4 mm	.7 mm			e3			1.1 mm
EG25GGC-128-SGNS	Quectel Wireless Solutions	RF AND BASEBAND CIRCUIT		NO LEAD		SMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				75 Cel	-35 Cel		SINGLE	R-XSMA-N		4.9 mm	30 mm		also available Extended Temperature Range -40 to 80 degree Celsius				51 mm
LARA-R211-02B	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	100	LGA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949	300 mA	3.8 V		GRID ARRAY	LGA100(UNSPEC)			65 Cel	-20 Cel		BOTTOM	R-XLGA-N100	4	2.87 mm	24 mm		-40 to 85 extended operating temp available				26 mm
LARA-R211-02B-02	U-blox Ag	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	100		RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		MICROELECTRONIC ASSEMBLY				65 Cel	-20 Cel		UNSPECIFIED	R-XXMA-N100	4	2.87 mm	24 mm				NOT SPECIFIED	NOT SPECIFIED	26 mm
TOBY-L210-03S	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		GRID ARRAY				65 Cel	-20 Cel		BOTTOM	R-XBGA-N152	4	2.87 mm	24.8 mm		-40 to 85 extended operating temp available				35.6 mm
SARA-R410M-02B-03	U-blox Ag	RF AND BASEBAND CIRCUIT	COMMERCIAL	NO LEAD	96	LGA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		GRID ARRAY	LGA96(UNSPEC)			65 Cel	-20 Cel		BOTTOM	R-XLGA-N96	4	2.78 mm	16 mm		-40 to 85 extended operating temp available				26 mm
TOBY-L210-03S-03	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		GRID ARRAY				65 Cel	-20 Cel		BOTTOM	R-XBGA-N152		2.87 mm	24.8 mm		-40 to 85 extended operating temp available				35.6 mm
SARA-U201-04B-00	U-blox Ag	TELECOM CIRCUIT	COMMERCIAL	BUTT	96	BCC	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		CHIP CARRIER				65 Cel	-20 Cel		BOTTOM	R-XBCC-B96	4	3.25 mm	16 mm		ALSO HAVE EXTENDED OPERATING INPUT VOLTAGE FROM 3.10V TO 4.5V				26 mm
CC1000PW	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.001 mA	3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified		e4	30	260	9.7 mm
SA638	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified		e4			7.8 mm
AD607ARSZ	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	MATTE TIN	DUAL	R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified		e3		260	7.2 mm
AD607ARS	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified		e0		240	7.2 mm
SARA-R412M-02B	U-blox Ag	RF AND BASEBAND CIRCUIT	OTHER	BUTT	96	LGA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		GRID ARRAY				65 Cel	-20 Cel		BOTTOM	R-XBGA-B96	4	2.78 mm	16 mm				NOT SPECIFIED	NOT SPECIFIED	26 mm
NRF9160-SIBA-B1A-R	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		GRID ARRAY	LGA127,21X30,20		.5 mm	85 Cel	-40 Cel		BOTTOM	R-XBGA-N127		1.1 mm	10.5 mm						16 mm
SARA-U201-03B-00	U-blox Ag	TELECOM CIRCUIT	COMMERCIAL	BUTT	96	BCC	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		CHIP CARRIER				65 Cel	-20 Cel		BOTTOM	R-XBCC-B96	4	3.25 mm	16 mm		ALSO HAVE EXTENDED OPERATING INPUT VOLTAGE FROM 3.10V TO 4.5V				26 mm
SX8652IWLTRT	Semtech	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-N14	2	.8 mm	3 mm	Not Qualified		e3		260	4 mm
MAX2606EUT-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified		e0			2.9 mm
MAX2606EUT+T	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified		e3	30	260	2.9 mm
MAX-7W-0	U-blox Ag	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL	R-XDMA-N18	4	2.7 mm	9.7 mm						10.1 mm
BGC100GN6E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT		BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		CMOS					CHIP CARRIER							BOTTOM	R-XBCC-B6	1
LMH2110TM	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					4.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.675 mm	.84 mm	Not Qualified					1.24 mm
AD607ARS-REEL	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified		e0		240	7.2 mm
AD607ARSZ-REEL	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	MATTE TIN	DUAL	R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified		e3		260	7.2 mm
M95FA-03-STD	Quectel Wireless Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	42	QMA	RECTANGULAR	UNSPECIFIED	YES	1					4 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD	R-XQMA-N42		2.65 mm	19.9 mm						23.6 mm
SARA-R412M-02B-03	U-blox Ag	RF AND BASEBAND CIRCUIT	COMMERCIAL	NO LEAD	96	LGA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		GRID ARRAY	LGA96(UNSPEC)			65 Cel	-20 Cel		BOTTOM	R-XLGA-N96	4	2.78 mm	16 mm		-40 to 85 extended operating temp available				26 mm
HL7692	Sierra Wireless	RF AND BASEBAND CIRCUIT		NO LEAD	146	LGA	RECTANGULAR	UNSPECIFIED	YES	1					3.7 V		GRID ARRAY	LGA146(UNSPEC)			85 Cel	-40 Cel		BOTTOM	R-XBGA-N146		2.7 mm	22 mm		Also Operates with class A: -30 deg c to 70 deg c				23 mm
BGA777N7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1					2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	DUAL	R-PDSO-N6	1	.4 mm	1.3 mm			e3			2 mm
CC1000PWR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.001 mA	3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified		e4	30	260	9.7 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.