RECTANGULAR Cellphone ICs 530

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Companding Law	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
AD8348ARU	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR			5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	R-PDSO-G28	1	1.2 mm		4.4 mm	Not Qualified			e0		240	9.7 mm
AD8348ARU-REEL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR			5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	R-PDSO-G28	1	1.2 mm		4.4 mm	Not Qualified			e0		240	9.7 mm
MAX2674EWT+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B6	1	.69 mm		.865 mm	Not Qualified			e2	30	260	1.27 mm
MAX2674EWT+T10	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B6	1	.69 mm		.865 mm				e2	30	260	1.27 mm
SARA-G350-02S-00	U-blox Ag	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	96		RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel			UNSPECIFIED	R-XXMA-N96	4	2.65 mm		16 mm					60	245	26 mm
SI4136-F-BT	Silicon Labs	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.031 mA	3 V	3/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G24		1.2 mm		4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7.8 mm
SI4136-F-GT	Silicon Labs	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.031 mA	3 V	3/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G24	3	1.2 mm		4.4 mm	Not Qualified			e3		260	7.8 mm
SI4136-F-GTR	Silicon Labs	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G24	3	1.2 mm		4.4 mm	Not Qualified			e3		260	7.8 mm
HMC786LP4E	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	R-PQCC-N24	1	1 mm		4 mm	Not Qualified			e3		260	4 mm
SKY13437-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	22		RECTANGULAR	UNSPECIFIED	YES	1					2.85 V		MICROELECTRONIC ASSEMBLY			.4 mm	90 Cel	-35 Cel			QUAD	R-XQMA-N22	3	.9 mm		2.5 mm						260	3.2 mm
CC1000PWRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	3	1.2 mm		4.4 mm	Not Qualified			e4	30	260	9.7 mm
SKY78117-14	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	34		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY								UNSPECIFIED	R-XXMA-N34									NOT SPECIFIED	NOT SPECIFIED
BGSX22G2A10E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT		BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1		CMOS					CHIP CARRIER								BOTTOM	R-XBCC-B10	1
SARA-U270-03S-01	U-blox Ag	TELECOM CIRCUIT	COMMERCIAL	BUTT	96	BCC	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		CHIP CARRIER				55 Cel	-20 Cel			BOTTOM	R-XBCC-B96	4	3.25 mm		16 mm			ALSO HAVE EXTENDED OPERATING INPUT VOLTAGE FROM 3.10V TO 4.5V				26 mm
TOBY-L210-65S	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		GRID ARRAY				65 Cel	-20 Cel			BOTTOM	R-XBGA-N152	4	2.87 mm		24.8 mm			-40 to 85 extended operating temp available				35.6 mm
BGA713N7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1					2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		TIN	DUAL	R-PDSO-N6	1	.4 mm		1.3 mm				e3			2 mm
BGA7L1BN6E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					2.8 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		TIN	BOTTOM	R-PBCC-N6	1	.4 mm		.7 mm				e3			1.1 mm
J-N3-B3E6-LR	Telit Communications Plc	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE				85 Cel	-40 Cel			DUAL	R-PDSO-N24		2.4 mm		12.2 mm							16 mm
LMV228TLX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL		VFBGA	RECTANGULAR	UNSPECIFIED	YES	1	1			8 mA			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	R-XBGA-B4	1							e1	30	260
SARA-G340-02S-00	U-blox Ag	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	96		RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel			UNSPECIFIED	R-XXMA-N96	4	2.65 mm		16 mm					60	245	26 mm
SKY65723-81	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6		RECTANGULAR	UNSPECIFIED	NO	1					1.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			DUAL	R-XDMA-N6		.8 mm		1.7 mm					NOT SPECIFIED	NOT SPECIFIED	2.3 mm
SX8653IWLTRT	Semtech	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			DUAL	R-PDSO-N14		.8 mm		3 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	4 mm
TOBY-L210-62S	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		GRID ARRAY				65 Cel	-20 Cel			BOTTOM	R-XBGA-N152	4	2.87 mm		24.8 mm			-40 to 85 extended operating temp available				35.6 mm
TOBY-L280-03S	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		GRID ARRAY				65 Cel	-20 Cel			BOTTOM	R-XBGA-N152	4	2.87 mm		24.8 mm			-40 to 85 extended operating temp available				35.6 mm
ACMD-7410-TR1	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	9		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		GOLD	UNSPECIFIED	R-XXMA-N9	3	.95 mm			Not Qualified			e4
LARA-R202-02B	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	100	LGA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.8 V		GRID ARRAY	LGA100(UNSPEC)			65 Cel	-20 Cel			BOTTOM	R-XLGA-N100	4	2.87 mm		24 mm			-40 to 85 extended operating temp available			245	26 mm
LISA-U200-03S	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	76	QMA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel			QUAD	R-XQMA-N76		2.87 mm		22.4 mm							33.2 mm
MC13142D	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G16		1.75 mm		3.9 mm							9.9 mm
SKY53735-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	47	HVQCCN	RECTANGULAR		YES	1					1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC47,.16X.24,16		.4 mm	85 Cel	-30 Cel			QUAD	R-XQCC-N47	3	.7 mm		4.2 mm						260	6.2 mm
SKY66105-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	12	HVQCCN	RECTANGULAR		YES	1					3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				85 Cel	-40 Cel			QUAD	R-XQCC-N12		1.15 mm		6 mm					NOT SPECIFIED	NOT SPECIFIED	8 mm
SKY85747-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	24	HVFLGA	RECTANGULAR		YES	1				500 mA	5 V		GRID ARRAY, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH				85 Cel	-40 Cel			BOTTOM	R-XBGA-N24		1 mm		3 mm							5 mm
IAM-91563-BLKG	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G6	1	1.1 mm		1.25 mm	Not Qualified			e3		260	2.025 mm
SKY13529-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	17		RECTANGULAR	UNSPECIFIED	YES	1					2.85 V		MICROELECTRONIC ASSEMBLY				90 Cel	-35 Cel			QUAD	R-XQMA-N17		.84 mm		3 mm					NOT SPECIFIED	NOT SPECIFIED	4 mm
SKY53735-21	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	47	HVQCCN	RECTANGULAR		YES	1					1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC47,.16X.24,16		.4 mm	85 Cel	-30 Cel			QUAD	R-XQCC-N47	3	.7 mm		4.2 mm						260	6.2 mm
SKY58081-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	56	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				3200 mA	3.4 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.23X.3,17		.44 mm	110 Cel	-40 Cel			QUAD	R-PQCC-N56		.7 mm		6 mm							7.6 mm
1605C	Murata Manufacturing	BASEBAND CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	UNSPECIFIED	NO	1							IN-LINE			2.54 mm	70 Cel	0 Cel			DUAL	R-XDIP-T16		6.84 mm		7.62 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	22.5 mm
AD8348ARUZ-REEL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR			5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G28	1	1.2 mm		4.4 mm	Not Qualified			e3	30	260	9.7 mm
LMH6523SQE/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	54	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1	4			485 mA	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	25.74 dB	MATTE TIN	QUAD	R-XQCC-N54	2	.8 mm		5.5 mm				e3	30	260	10 mm
LMH2121TMX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel			BOTTOM	R-PBGA-B4		.675 mm		.866 mm							1.07 mm
TCM320AC56CN	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		CMOS		.0099 mA	5 V	5	IN-LINE	DIP20,.3	Codecs	2.54 mm	70 Cel	0 Cel	1 dB		DUAL	R-PDIP-T20		5.08 mm	13-BIT	7.62 mm	Not Qualified	MU-LAW			NOT SPECIFIED	NOT SPECIFIED	24.325 mm	YES
LMH2121TMX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1			4.7 mA	2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	R-PBGA-B4	1	.675 mm		.858 mm				e1	30	260	1.058 mm
TCM320AC57CDW	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.0099 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Codecs	1.27 mm	70 Cel	0 Cel	1 dB		DUAL	R-PDSO-G20		2.65 mm	13-BIT	7.5 mm	Not Qualified	A-LAW			NOT SPECIFIED	NOT SPECIFIED	12.8 mm	YES
LMH6522SQ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	54	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD	R-XQCC-N54		.8 mm		5.5 mm					NOT SPECIFIED	NOT SPECIFIED	10 mm
TLV320AC56IN	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		CMOS		.0075 mA	3 V	3	IN-LINE	DIP20,.3	Codecs	2.54 mm	85 Cel	-40 Cel	1 dB		DUAL	R-PDIP-T20		5.08 mm	13-BIT	7.62 mm	Not Qualified	MU-LAW			NOT SPECIFIED	NOT SPECIFIED	24.325 mm	YES
TRF1015DBLE	Texas Instruments	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.75 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2 mm		5.3 mm	Not Qualified						7.2 mm
LMV227SDX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	UNSPECIFIED	YES	1					2.7 V		SMALL OUTLINE, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		TIN	DUAL	R-XDSO-N6	1	.8 mm		2.2 mm	Not Qualified			e3			2.5 mm
LMH2120UMX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1			4 mA	4.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	R-PBGA-B6	1	.47 mm		.816 mm				e1	30	260	1.216 mm
TLV321AC36CDW	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified						12.8 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.