RECTANGULAR Cellphone ICs 530

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SA910	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	300 mA	3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
UMA1000LT	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	70 Cel	-30 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
UAA2073M	NXP Semiconductors	RF FRONT END CIRCUIT	OTHER	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	34 mA	3.75 V	3.75	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25	Other Telecom ICs	.65 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
SA621DH	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.1 mm	4.4 mm	Not Qualified				6.5 mm
SA601DK,512	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		1.5 mm	4.4 mm		e4			6.5 mm
SA601DK	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
SA9502DH	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G20		1.1 mm	4.4 mm	Not Qualified				6.5 mm
934060303135	NXP Semiconductors	BASEBAND CIRCUIT		FLAT	16	SOF	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE							DUAL	R-PDSO-F16			11 mm					15.9 mm
BLM6G10-30,127	NXP Semiconductors	BASEBAND CIRCUIT		FLAT	16	SOF	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE						Tin (Sn)	DUAL	R-PDSO-F16			11 mm		e3			15.9 mm
BGS8M2	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6		.4 mm	.7 mm					1.1 mm
SA910DK	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
UMA1000TD-T	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
BLM6G10-30	NXP Semiconductors	BASEBAND CIRCUIT		FLAT	16	HSOF	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE, HEAT SINK/SLUG			1.37 mm			TIN	DUAL	R-PDSO-F16			11 mm	Not Qualified	e3			15.9 mm
UAA2073AM-T	NXP Semiconductors	RF FRONT END CIRCUIT	COMMERCIAL EXTENDED	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	34 mA	3.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-30 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
UMA1000LT-T	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	70 Cel	-30 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
UMF1000T	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
SA620DK,112	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
BGU8103UK	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.26 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.31 mm	.44 mm					.69 mm
UAA2073M-T	NXP Semiconductors	RF FRONT END CIRCUIT	OTHER	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	34 mA	3.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
934060303118	NXP Semiconductors	BASEBAND CIRCUIT		FLAT	16	SOF	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE							DUAL	R-PDSO-F16			11 mm					15.9 mm
MRFIC1814R2	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm					5.1 mm
BLM6G10-30,135	NXP Semiconductors	BASEBAND CIRCUIT		FLAT	16	SOF	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE						Tin (Sn)	DUAL	R-PDSO-F16			11 mm		e3			15.9 mm
934060303127	NXP Semiconductors	BASEBAND CIRCUIT		FLAT	16	SOF	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE							DUAL	R-PDSO-F16			11 mm					15.9 mm
MRFIC0954R2	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.2 mm	4.4 mm					6.5 mm
SA910DK-T	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
BLM6G10-30G,127	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE			1.37 mm			Tin (Sn)	DUAL	R-PDSO-G16		3.6 mm	11 mm		e3			15.9 mm
UMA1000TD	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
BLM6G10-30G	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE, HEAT SINK/SLUG			1.37 mm			TIN	DUAL	R-PDSO-G16	3	3.6 mm	11 mm	Not Qualified	e3			15.9 mm
A2I25H060NR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT		GULL WING	17	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	LDMOS		28 V		SMALL OUTLINE, HEAT SINK/SLUG						TIN	DUAL	R-PDSO-G17	3	2.67 mm	9.02 mm		e3	40	260	17.53 mm
UAA2077TS/D	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	.028 mA	2.8 V	2.8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.65 mm	70 Cel	-30 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified	e4			5.2 mm
BLM6G10-30,118	NXP Semiconductors	BASEBAND CIRCUIT		FLAT	16	SOF	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE						TIN	DUAL	R-PDSO-F16	3		11 mm		e3	30	245	15.9 mm
SA601DK-T	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
OM5302	NXP Semiconductors	RF AND BASEBAND CIRCUIT		UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY							UNSPECIFIED	R-XXMA-X				Not Qualified
935143730118	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
935164740112	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
SA620DK,118	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
934060893118	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE			1.37 mm				DUAL	R-PDSO-G16		3.6 mm	11 mm					15.9 mm
SA601DK,112	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
934060304127	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE							DUAL	R-PDSO-G16		3.6 mm	11 mm					15.9 mm
UAA2073AM	NXP Semiconductors	RF FRONT END CIRCUIT	COMMERCIAL EXTENDED	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	34 mA	3.75 V	3.75	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25	Other Telecom ICs	.65 mm	75 Cel	-30 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
BGM1143N9E6327	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	8	BCC	RECTANGULAR	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B8		.77 mm	1.1 mm					1.5 mm
BGSX22G2A10	Infineon Technologies	RF AND BASEBAND CIRCUIT		BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS				CHIP CARRIER							BOTTOM	R-XBCC-B10	1
BGM1143N9	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	8	BCC	RECTANGULAR	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B8		.77 mm	1.1 mm			NOT SPECIFIED	NOT SPECIFIED	1.5 mm
BGM1044N7	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm					2.3 mm
CMH0819	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	R-PQCC-N24		.9 mm	3.5 mm	Not Qualified	e0			4.5 mm
PMB2208	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.014 mA	3.6 V	2.7/4.5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G24	3	1.2 mm	4.4 mm	Not Qualified			260	7.8 mm
BGM1143N9E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	8	BCC	RECTANGULAR	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B8		.77 mm	1.1 mm					1.5 mm
CMY91	Infineon Technologies	RF AND BASEBAND CIRCUIT		GULL WING	6	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE			.95 mm			Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G6		1.1 mm	1.3 mm	Not Qualified	e0			2.9 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.