RECTANGULAR Cellphone ICs 530

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BGM1044N7E6327XUSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm					2.3 mm
CMY212	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	8	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE				85 Cel	-30 Cel		DUAL	R-PDSO-G8		1.1 mm	1.6 mm	Not Qualified				2.9 mm
PMB2202	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3.6 V	2.7/4.5	SMALL OUTLINE	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified	e0			7.8 mm
CMY213	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	8	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE				85 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G8		1.1 mm	1.6 mm	Not Qualified	e0			2.9 mm
BGSX22GN10	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		2.6 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B10		.4 mm	1.1 mm					1.5 mm
CMY82	Infineon Technologies	RF AND BASEBAND CIRCUIT		NO LEAD	24	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm			TIN LEAD	QUAD	R-PQCC-N24		.9 mm	3.5 mm	Not Qualified	e0			4.5 mm
OC1120-0810VQFN8	Infineon Technologies	BASEBAND CIRCUIT		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		10 mA	1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			1.27 mm	85 Cel	-25 Cel		DUAL	R-PQCC-N8		.9 mm	5 mm					6 mm
BGSX22G5A10E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT		NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1	RFCMOS		2.8 V		CHIP CARRIER, VERY THIN PROFILE	LCC10,.04X.05,16		.4 mm	85 Cel	-40 Cel		QUAD	R-XQCC-N10	1	.65 mm	1.1 mm					1.5 mm
BGA713L7	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	BUTT	6	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6		.4 mm	1.3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	2 mm
BGA777L7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	BUTT	6	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6		.5 mm	1.3 mm			NOT SPECIFIED	NOT SPECIFIED	2 mm
BGA7H1BN6	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel	TIN	BOTTOM	R-XBCC-B6	1	.4 mm	.7 mm		e3			1.1 mm
BGA777N7	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		DUAL	R-PDSO-N6	1	.4 mm	1.3 mm					2 mm
BGA713N7	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	BUTT	6	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6	1	.4 mm	1.3 mm					2 mm
BGA713L7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	BUTT	6	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6		.5 mm	1.3 mm			NOT SPECIFIED	NOT SPECIFIED	2 mm
BGA7L1BN6	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel	TIN	BOTTOM	R-XBCC-B6	1	.4 mm	.7 mm		e3			1.1 mm
BGA777L7	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	BUTT	6	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6		.5 mm	1.3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	2 mm
BGA7H1BN6E6327	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B6		.4 mm	.7 mm					1.1 mm
BGS8H2UK	Nexperia	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		7 mA	1.8 V		GRID ARRAY			.26 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.31 mm	.44 mm					.69 mm
BGS8L3UK	Nexperia	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.26 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.31 mm	.44 mm					.69 mm
BGS8M2UK	Nexperia	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.26 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.31 mm	.44 mm					.69 mm
MAX2312EEI-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0415 mA	2.75 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e0			9.89 mm
MAX2463EAI-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e0			10.2 mm
MAX2460EAI-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e0			10.2 mm
MAX2310EEI	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0415 mA	2.75 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e0			9.89 mm
MAX2441EAI+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e3			10.2 mm
MAX2055EUP-D	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified	e0			6.5 mm
MAX2441EAI-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e0			10.2 mm
MAX2316EEI	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0415 mA	2.75 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e0			9.89 mm
MAX2424EAI-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e0			10.2 mm
MAX2421EAI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e0			10.2 mm
MAX2676EWT+T10	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B6	1	.69 mm	.865 mm		e2	30	260	1.27 mm
MAX2400ETI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	RECTANGULAR	UNSPECIFIED	YES		BICMOS	.04 mA	3 V	3	CHIP CARRIER	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	R-XQCC-N28	1			Not Qualified	e0
MAX2424EAI+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e3			10.2 mm
MAX2607EUT-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified	e0			2.9 mm
MAX2441EAI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.036 mA	3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e0			10.2 mm
MAX2202EWT+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		2.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B6	1	.69 mm	.865 mm		e2	30	260	1.27 mm
MAX2386EBP-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.75 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.02 mm	Not Qualified	e0			2.64 mm
MAX2392ETI+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	RECTANGULAR	UNSPECIFIED	YES		BICMOS	.04 mA	3 V	3	CHIP CARRIER	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-XQCC-N28	1			Not Qualified	e3	30	260
MAX2424EAI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e0			10.2 mm
MAX2383EBC+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	11	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		2.85 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	R-PBGA-B11		.65 mm	1.64 mm	Not Qualified	e3			2.12 mm
MAX2426EAI+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e3	30	260	10.2 mm
MAX2202EWT+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		2.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B6	1	.69 mm	.865 mm		e2	30	260	1.27 mm
MAX2422EAI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e0			10.2 mm
MAX2316EEI+T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0415 mA	2.75 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28		1.73 mm	3.9 mm	Not Qualified	e3			9.89 mm
MAX2391ETI+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	RECTANGULAR	UNSPECIFIED	YES		BICMOS	.04 mA	3 V	3	CHIP CARRIER	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-XQCC-N28	1			Not Qualified	e3	30	260
MAX2312EEI+	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0415 mA	2.75 V	3/5	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e3	30	260	9.89 mm
MAX2685EEE	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.73 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX2385EBP-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.75 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.02 mm	Not Qualified	e0			2.64 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.