RECTANGULAR Cellphone ICs 530

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX2676EWT+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM		R-PBGA-B6	1	.69 mm	.865 mm	Not Qualified	e2	30	260	1.27 mm
FXLA2203UMX	Onsemi	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1						CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		R-XQCC-N24	1	.55 mm	2.5 mm		e3	30	260	3.4 mm
FXLA2203	Onsemi	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	VQCCN	RECTANGULAR	UNSPECIFIED	YES	2				1.8 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		R-XQCC-N24	1	.55 mm	2.5 mm	Not Qualified				3.4 mm
STLC4560	STMicroelectronics	RF AND BASEBAND CIRCUIT	OTHER	BALL	240	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1	.006 mA	3.6 V	1.86,3.6	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA240,15X16,20	Network Interfaces	.5 mm	85 Cel	-30 Cel		BOTTOM	54 Mbps	R-PBGA-B240		1.4 mm	8 mm	Not Qualified				8.5 mm
TN100-MOD	STMicroelectronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	44		RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N44
STRAFT-P98L15	STMicroelectronics	RF AND BASEBAND CIRCUIT	OTHER	BUTT	15	TFLGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, THIN PROFILE, FINE PITCH			.75 mm	85 Cel	-25 Cel		BOTTOM		R-XBGA-B15		1.1 mm	2.7 mm					3.8 mm
STLC4560TRAY	STMicroelectronics	RF AND BASEBAND CIRCUIT	OTHER	BALL	240	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1	.006 mA	3.6 V	1.86,3.6	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA240,15X16,20	Network Interfaces	.5 mm	85 Cel	-30 Cel		BOTTOM	54 Mbps	R-PBGA-B240		1.4 mm	8 mm	Not Qualified				8.5 mm
DSL01-010SC5	STMicroelectronics	BASEBAND CIRCUIT		GULL WING	5		RECTANGULAR	PLASTIC/EPOXY	YES							SMALL OUTLINE						NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G5	1			Not Qualified	e4	30	260
DSL01-024SC5	STMicroelectronics	BASEBAND CIRCUIT		GULL WING	5		RECTANGULAR	PLASTIC/EPOXY	YES							SMALL OUTLINE						NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G5	1			Not Qualified	e4	30	260
STLC4420A	STMicroelectronics	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	BALL	228	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1		3.6 V	1.8,3.6	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA228,13X24,20	Network Interfaces	.5 mm	85 Cel	-30 Cel		BOTTOM	54 Mbps	R-PBGA-B228		1.4 mm	7 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	12.5 mm
LTE3401LX	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBCC-B6	1	.4 mm	.7 mm				260	1.1 mm
MD7IC2250GNR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT		GULL WING	14		RECTANGULAR	PLASTIC/EPOXY	YES	1				28 V		FLANGE MOUNT						TIN	DUAL		R-PDFM-G14	3			Not Qualified	e3	40	260
MC13760	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	104	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B104		1.6 mm	10 mm					10 mm
MD7IC2250NBR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT		THROUGH-HOLE	14		RECTANGULAR	PLASTIC/EPOXY	NO	1				28 V		FLANGE MOUNT						TIN	DUAL		R-PDFM-T14	3			Not Qualified	e3	40	260
MD7IC2250NR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT		THROUGH-HOLE	14		RECTANGULAR	PLASTIC/EPOXY	NO	1				28 V		FLANGE MOUNT						MATTE TIN	DUAL		R-PDFM-T14	3			Not Qualified	e3
MC13143D	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm					4.9 mm
LTE3401L	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBCC-B6		.4 mm	.7 mm					1.1 mm
LTE3401H	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBCC-B6		.4 mm	.7 mm					1.1 mm
MMM7210B	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	170	LGA	RECTANGULAR	UNSPECIFIED	YES	1				1.2 V		GRID ARRAY				85 Cel	-30 Cel		BOTTOM		R-XBGA-N170		1.2 mm	7.65 mm					9.25 mm
LTE3401HX	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBCC-B6	1	.4 mm	.7 mm				260	1.1 mm
BGS8L2	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBCC-B6		.4 mm	.7 mm					1.1 mm
935164740512	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
BLM6G10-30G,118	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				28 V		SMALL OUTLINE			1.37 mm			TIN	DUAL		R-PDSO-G16	3	3.6 mm	11 mm		e3	30	245	15.9 mm
SA601DK,118	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
935143730112	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
934060893135	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				28 V		SMALL OUTLINE			1.37 mm				DUAL		R-PDSO-G16		3.6 mm	11 mm					15.9 mm
934060893127	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				28 V		SMALL OUTLINE			1.37 mm				DUAL		R-PDSO-G16		3.6 mm	11 mm					15.9 mm
934060304118	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				28 V		SMALL OUTLINE							DUAL		R-PDSO-G16		3.6 mm	11 mm					15.9 mm
SA3603DH	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			2.8 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16		1.2 mm	4.4 mm	Not Qualified	e4			5 mm
OM5300	NXP Semiconductors	BASEBAND CIRCUIT		J INVERTED	66		RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY							DUAL		R-XDMA-U66				Not Qualified
UMF1000T-T	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
UMA1002T	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0018 mA	3 V	3/5	SMALL OUTLINE	SOP28,.4	Cordless Telephone ICs	1.27 mm	70 Cel	-30 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified	e4			17.9 mm
OM5301	NXP Semiconductors	RF AND BASEBAND CIRCUIT		UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1						MICROELECTRONIC ASSEMBLY							UNSPECIFIED		R-XXMA-X				Not Qualified
934060304135	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				28 V		SMALL OUTLINE							DUAL		R-PDSO-G16		3.6 mm	11 mm					15.9 mm
935164740118	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
A2I25H060GNR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT		GULL WING	17	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	LDMOS			28 V		SMALL OUTLINE, HEAT SINK/SLUG						TIN	DUAL		R-PDSO-G17	3	2.67 mm	9.02 mm		e3	40	260	17.53 mm
SA620DK-T	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
UMA1002TD-T	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE			1.27 mm	70 Cel	-30 Cel		DUAL		R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
BGS8L5	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBCC-B6		.4 mm	.7 mm					1.1 mm
SA620DK	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
BLM6G10-30G,135	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				28 V		SMALL OUTLINE			1.37 mm			Tin (Sn)	DUAL		R-PDSO-G16		3.6 mm	11 mm		e3			15.9 mm
UMA1002T-T	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE			1.27 mm	70 Cel	-30 Cel		DUAL		R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
MRFIC1814	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G16		1.2 mm	4.4 mm	Not Qualified
SA3604DH	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			2.8 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16		1.2 mm	4.4 mm	Not Qualified	e4			5 mm
MRFIC1854AR2	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.2 mm	4.4 mm					6.5 mm
SA621DH-T	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.1 mm	4.4 mm	Not Qualified				6.5 mm
SA910-T	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		300 mA	3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
SA9500DH	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			2.85 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G20		1.1 mm	4.4 mm	Not Qualified				6.5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.