RECTANGULAR Cellphone ICs 530

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX2202EMT+T10	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		2.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.69 mm	.865 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	1.27 mm
MAX2310EEI-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0415 mA	2.75 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e0			9.89 mm
MAX2422EAI+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e3	30	260	10.2 mm
MAX2392ETI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	RECTANGULAR	UNSPECIFIED	YES		BICMOS	.04 mA	3 V	3	CHIP CARRIER	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	R-XQCC-N28	1			Not Qualified	e0
MAX2312EEI	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0415 mA	2.75 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e0			9.89 mm
MAX2440EAI-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e0			10.2 mm
MAX2442EAI+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e3	30	260	10.2 mm
MAX2442EAI-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e0			10.2 mm
MAX2421EAI-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e0			10.2 mm
MAX2426EAI+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e3			10.2 mm
MAX2396EGI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	RECTANGULAR	UNSPECIFIED	YES		BICMOS	.038 mA	3 V	3	CHIP CARRIER	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	R-XQCC-N28	1			Not Qualified	e0
MAX2426EAI-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e0			10.2 mm
MAX2421EAI+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	2 mm	5.3 mm	Not Qualified	e3	30	260	10.2 mm
MAX2055EUP-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified	e0			6.5 mm
UPC8112TB-E3	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e0			2 mm
UPC8112TB	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e0			2 mm
UPG2128TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	OTHER	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	90 Cel	-30 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
UPG2121TB-E3	Renesas Electronics	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	GAAS	.0045 mA	2.8 V	2.8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	Other Telecom ICs	.65 mm	90 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e0			2 mm
UPC8194K-E1	Renesas Electronics	BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0126 mA	3 V	3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.12X.16,16	Other Telecom ICs	.4 mm	85 Cel	-25 Cel	TIN LEAD	QUAD	R-PQCC-N20		.9 mm	3 mm	Not Qualified	e0			4 mm
HD155131TF	Renesas Electronics	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	56	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1					FLATPACK				75 Cel	-20 Cel		QUAD	R-PQFP-G56				Not Qualified
HFA3600IB	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm					8.65 mm
UPC8195K-E1-A	Renesas Electronics	BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0126 mA	3 V	3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.12X.16,16	Other Telecom ICs	.4 mm	85 Cel	-25 Cel	TIN BISMUTH	QUAD	R-PQCC-N20		.9 mm	3 mm	Not Qualified	e6			4 mm
UPC8158K-E1	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0376 mA	3 V	3	CHIP CARRIER	LCC28,.20X.22,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	R-PQCC-N28		1.05 mm	5.1 mm	Not Qualified	e0			5.5 mm
UPC8186K-E1	Renesas Electronics	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	24	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.041 mA	3 V	3	CHIP CARRIER	LCC24,.16X.2,20	Other Telecom ICs	.5 mm	80 Cel	-30 Cel	TIN LEAD	QUAD	R-PQCC-N24		1.05 mm	4.1 mm	Not Qualified	e0			5.1 mm
UPC8194K-E1-A	Renesas Electronics	BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0126 mA	3 V	3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.12X.16,16	Other Telecom ICs	.4 mm	85 Cel	-25 Cel	TIN BISMUTH	QUAD	R-PQCC-N20		.9 mm	3 mm	Not Qualified	e6			4 mm
UPG2130TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	OTHER	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	90 Cel	-30 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
UPC8190K-E1	Renesas Electronics	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-25 Cel		QUAD	R-PQCC-N20		.9 mm	3 mm					4 mm
UPG174TA-E3	Renesas Electronics	RF FRONT END CIRCUIT	OTHER	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.8 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	90 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G6		1.53 mm	1.5 mm		e0			2.9 mm
UPC8195K-E1	Renesas Electronics	BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0126 mA	3 V	3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.12X.16,16	Other Telecom ICs	.4 mm	85 Cel	-25 Cel	TIN LEAD	QUAD	R-PQCC-N20		.9 mm	3 mm	Not Qualified	e0			4 mm
UPC8112TB-E3-A	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN BISMUTH	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e6			2 mm
UPG2106TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	90 Cel	-40 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
UPC8191K-E1	Renesas Electronics	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-25 Cel		QUAD	R-PQCC-N20		.9 mm	3 mm					4 mm
UPG2110TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	90 Cel	-40 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
UPG2126TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	OTHER	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	90 Cel	-30 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
RP-M110A	Littelfuse	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	45		RECTANGULAR	UNSPECIFIED	YES	1			1.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD	R-XQMA-N45		2.6 mm	14.9 mm					17.9 mm
RP-M100A	Littelfuse	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	45		RECTANGULAR	UNSPECIFIED	YES	1			1.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD	R-XQMA-N45		2.6 mm	14.9 mm					17.9 mm
RP-M2470BW	Littelfuse	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	48		RECTANGULAR	UNSPECIFIED	YES	1			1.8 V		MICROELECTRONIC ASSEMBLY				70 Cel	-20 Cel		UNSPECIFIED	R-XXMA-N48		2.4 mm	15 mm					18 mm
RP-M2455AP	Littelfuse	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	38		RECTANGULAR	UNSPECIFIED	YES	1			1.5 V		MICROELECTRONIC ASSEMBLY			1.3 mm	70 Cel	-20 Cel		QUAD	R-XQMA-N38			16 mm					22 mm
IAM-91563-TR1	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e0			2.025 mm
IAM-91563-TR1G	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified	e3		260	2.025 mm
IAM-91563-BLK	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e0			2.025 mm
IAM-91563-TR2G	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified	e3		260	2.025 mm
IAM-91563-TR2	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e0			2.025 mm
ACPM-7051-TR1	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	24		RECTANGULAR	UNSPECIFIED	YES	1			3.4 V		MICROELECTRONIC ASSEMBLY			.64 mm				QUAD	R-XQMA-N24	3	1 mm	5 mm				260	7.5 mm
ACFM-7102-TR1	Broadcom	BASEBAND CIRCUIT	INDUSTRIAL	UNSPECIFIED	6		RECTANGULAR	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY				100 Cel	-40 Cel		UNSPECIFIED	R-XXMA-X6	3			Not Qualified
ACPM-7355-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14		RECTANGULAR	UNSPECIFIED	NO	2	BIPOLAR		3.4 V		MICROELECTRONIC ASSEMBLY			.73 mm	85 Cel	-30 Cel		DUAL	R-XDMA-N14	3	1.05 mm	4 mm				260	5 mm
ACFM-7325-BLK	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	5	QCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER				85 Cel	-40 Cel	GOLD	QUAD	R-XQCC-N5	3	1.2 mm	4 mm		e4			7 mm
W3013BCL-TR	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-35 Cel	TIN LEAD	DUAL	R-PDSO-G20		1.1 mm	4.4 mm	Not Qualified	e0	30	240	6.5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.