RF AND BASEBAND CIRCUIT Cellphone ICs 1,460

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MD7IC2250NR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT		THROUGH-HOLE	14		RECTANGULAR	PLASTIC/EPOXY	NO	1			28 V		FLANGE MOUNT						MATTE TIN	DUAL	R-PDFM-T14	3			Not Qualified	e3
MC13143D	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm					4.9 mm
MC13193	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		1 mm	5 mm	Not Qualified				5 mm
LTE3401L	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6		.4 mm	.7 mm					1.1 mm
MD7IC18120GNR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT
935308612551	NXP Semiconductors	RF AND BASEBAND CIRCUIT
935318954528	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			TIN			3				e3	40	260
935314393528	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			TIN			3				e3	40	260
LTE3401H	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6		.4 mm	.7 mm					1.1 mm
MC13146FTA	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-20 Cel		QUAD	S-PQFP-G24	1	1.6 mm	4 mm					4 mm
MC13150FTB	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	3 mA	3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32		1.6 mm	7 mm	Not Qualified	e0			7 mm
MC13192FC	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32	3	1 mm	5 mm	Not Qualified		40	260	5 mm
MD7IC21100GNR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT																						3					40	260
MC13145FTA	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-20 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm					7 mm
MD7IC2251NR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			Matte Tin (Sn)			3				e3	40	260
MC13201FCR2	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-PQCC-N32	3	1 mm	5 mm	Not Qualified	e3	40	260	5 mm
MC13191FC	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32	2	1 mm	5 mm	Not Qualified		30	240	5 mm
MMM7210B	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	170	LGA	RECTANGULAR	UNSPECIFIED	YES	1			1.2 V		GRID ARRAY				85 Cel	-30 Cel		BOTTOM	R-XBGA-N170		1.2 mm	7.65 mm					9.25 mm
935295245115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		1 mm	5 mm					5 mm
935294197515	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		.85 mm	5 mm					5 mm
MC13201FC	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-PQCC-N32	3	1 mm	5 mm	Not Qualified	e3	40	260	5 mm
935377767528	NXP Semiconductors	RF AND BASEBAND CIRCUIT
LTE3401HX	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6	1	.4 mm	.7 mm				260	1.1 mm
935295517115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
MC13202FC	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-PQCC-N32	3	1 mm	5 mm	Not Qualified	e3	40	260	5 mm
935307899518	NXP Semiconductors	RF AND BASEBAND CIRCUIT
935295517518	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
935296762115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
935318586528	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			TIN			3				e3	40	260
935369413528	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			NICKEL GOLD			3				e4	40	260
935164740512	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
A3I25X050GNR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			TIN			3				e3	40	260
MWPR1024IZVHT	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			NICKEL GOLD			3				e4	40	260
SA601DK,118	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
935143730112	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
934067773115	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			NICKEL PALLADIUM GOLD			1				e4	30	260
SA900BE-T	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		4 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
BGU7060	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
A3M39TL039T2	NXP Semiconductors	RF AND BASEBAND CIRCUIT																						3					40	260
BGU7078Y	NXP Semiconductors	RF AND BASEBAND CIRCUIT																						3						260
SA3603DH	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		2.8 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16		1.2 mm	4.4 mm	Not Qualified	e4			5 mm
OM5301	NXP Semiconductors	RF AND BASEBAND CIRCUIT		UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY							UNSPECIFIED	R-XXMA-X				Not Qualified
TEF8101EN/N1Y	NXP Semiconductors	RF AND BASEBAND CIRCUIT																						2						260
BGU7063,115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
935164740118	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
A2I25H060GNR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT		GULL WING	17	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	LDMOS		28 V		SMALL OUTLINE, HEAT SINK/SLUG						TIN	DUAL	R-PDSO-G17	3	2.67 mm	9.02 mm		e3	40	260	17.53 mm
PCF5073H	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G64		1.6 mm	7 mm	Not Qualified				7 mm
SA620DK-T	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.