RF AND BASEBAND CIRCUIT Cellphone ICs 1,460

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
UAA2077TS/D	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	.028 mA	2.8 V	2.8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.65 mm	70 Cel	-30 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified	e4			5.2 mm
BGU7258X	NXP Semiconductors	RF AND BASEBAND CIRCUIT		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.06,20		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N6	1	.5 mm	1.6 mm		e4	30	260	1.6 mm
BGU7258	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.06,20		.5 mm	85 Cel	-40 Cel		DUAL	S-PDSO-N6		.5 mm	1.6 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
SA601DK-T	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
BGY284	NXP Semiconductors	RF AND BASEBAND CIRCUIT								1			3.6 V														Not Qualified
SA3601	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified				5 mm
OM5302	NXP Semiconductors	RF AND BASEBAND CIRCUIT		UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY							UNSPECIFIED	R-XXMA-X				Not Qualified
935143730118	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
BGU7073	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
935164740112	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
SA620DK,118	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
BGU7061	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
SA601DK,112	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
AFSC5G35D35T2	NXP Semiconductors	RF AND BASEBAND CIRCUIT																						3					40	260
BGU7062,518	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
BGU8822/AY	NXP Semiconductors	RF AND BASEBAND CIRCUIT
BGU8823/AY	NXP Semiconductors	RF AND BASEBAND CIRCUIT
BGS8U5	NXP Semiconductors	RF AND BASEBAND CIRCUIT
BTS7202HJ	NXP Semiconductors	RF AND BASEBAND CIRCUIT																						1						260
BTS7202UJ	NXP Semiconductors	RF AND BASEBAND CIRCUIT																						1					NOT SPECIFIED	260
BGU7073Y	NXP Semiconductors	RF AND BASEBAND CIRCUIT																						3					NOT SPECIFIED	260
BGA7210X	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32	1	.85 mm	5 mm				260	5 mm
BGA7351	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32	1	1 mm	5 mm					5 mm
BGA7350,115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32	1	1 mm	5 mm			30	260	5 mm
BGA7350,515	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		1 mm	5 mm					5 mm
BGA7210,515	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		.85 mm	5 mm					5 mm
BGA7351,115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32	1	1 mm	5 mm			30	260	5 mm
BGA7351,515	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		1 mm	5 mm					5 mm
BGA7210	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32	1	.85 mm	5 mm					5 mm
BGA7350	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32	1	1 mm	5 mm					5 mm
BGM1143N9E6327	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	8	BCC	RECTANGULAR	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B8		.77 mm	1.1 mm					1.5 mm
BGSX22G2A10	Infineon Technologies	RF AND BASEBAND CIRCUIT		BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS				CHIP CARRIER							BOTTOM	R-XBCC-B10	1
BGM1143N9	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	8	BCC	RECTANGULAR	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B8		.77 mm	1.1 mm			NOT SPECIFIED	NOT SPECIFIED	1.5 mm
CMY191	Infineon Technologies	RF AND BASEBAND CIRCUIT		GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm				DUAL	S-PDSO-G10		1.1 mm	3 mm	Not Qualified				3 mm
BGM1044N7	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm					2.3 mm
CMH0819	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	R-PQCC-N24		.9 mm	3.5 mm	Not Qualified	e0			4.5 mm
PMB2208	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.014 mA	3.6 V	2.7/4.5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G24	3	1.2 mm	4.4 mm	Not Qualified			260	7.8 mm
PMB2240	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1					FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G48		1.1 mm	7 mm	Not Qualified				7 mm
CMH192	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N20		.9 mm	3.5 mm	Not Qualified				3.5 mm
BGSA20VGL8E6327	Infineon Technologies	RF AND BASEBAND CIRCUIT
BGM1143N9E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	8	BCC	RECTANGULAR	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B8		.77 mm	1.1 mm					1.5 mm
BGM1143N9E6327XUSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT
BGM14HBA12	Infineon Technologies	RF AND BASEBAND CIRCUIT
CMY91	Infineon Technologies	RF AND BASEBAND CIRCUIT		GULL WING	6	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE			.95 mm			Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G6		1.1 mm	1.3 mm	Not Qualified	e0			2.9 mm
BGSA20UGL8E6327	Infineon Technologies	RF AND BASEBAND CIRCUIT
BGM1044N7E6327XUSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm					2.3 mm
CMY212	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	8	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE				85 Cel	-30 Cel		DUAL	R-PDSO-G8		1.1 mm	1.6 mm	Not Qualified				2.9 mm
PMB2202	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3.6 V	2.7/4.5	SMALL OUTLINE	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified	e0			7.8 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.