RF AND BASEBAND CIRCUIT Cellphone ICs 1,460

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MWPR1124ZVHT	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			NICKEL GOLD			3				e4	40	260
PCF5073H-T	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G64		1.6 mm	7 mm	Not Qualified				7 mm
SA3601W	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified				5 mm
A3I25D080GNR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT																						3					40	260
SA620DK	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
BGU7061,518	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16	3	1.4 mm	8 mm				260	8 mm
MRFIC1814	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm	Not Qualified
SA3604DH	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		2.8 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16		1.2 mm	4.4 mm	Not Qualified	e4			5 mm
MRFIC1854AR2	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.2 mm	4.4 mm					6.5 mm
SA1638BE-S	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		24 mA	3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
SA621DH-T	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.1 mm	4.4 mm	Not Qualified				6.5 mm
BGU7062	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16	3	1.4 mm	8 mm					8 mm
AFSC5G26D37T2	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			NICKEL GOLD			3				e4	40	260
SA9500DH	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		2.85 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G20		1.1 mm	4.4 mm	Not Qualified				6.5 mm
WLAN7102CZ	NXP Semiconductors	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		214 mA	3.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.07SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16	3	.7 mm	2 mm				260	2 mm
AFSC5G35D37T2	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			NICKEL GOLD			3				e4	40	260
BGU7224	NXP Semiconductors	RF AND BASEBAND CIRCUIT		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.06,20		.5 mm	85 Cel	-40 Cel		DUAL	S-PDSO-N6		.5 mm	1.6 mm					1.6 mm
SA1638BE-T	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		24 mA	3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
SA621DH	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.1 mm	4.4 mm	Not Qualified				6.5 mm
SA601DK,512	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		1.5 mm	4.4 mm		e4			6.5 mm
SA601DK	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
SA9502DH	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G20		1.1 mm	4.4 mm	Not Qualified				6.5 mm
UAA3581HN	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		2.8 V	1.6,2.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	70 Cel	-30 Cel	TIN/NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N24		1 mm	4 mm	Not Qualified	e3/e4			4 mm
BGU7063,518	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16	3	1.4 mm	8 mm			30	260	8 mm
SA900BE	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		4 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
SA1638BE	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	24 mA	3 V	3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
TEF8101EN/N1E	NXP Semiconductors	RF AND BASEBAND CIRCUIT																						2						260
SA620DK,112	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
BGU7060Y	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16	3	1.4 mm	8 mm				260	8 mm
AFSC5G37D37T2	NXP Semiconductors	RF AND BASEBAND CIRCUIT																						3					40	260
BGU7075	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
A3I25X050NR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT																			TIN			3				e3	40	260
UAA3535HL	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.066 mA	2.6 V	2.6,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel	-30 Cel	TIN	QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified	e3			7 mm
AFSC5G26D37T1	NXP Semiconductors	RF AND BASEBAND CIRCUIT
MRFIC1814R2	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm					5.1 mm
BGU7075Y	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16	3	1.4 mm	8 mm				260	8 mm
MRFIC0954R2	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.2 mm	4.4 mm					6.5 mm
SA2400ABE	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
A2I25H060NR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT		GULL WING	17	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	LDMOS		28 V		SMALL OUTLINE, HEAT SINK/SLUG						TIN	DUAL	R-PDSO-G17	3	2.67 mm	9.02 mm		e3	40	260	17.53 mm
AFRX5G372	NXP Semiconductors	RF AND BASEBAND CIRCUIT		NO LEAD	20	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG	LCC20,.25SQ,35		.9 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N20		1.218 mm	6.2 mm					6.2 mm
A3I25D080NR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT																						3					40	260
UAA3580HN	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	.063 mA	1.8 V	2.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	70 Cel	-30 Cel	TIN/NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N24		1 mm	4 mm	Not Qualified	e3/e4			4 mm
BGU7061,115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
TEF8102EN/N1E	NXP Semiconductors	RF AND BASEBAND CIRCUIT																						2						260
BGU7078	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
BGU7063	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16	3	1.4 mm	8 mm					8 mm
BGU7062,115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG			1.42 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16		1.4 mm	8 mm					8 mm
SA900BE-S	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		4 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.