NO LEAD Cellphone ICs 1,033

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Terminal Finish	Maximum Output Voltage	Terminal Position	Data Rate	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	Additional Features	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TOBY-L210-03S-03	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1						3.8 V		GRID ARRAY				65 Cel		-20 Cel			BOTTOM		R-XBGA-N152			2.87 mm	24.8 mm			-40 to 85 extended operating temp available					35.6 mm
TQP3M9036	Qorvo	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			DUAL		S-PDSO-N8		1	.95 mm	2 mm							260	2 mm
ADF7021BCPZ-RL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-XQCC-N48		3	1 mm	7 mm	Not Qualified				e3		260	7 mm
CC115LRGPT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)		QUAD	.6 Mbps	S-PQCC-N20		3	1 mm	4 mm	Not Qualified				e4	NOT SPECIFIED	260	4 mm
ADF4360-7BCPZRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
SKY13524-639LF	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	90 Cel		-30 Cel			QUAD		S-XQCC-N14			.5 mm	1.6 mm						NOT SPECIFIED	NOT SPECIFIED	1.6 mm
LT5526EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-PQCC-N16		1	.8 mm	4 mm	Not Qualified				e3	30	260	4 mm
ADF4360-0BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
AT86RF233-ZUR	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			3 V	1.8,3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-XQCC-N32			1 mm	5 mm	Not Qualified				e3			5 mm
ADF7020-1BCPZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-XQCC-N48		3	1 mm	7 mm	Not Qualified				e3	30	260	7 mm
ADF4360-7BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
ADF4360-0BCPZRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
CC1020RSSR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)		QUAD	.1536 Mbps	S-XQCC-N32		3	1 mm	7 mm	Not Qualified				e4	NOT SPECIFIED	260	7 mm
NRF9160-SIBA-B1A-R	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	1						3.8 V		GRID ARRAY	LGA127,21X30,20		.5 mm	85 Cel		-40 Cel			BOTTOM		R-XBGA-N127			1.1 mm	10.5 mm								16 mm
1185	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel			QUAD		S-PQCC-N16			.95 mm	4 mm	Not Qualified							4 mm
ADF7021BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-XQCC-N48		3	1 mm	7 mm	Not Qualified				e3	40	260	7 mm
RFX2401C	Skyworks Solutions	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel			QUAD		S-XQCC-N16			.6 mm	3 mm						NOT SPECIFIED	NOT SPECIFIED	3 mm
SX8652IWLTRT	Semtech	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1						1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		DUAL		R-PDSO-N14		2	.8 mm	3 mm	Not Qualified				e3		260	4 mm
MAX-7W-0	U-blox Ag	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1				AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel		-40 Cel			DUAL		R-XDMA-N18		4	2.7 mm	9.7 mm								10.1 mm
HMC832ALP6GETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	TIN		QUAD		S-XQCC-N40		1	.9 mm	6 mm					e3	30	260	6 mm
HMC830LP6GE	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-PQCC-N40		1	.9 mm	6 mm	Not Qualified				e3		260	6 mm
SKY13522-644LF	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	8	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	90 Cel		-30 Cel			QUAD		S-XQCC-N8			.5 mm	1.1 mm						NOT SPECIFIED	NOT SPECIFIED	1.1 mm
CC115LRTKR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.6 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-PQCC-N20		3	.9 mm	4 mm	Not Qualified				e4	30	260	4 mm
ADF4360-0BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
M95FA-03-STD	Quectel Wireless Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	42	QMA	RECTANGULAR	UNSPECIFIED	YES	1						4 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel			QUAD		R-XQMA-N42			2.65 mm	19.9 mm								23.6 mm
CC2591RGVR	Texas Instruments	RF FRONT END CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					4 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-PQCC-N16		2	1 mm	4 mm	Not Qualified				e4	30	260	4 mm
HMC832ALP6GE	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	TIN		QUAD		S-XQCC-N40		1	.9 mm	6 mm					e3	30	260	6 mm
SI4711-B30-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-20 Cel			QUAD		S-XQCC-N20			.6 mm	3 mm	Not Qualified					NOT SPECIFIED	NOT SPECIFIED	3 mm
SARA-R412M-02B-03	U-blox Ag	RF AND BASEBAND CIRCUIT	COMMERCIAL	NO LEAD	96	LGA	RECTANGULAR	UNSPECIFIED	YES	1						3.8 V		GRID ARRAY	LGA96(UNSPEC)			65 Cel		-20 Cel			BOTTOM		R-XLGA-N96		4	2.78 mm	16 mm			-40 to 85 extended operating temp available					26 mm
SI4711-B30-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-20 Cel			QUAD		S-XQCC-N20			.6 mm	3 mm	Not Qualified					NOT SPECIFIED	NOT SPECIFIED	3 mm
AT86RF231-ZF	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			3 V	1.8,3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-XQCC-N32			1 mm	5 mm	Not Qualified				e3			5 mm
LT5575EUF#TRPBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-PQCC-N16		1	.8 mm	4 mm	Not Qualified				e3	30	260	4 mm
ADF4360-8BCPZRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
HL7692	Sierra Wireless	RF AND BASEBAND CIRCUIT		NO LEAD	146	LGA	RECTANGULAR	UNSPECIFIED	YES	1						3.7 V		GRID ARRAY	LGA146(UNSPEC)			85 Cel		-40 Cel			BOTTOM		R-XBGA-N146			2.7 mm	22 mm			Also Operates with class A: -30 deg c to 70 deg c					23 mm
SI4136-F-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		.031 mA	3 V	3/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-XQCC-N28		3	.9 mm	5 mm	Not Qualified				e3		260	5 mm
BGA777N7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1						2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-30 Cel	TIN		DUAL		R-PDSO-N6		1	.4 mm	1.3 mm					e3			2 mm
MAX5865ETM-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	OFFSET BINARY	2	CMOS			3 V	1.8,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Codecs	.5 mm	85 Cel	8	-40 Cel	TIN LEAD	3 V	QUAD		S-XQCC-N48	VOLTAGE		.8 mm	7 mm	Not Qualified	DIFFERENTIAL		1.5 V	e0			7 mm
MAX5865ETM+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		QUAD		S-XQCC-N48		1	.8 mm	7 mm	Not Qualified				e3	30	260	7 mm
SI4713-B30-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-20 Cel			QUAD		S-XQCC-N20			.6 mm	3 mm	Not Qualified					NOT SPECIFIED	NOT SPECIFIED	3 mm
LLCC68IMLTRT	Semtech	RF AND BASEBAND CIRCUIT		NO LEAD	24	HVQCCN	SQUARE		YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-XQCC-N24		1	1 mm	4 mm					e3		260	4 mm
LT5575EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-PQCC-N16		1	.8 mm	4 mm	Not Qualified				e3	30	260	4 mm
S2-LPTXQTR	STMicroelectronics	RF AND BASEBAND CIRCUIT		NO LEAD	24	HVQCCN	SQUARE		YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	105 Cel		-40 Cel			QUAD		S-XQCC-N24			1 mm	4 mm						NOT SPECIFIED	NOT SPECIFIED	4 mm
AT86RF233-ZF	Microchip Technology	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel	MATTE TIN		QUAD		S-XQCC-N32			1 mm	5 mm					e3			5 mm
AT86RF233-ZFR	Microchip Technology	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel	MATTE TIN		QUAD		S-XQCC-N32			1 mm	5 mm					e3			5 mm
CC1110F32RSP	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-XQCC-N36		3	.9 mm	6 mm	Not Qualified				e4	30	260	6 mm
SARA-G350-02S-00	U-blox Ag	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	96		RECTANGULAR	UNSPECIFIED	YES	1						3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel		-30 Cel			UNSPECIFIED		R-XXMA-N96		4	2.65 mm	16 mm						60	245	26 mm
SI4721-B20-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-20 Cel			QUAD		S-XQCC-N20			.6 mm	3 mm	Not Qualified					NOT SPECIFIED	NOT SPECIFIED	3 mm
AD6673BCPZ-250	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		.282 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-XQCC-N48		3	.8 mm	7 mm	Not Qualified				e3	30	260	7 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.