NO LEAD Cellphone ICs 1,033

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SE5007BT-R	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N16		.6 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
SKY13491-21	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	22		SQUARE	UNSPECIFIED	YES	1				2.85 V		MICROELECTRONIC ASSEMBLY			.4 mm	90 Cel	-30 Cel			QUAD	S-XQMA-N22	3	.9 mm	2.5 mm				260	2.9 mm
SKY13529-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	17		RECTANGULAR	UNSPECIFIED	YES	1				2.85 V		MICROELECTRONIC ASSEMBLY				90 Cel	-35 Cel			QUAD	R-XQMA-N17		.84 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	4 mm
SKY53735-21	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	47	HVQCCN	RECTANGULAR		YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC47,.16X.24,16		.4 mm	85 Cel	-30 Cel			QUAD	R-XQCC-N47	3	.7 mm	4.2 mm				260	6.2 mm
SKY58081-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	56	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			3200 mA	3.4 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.23X.3,17		.44 mm	110 Cel	-40 Cel			QUAD	R-PQCC-N56		.7 mm	6 mm					7.6 mm
SKY65174-21	Skyworks Solutions	RF FRONT END CIRCUIT	OTHER	NO LEAD	10		SQUARE	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY			.5 mm	85 Cel	-35 Cel			DUAL	S-XDMA-N10		.95 mm	4 mm			NOT SPECIFIED	NOT SPECIFIED	4 mm
SKY66115-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE		YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,32		.8 mm	85 Cel	-40 Cel		GOLD OVER NICKEL	QUAD	S-XQCC-N16	3	1 mm	4 mm		e4		260	4 mm
SKY73083-21	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N36	3	1.15 mm	6 mm	Not Qualified			260	6 mm
SKY73208-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36		SQUARE	UNSPECIFIED	YES	1		BICMOS		3.3 V		MICROELECTRONIC ASSEMBLY			.5 mm	85 Cel	-40 Cel			QUAD	S-XQMA-N36	3	1.45 mm	6 mm				260	6 mm
SKY73420-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm					QUAD	S-XQCC-N36		.9 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
SKY77762-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	10		SQUARE	UNSPECIFIED	NO	1				3.4 V		MICROELECTRONIC ASSEMBLY				75 Cel	-30 Cel			DUAL	S-XDMA-N10		1 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
SKY85402-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N20	3	.9 mm	4 mm				260	4 mm
ADF7020BCPZ-RL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3		260	7 mm
ADF7021-VBCPZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3	30	260	7 mm
ADRF6701ACPZ-R7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES			BICMOS		5 V	5	CHIP CARRIER	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD	S-PQCC-N40				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
AT86RF231-ZU	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3 V	1.8,3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N32		1 mm	5 mm	Not Qualified	e3			5 mm
HMC689LP4ETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N24	1	1 mm	4 mm		e3	30	260	4 mm
LMH6523SQE/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	54	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1	4		485 mA	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	25.74 dB	MATTE TIN	QUAD	R-XQCC-N54	2	.8 mm	5.5 mm		e3	30	260	10 mm
CC2400RSU	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N48		1 mm	7 mm	Not Qualified				7 mm
CC2420	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N48			7 mm	Not Qualified				7 mm
CC2510F8RHH	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N36	3	1 mm	6 mm	Not Qualified	e4	30	260	6 mm
CC2511F16RSPG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N36	3	.9 mm	6 mm	Not Qualified	e4	30	260	6 mm
CC2510F32RHHT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	S-PQCC-N36	3	1 mm	6 mm	Not Qualified	e4	NOT SPECIFIED	260	6 mm
LMH6522SQ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	54	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD	R-XQCC-N54		.8 mm	5.5 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
LMV227SDX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V		SMALL OUTLINE, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		TIN	DUAL	R-XDSO-N6	1	.8 mm	2.2 mm	Not Qualified	e3			2.5 mm
CC2510F32RHH	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N36	3	1 mm	6 mm	Not Qualified	e4	30	260	6 mm
CC2420Z-RTR1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1.8 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N48		.9 mm	7 mm	Not Qualified				7 mm
CC2511F16RSP	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3.3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-XQCC-N36	3	.9 mm	6 mm	Not Qualified	e4	NOT SPECIFIED	260	6 mm
HPA02142RGVR	Texas Instruments	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			4 mA	3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25		.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N16	2	1 mm	4 mm		e4	30	260	4 mm
LMH6521SQX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	VQCCN	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N32		.8 mm	5 mm					5 mm
LMV225SDX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		TIN	DUAL	R-XDSO-N6	1	.8 mm	2.2 mm	Not Qualified	e3			2.5 mm
CC2510F8RHHR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	S-PQCC-N36	3	1 mm	6 mm	Not Qualified	e4	NOT SPECIFIED	260	6 mm
CC1260RGZR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	QUAD	S-PQCC-N48	3	1 mm	7 mm		e4	30	260	7 mm
CC2511F16RSPRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N36	3	.9 mm	6 mm	Not Qualified	e4	30	260	6 mm
CC2400-STB1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1.8 V	1.8,1.8/3.3	CHIP CARRIER, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N48		1 mm	7 mm	Not Qualified				7 mm
CC2420-RTR2	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1.8 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N48		.9 mm	7 mm	Not Qualified				7 mm
CC2420RGZT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3.3 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N48	3	1 mm	7 mm	Not Qualified	e4	30	260	7 mm
LMH9226IRRLR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1		100 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC12,.08SQ,20		.5 mm	105 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	QUAD	S-PQCC-N12	2	.8 mm	2 mm		e4	30	260	2 mm
CC2511F8RSPRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N36	3	.9 mm	6 mm	Not Qualified	e4	30	260	6 mm
LP3939ILQ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD	S-PQCC-N16		.8 mm	4 mm					4 mm
LMV227SD	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V		SMALL OUTLINE, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	R-XDSO-N6	1	.8 mm	2.2 mm	Not Qualified	e0			2.5 mm
CC2510F8RHHT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	S-PQCC-N36	3	1 mm	6 mm	Not Qualified	e4	NOT SPECIFIED	260	6 mm
CC2511F8RSPG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N36	3	.9 mm	6 mm	Not Qualified	e4	30	260	6 mm
LMV225SD	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	R-XDSO-N6	1	.8 mm	2.2 mm	Not Qualified	e0		260	2.5 mm
LMH6521SQ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	VQCCN	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N32		.8 mm	5 mm					5 mm
CC2510F32RSPRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N36	3	.9 mm	6 mm	Not Qualified	e4	30	260	6 mm
CC2510F16RSPRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N36	3	.9 mm	6 mm	Not Qualified	e4	30	260	6 mm
CC2420ZRTCR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1.8 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N48	3	.9 mm	7 mm	Not Qualified	e4	30	260	7 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.