Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Width | Qualification | Companding Law | Input Type | Additional Features | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
OTHER |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3.3 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-XQCC-N36 |
3 |
.9 mm |
6 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
6 mm |
|||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N36 |
3 |
.9 mm |
6 mm |
Not Qualified |
e4 |
30 |
260 |
6 mm |
|||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1439 mA |
1.15 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N72 |
3 |
.9 mm |
10 mm |
e4 |
30 |
260 |
10 mm |
|||||||||||||||||||||
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N16 |
.8 mm |
4 mm |
4 mm |
||||||||||||||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N36 |
3 |
.9 mm |
6 mm |
Not Qualified |
e4 |
30 |
260 |
6 mm |
|||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
1.8,1.8/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N48 |
3 |
1 mm |
7 mm |
Not Qualified |
e4 |
30 |
260 |
7 mm |
|||||||||||||||||
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1.8 V |
1.8,1.8/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N48 |
.9 mm |
7 mm |
Not Qualified |
7 mm |
|||||||||||||||||||||||
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.95 mm |
4 mm |
Not Qualified |
4 mm |
||||||||||||||||||||||||||
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
.8 mm |
5 mm |
5 mm |
||||||||||||||||||||||||||||
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
54 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N54 |
.8 mm |
5.5 mm |
10 mm |
||||||||||||||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1.8 V |
1.8,1.8/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
Not Qualified |
e4 |
30 |
260 |
7 mm |
|||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
OTHER |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N36 |
3 |
.9 mm |
6 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
6 mm |
|||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
54 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
4 |
485 mA |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
25.74 dB |
MATTE TIN |
QUAD |
R-XQCC-N54 |
2 |
.8 mm |
5.5 mm |
e3 |
30 |
260 |
10 mm |
|||||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1.8 V |
1.8,1.8/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
Not Qualified |
e4 |
30 |
260 |
7 mm |
|||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1439 mA |
1.15 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N72 |
3 |
.9 mm |
10 mm |
e4 |
30 |
260 |
10 mm |
|||||||||||||||||||||
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.95 mm |
4 mm |
Not Qualified |
4 mm |
||||||||||||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
OTHER |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3.3 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N36 |
3 |
.9 mm |
6 mm |
Not Qualified |
e4 |
30 |
260 |
6 mm |
|||||||||||||||||
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1.8 V |
1.8,1.8/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N48 |
.9 mm |
7 mm |
Not Qualified |
7 mm |
|||||||||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1.8 V |
1.8,1.8/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
Not Qualified |
e4 |
30 |
260 |
7 mm |
|||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
S-PQCC-N48 |
3 |
1 mm |
7 mm |
e4 |
30 |
260 |
7 mm |
|||||||||||||||||||||
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
HVSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
2.7 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-XDSO-N6 |
1 |
.8 mm |
2.2 mm |
Not Qualified |
e0 |
2.5 mm |
||||||||||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
S-PQCC-N36 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
6 mm |
|||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2 |
245 mA |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
26 dB |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
.8 mm |
5 mm |
e3 |
30 |
260 |
5 mm |
|||||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N36 |
3 |
.9 mm |
6 mm |
Not Qualified |
e4 |
30 |
260 |
6 mm |
|||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N36 |
3 |
.9 mm |
6 mm |
Not Qualified |
e4 |
30 |
260 |
6 mm |
|||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N36 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
30 |
260 |
6 mm |
|||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
||||||||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
OTHER |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3.3 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-XQCC-N36 |
3 |
.9 mm |
6 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
6 mm |
|||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
54 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
4 |
485 mA |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC54,.2X.39,20 |
.5 mm |
85 Cel |
-40 Cel |
25.74 dB |
MATTE TIN |
QUAD |
R-XQCC-N54 |
2 |
.8 mm |
5.5 mm |
e3 |
30 |
260 |
10 mm |
||||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
NO LEAD |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
8 mA |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
MATTE TIN |
DUAL |
R-PDSO-N6 |
1 |
e3 |
30 |
260 |
|||||||||||||||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
HVSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
2.7 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
TIN |
DUAL |
R-XDSO-N6 |
1 |
.8 mm |
2.2 mm |
Not Qualified |
e3 |
2.5 mm |
|||||||||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1.8 V |
1.8,1.8/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
Not Qualified |
e4 |
30 |
260 |
7 mm |
|||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N36 |
3 |
.9 mm |
6 mm |
Not Qualified |
e4 |
30 |
260 |
6 mm |
|||||||||||||||||
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1.8 V |
1.8,1.8/3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N48 |
1 mm |
7 mm |
Not Qualified |
7 mm |
|||||||||||||||||||||||
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
.005 mA |
1.8 V |
1.8,1.8/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N48 |
1 mm |
7 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
||||||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N48 |
1 mm |
7 mm |
7 mm |
||||||||||||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
HQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
S-XQCC-N12 |
2 |
e4 |
30 |
260 |
|||||||||||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
||||||||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1 |
8 mA |
2.7 V |
SMALL OUTLINE, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-XDSO-N6 |
1 |
.8 mm |
2.2 mm |
Not Qualified |
e3 |
30 |
260 |
2.5 mm |
|||||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2.7 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-N6 |
1 |
.8 mm |
2.2 mm |
e3 |
30 |
260 |
2.5 mm |
||||||||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
S-PQCC-N36 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
6 mm |
|||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N36 |
3 |
.9 mm |
6 mm |
Not Qualified |
e4 |
30 |
260 |
6 mm |
|||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
54 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
4 |
485 mA |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
25.74 dB |
MATTE TIN |
QUAD |
R-XQCC-N54 |
2 |
.8 mm |
5.5 mm |
e3 |
30 |
260 |
10 mm |
|||||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N36 |
3 |
.9 mm |
6 mm |
Not Qualified |
e4 |
30 |
260 |
6 mm |
|||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,25 |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
3 |
.95 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
|||||||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2.7 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-N6 |
1 |
.8 mm |
2.2 mm |
e3 |
30 |
260 |
2.5 mm |
||||||||||||||||||||||
|
Texas Instruments |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1 |
8 mA |
2.7 V |
SMALL OUTLINE, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-XDSO-N6 |
1 |
.8 mm |
2.2 mm |
Not Qualified |
e3 |
30 |
260 |
2.5 mm |
|||||||||||||||||||
|
Texas Instruments |
RF FRONT END CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
4 mA |
3 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.
Some common types of cellphone ICs include:
1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.
2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.
3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.
5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.