NO LEAD Cellphone ICs 1,033

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Terminal Finish	Maximum Output Voltage	Terminal Position	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	Additional Features	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ADF4360-3BCPZRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
SKY66101-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36		SQUARE	UNSPECIFIED	YES	1					3.6 V		MICROELECTRONIC ASSEMBLY			.5 mm	85 Cel		-40 Cel			QUAD	S-XQMA-N36			1 mm	6 mm						NOT SPECIFIED	NOT SPECIFIED	6 mm
HMC602LP4	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	TIN LEAD		QUAD	S-PQCC-N24		1	1 mm	4 mm	Not Qualified				e0			4 mm
HMC786LP4ETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-PQCC-N24		1	1 mm	4 mm					e3	30	260	4 mm
LT5558EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-PQCC-N16		1	.8 mm	4 mm	Not Qualified				e3	30	260	4 mm
SI4710-B30-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-20 Cel			QUAD	S-XQCC-N20			.6 mm	3 mm	Not Qualified					NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4710-B30-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-20 Cel			QUAD	S-XQCC-N20			.6 mm	3 mm	Not Qualified					NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4136-F-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N28		3	.9 mm	5 mm	Not Qualified				e3		260	5 mm
SI4712-B30-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-20 Cel			QUAD	S-XQCC-N20			.6 mm	3 mm	Not Qualified					NOT SPECIFIED	NOT SPECIFIED	3 mm
HMC786LP4E	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	R-PQCC-N24		1	1 mm	4 mm	Not Qualified				e3		260	4 mm
SKY13437-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	22		RECTANGULAR	UNSPECIFIED	YES	1					2.85 V		MICROELECTRONIC ASSEMBLY			.4 mm	90 Cel		-35 Cel			QUAD	R-XQMA-N22		3	.9 mm	2.5 mm							260	3.2 mm
TRF372017IRGZT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				.25 mA	3.3 V	3.3,5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD	S-PQCC-N48		2	1 mm	7 mm	Not Qualified				e4	30	260	7 mm
ADF4360-2BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
ADF7020-1BCPZ-RL7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified				e3	30	260	7 mm
CC2591RGVRG4	Texas Instruments	RF FRONT END CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				4 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQCC-N16		2	1 mm	4 mm	Not Qualified				e4	30	260	4 mm
MAX5865ETM	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	OFFSET BINARY	2	CMOS		3 V	1.8,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Codecs	.5 mm	85 Cel	8	-40 Cel	TIN LEAD	3 V	QUAD	S-XQCC-N48	VOLTAGE	1	.8 mm	7 mm	Not Qualified	DIFFERENTIAL		1.5 V	e0		245	7 mm
MAX5865ETM+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		QUAD	S-XQCC-N48		1	.8 mm	7 mm	Not Qualified				e3	30	260	7 mm
SKY78117-14	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	34		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY									UNSPECIFIED	R-XXMA-N34										NOT SPECIFIED	NOT SPECIFIED
1168	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N16			.95 mm	4 mm	Not Qualified							4 mm
ADF4360-2BCPZRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
LTC5594IUH#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel		-40 Cel	MATTE TIN		QUAD	S-PQCC-N32		1	.8 mm	5 mm					e3		260	5 mm
NRF24L01-REEL7	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N20		2	.95 mm	4 mm					e3		260	4 mm
SI4713	Silicon Labs	RF AND BASEBAND CIRCUIT		NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm						QUAD	S-XQCC-N20			.6 mm	3 mm	Not Qualified							3 mm
TOBY-L210-65S	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		GRID ARRAY				65 Cel		-20 Cel			BOTTOM	R-XBGA-N152		4	2.87 mm	24.8 mm			-40 to 85 extended operating temp available					35.6 mm
TRF370317IRGER	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				.245 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQCC-N24		2	1 mm	4 mm	Not Qualified				e4	30	260	4 mm
TRF370317IRGET	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				.245 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQCC-N24		2	1 mm	4 mm	Not Qualified				e4	30	260	4 mm
AD6672BCPZ-250	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.145 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N32		3	.8 mm	5 mm	Not Qualified				e3	30	260	5 mm
AD6672BCPZRL7-250	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.145 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N32		3	.8 mm	5 mm	Not Qualified				e3	30	260	5 mm
ADF4360-2BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3		260	4 mm
BGA713N7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1					2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-30 Cel	TIN		DUAL	R-PDSO-N6		1	.4 mm	1.3 mm					e3			2 mm
BGA7L1BN6E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					2.8 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel		-40 Cel	TIN		BOTTOM	R-PBCC-N6		1	.4 mm	.7 mm					e3			1.1 mm
CC1100RTKR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N20		3	.95 mm	4 mm	Not Qualified				e3	30	260	4 mm
CC2511F32RSPR	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3.3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel		0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	S-XQCC-N36		3	.9 mm	6 mm	Not Qualified				e4	NOT SPECIFIED	260	6 mm
J-N3-B3E6-LR	Telit Communications Plc	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE				85 Cel		-40 Cel			DUAL	R-PDSO-N24			2.4 mm	12.2 mm								16 mm
LT5527EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-PQCC-N16		1	.8 mm	4 mm	Not Qualified				e3	30	260	4 mm
SKY65364-21	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28		SQUARE	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel			QUAD	S-XQMA-N28			1 mm	6 mm						NOT SPECIFIED	NOT SPECIFIED	6 mm
TRF3705IRGET	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQCC-N24		2	1 mm	4 mm	Not Qualified				e4	30	260	4 mm
ADF4360-2BCP	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	TIN LEAD		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e0		240	4 mm
ADF4360-2BCPRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	TIN LEAD		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e0		240	4 mm
ADF4360-2BCPRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	TIN LEAD		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e0		240	4 mm
ADF4360-3BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
ADF4360-3BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
ADF7020BCPZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified				e3	40	260	7 mm
CC1110F32RSPR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-XQCC-N36		3	.9 mm	6 mm	Not Qualified				e4	30	260	6 mm
CC1111F32RSPRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	QCCN	SQUARE	PLASTIC/EPOXY	YES				CMOS		3 V	3	CHIP CARRIER	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel		0 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQCC-N36		3			Not Qualified				e4	30	260
CC2511F32RSP	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		3.3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel		0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	S-XQCC-N36		3	.9 mm	6 mm	Not Qualified				e4	NOT SPECIFIED	260	6 mm
HMC602LP4E	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-PQCC-N24		1	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
HMC702LP6CE	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-PQCC-N40		1	.9 mm	6 mm	Not Qualified				e3			6 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.