HBGA Network Interfaces 27

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD9371BBCZ	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V		GRID ARRAY, HEAT SINK/SLUG			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm		e1	30	260	12 mm
AD9371BBCZ-REEL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V		GRID ARRAY, HEAT SINK/SLUG			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm		e1	30	260	12 mm
CYP15G0401DXB-BGXI	Infineon Technologies	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	4	1.1 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e1	20	260	27 mm
CYP15G0403DXB-BGXC	Infineon Technologies	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	4	1.32 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e1	20	260	27 mm
CYP15G0401DXB-BGXC	Infineon Technologies	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	4	1.1 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e1	20	260	27 mm
CYP15G0403DXB-BGXI	Cypress Semiconductor	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	4	1.32 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e1	20	260	27 mm
BCM52311A1HH0H275S	Broadcom	TELECOM CIRCUIT		BALL	1152	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				.85 V		GRID ARRAY, HEAT SINK/SLUG	BGA1152,34X34,40		1 mm	105 Cel	0 Cel		BOTTOM	12500 Mbps	S-PBGA-B1152		3.21 mm	35 mm					35 mm
CYW15G0403DXB-BGI	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	4	1.32 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e0			27 mm
CYP15G0401DXB-BGI	Cypress Semiconductor	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	4		3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e0			27 mm
VSC8244XHG	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	260	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	4		1.2 V		GRID ARRAY, HEAT SINK/SLUG	BGA260,18X18,40		1 mm	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1000 Mbps	S-PBGA-B260	4	2 mm	19 mm		e1	30	260	19 mm
TLK3118GDV	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	BALL	400	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V	1.2,1.5,2.5	GRID ARRAY, HEAT SINK/SLUG	BGA400,20X20,40	Other Telecom ICs	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B400	4	3.65 mm	21 mm	Not Qualified	e0	20	220	21 mm
CYV15G0401DXB-BGXC	Infineon Technologies	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	4	1.1 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e1	20	260	27 mm
BCM52311A1HH0H375D	Broadcom	TELECOM CIRCUIT		BALL	1152	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				.85 V		GRID ARRAY, HEAT SINK/SLUG	BGA1152,34X34,40		1 mm	105 Cel	0 Cel		BOTTOM	12500 Mbps	S-PBGA-B1152		3.21 mm	35 mm					35 mm
BCM52311A1EH0H774S	Broadcom	TELECOM CIRCUIT		BALL	1152	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				.85 V		GRID ARRAY, HEAT SINK/SLUG	BGA1152,34X34,40		1 mm	105 Cel	-40 Cel		BOTTOM	12500 Mbps	S-PBGA-B1152		3.21 mm	35 mm					35 mm
BCM52311A1HH0H325D	Broadcom	TELECOM CIRCUIT		BALL	1152	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				.85 V		GRID ARRAY, HEAT SINK/SLUG	BGA1152,34X34,40		1 mm	105 Cel	0 Cel		BOTTOM	27343.75 Mbps	S-PBGA-B1152		3.21 mm	35 mm					35 mm
BCM52311A1HH0H674S	Broadcom	TELECOM CIRCUIT		BALL	1152	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				.85 V		GRID ARRAY, HEAT SINK/SLUG	BGA1152,34X34,40		1 mm	105 Cel	0 Cel		BOTTOM	12500 Mbps	S-PBGA-B1152		3.21 mm	35 mm					35 mm
BCM52311A1HH0H175S	Broadcom	TELECOM CIRCUIT		BALL	1152	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				.85 V		GRID ARRAY, HEAT SINK/SLUG	BGA1152,34X34,40		1 mm	105 Cel	0 Cel		BOTTOM	12500 Mbps	S-PBGA-B1152		3.21 mm	35 mm					35 mm
BCM52311A1HH0H375S	Broadcom	TELECOM CIRCUIT		BALL	1152	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				.85 V		GRID ARRAY, HEAT SINK/SLUG	BGA1152,34X34,40		1 mm	105 Cel	0 Cel		BOTTOM	12500 Mbps	S-PBGA-B1152		3.21 mm	35 mm					35 mm
BCM52311A1HH0H274S	Broadcom	TELECOM CIRCUIT		BALL	1152	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				.85 V		GRID ARRAY, HEAT SINK/SLUG	BGA1152,34X34,40		1 mm	105 Cel	0 Cel		BOTTOM	12500 Mbps	S-PBGA-B1152		3.21 mm	35 mm					35 mm
BCM52311A1HH0H774S	Broadcom	TELECOM CIRCUIT		BALL	1152	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				.85 V		GRID ARRAY, HEAT SINK/SLUG	BGA1152,34X34,40		1 mm	105 Cel	0 Cel		BOTTOM	12500 Mbps	S-PBGA-B1152		3.21 mm	35 mm					35 mm
BCM52311A1HH0H675S	Broadcom	TELECOM CIRCUIT		BALL	1152	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				.85 V		GRID ARRAY, HEAT SINK/SLUG	BGA1152,34X34,40		1 mm	105 Cel	0 Cel		BOTTOM	12500 Mbps	S-PBGA-B1152		3.21 mm	35 mm					35 mm
BCM52311A1HH0H274D	Broadcom	TELECOM CIRCUIT		BALL	1152	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				.85 V		GRID ARRAY, HEAT SINK/SLUG	BGA1152,34X34,40		1 mm	105 Cel	0 Cel		BOTTOM	12500 Mbps	S-PBGA-B1152		3.21 mm	35 mm					35 mm
BCM52311A1HH0H275D	Broadcom	TELECOM CIRCUIT		BALL	1152	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				.85 V		GRID ARRAY, HEAT SINK/SLUG	BGA1152,34X34,40		1 mm	105 Cel	0 Cel		BOTTOM	12500 Mbps	S-PBGA-B1152		3.21 mm	35 mm					35 mm
BCM52311A1HH0H174S	Broadcom	TELECOM CIRCUIT		BALL	1152	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				.85 V		GRID ARRAY, HEAT SINK/SLUG	BGA1152,34X34,40		1 mm	105 Cel	0 Cel		BOTTOM	12500 Mbps	S-PBGA-B1152		3.21 mm	35 mm					35 mm
BCM52311A1EH0H275S	Broadcom	TELECOM CIRCUIT		BALL	1152	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				.85 V		GRID ARRAY, HEAT SINK/SLUG	BGA1152,34X34,40		1 mm	105 Cel	-40 Cel		BOTTOM	12500 Mbps	S-PBGA-B1152		3.21 mm	35 mm					35 mm
BCM52311A1HH0H625D	Broadcom	TELECOM CIRCUIT		BALL	1152	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				.85 V		GRID ARRAY, HEAT SINK/SLUG	BGA1152,34X34,40		1 mm	105 Cel	0 Cel		BOTTOM	27343.75 Mbps	S-PBGA-B1152		3.21 mm	35 mm					35 mm
BCM52311A1HH0H324S	Broadcom	TELECOM CIRCUIT		BALL	1152	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				.85 V		GRID ARRAY, HEAT SINK/SLUG	BGA1152,34X34,40		1 mm	105 Cel	0 Cel		BOTTOM	27343.75 Mbps	S-PBGA-B1152		3.21 mm	35 mm					35 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.