BALL Network Interfaces 343

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
88E1111-B2-BAB1I000	Marvell Technology	ETHERNET TRANSCEIVER		BALL	117	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		1 V		GRID ARRAY, LOW PROFILE			1 mm				BOTTOM		R-PBGA-B117		1.54 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	14 mm
88E1111-B2-BAB2I000	Marvell Technology	ETHERNET TRANSCEIVER		BALL	117	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		1 V		GRID ARRAY, LOW PROFILE			1 mm				BOTTOM		R-PBGA-B117		1.54 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	14 mm
AD9371BBCZ	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	HBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.3 V		GRID ARRAY, HEAT SINK/SLUG			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm			e1	30	260	12 mm
88E1111-B2-BAB1C000	Marvell Technology	ETHERNET TRANSCEIVER		BALL	117	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		1 V		GRID ARRAY, LOW PROFILE			1 mm			TIN SILVER COPPER	BOTTOM		R-PBGA-B117		1.54 mm	10 mm			e1			14 mm
SJA1105PELY	NXP Semiconductors	SUPPORT CIRCUIT		BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		200 mA	1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32		.8 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B159	3	1.5 mm	12 mm					260	12 mm
AD9371BBCZ-REEL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	HBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.3 V		GRID ARRAY, HEAT SINK/SLUG			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm			e1	30	260	12 mm
CYP15G0101DXB-BBXI	Infineon Technologies	INTERFACE CIRCUIT	INDUSTRIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		1	.51 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA100,10X10,40	Network Interfaces	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B100	3	1.4 mm	11 mm	Not Qualified		e1	20	260	11 mm
VSC8211XVW	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	117	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	324 mA	1.2 V		GRID ARRAY, LOW PROFILE	BGA117,9X13,40		1 mm	100 Cel	0 Cel		BOTTOM	1000 Mbps	R-PBGA-B117		1.7 mm	10 mm						14 mm
88E1111-XX-BAB1I000	Marvell Technology	ETHERNET TRANSCEIVER		BALL	117	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		1 V		GRID ARRAY, LOW PROFILE	BGA117,9X13,40		1 mm				BOTTOM	1000 Mbps	R-PBGA-B117		1.54 mm	10 mm	Not Qualified	IT ALSO REQUIRES 2.5V DIGITAL SUPPLY				14 mm
CYP15G0101DXB-BBXC	Infineon Technologies	INTERFACE CIRCUIT	COMMERCIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		1	.5 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA100,10X10,40	Network Interfaces	1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B100	3	1.4 mm	11 mm	Not Qualified		e1	20	260	11 mm
VSC8662XIC-03	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2		1.2 V		GRID ARRAY	BGA256,16X16,40		1 mm	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1000 Mbps	S-PBGA-B256		2 mm	17 mm			e1			17 mm
VSC8221XHH	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			1	367 mA	3.3 V	1.2,3.3	GRID ARRAY, FINE PITCH	BGA100,10X10,32	Network Interfaces	.8 mm	70 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B100		1.1 mm	9 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	9 mm
VSC8504XKS-05	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			4	900 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
88E1111-B2-BAB2C000	Marvell Technology	ETHERNET TRANSCEIVER		BALL	117	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				1 V		GRID ARRAY, LOW PROFILE			1 mm			TIN SILVER COPPER	BOTTOM		R-PBGA-B117		1.54 mm	10 mm			e1			14 mm
88E1548PA0-BAM2I000	Marvell Technology	ETHERNET TRANSCEIVER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1		1 V		GRID ARRAY, LOW PROFILE	BGA196,14X14,40		1 mm	85 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B196		1.5 mm	15 mm						15 mm
STULPI01BTBR	STMicroelectronics	SUPPORT CIRCUIT	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM		S-PBGA-B36	3	1.16 mm	3.6 mm	Not Qualified		e2		260	3.6 mm
KSZ8893MBLI	Microchip Technology	LAN SWITCHING CIRCUIT	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	2		3.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA100,10X10,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	100 Mbps	S-PBGA-B100	1	1.38 mm	9 mm	Not Qualified		e1			9 mm
VSC8552XKS-05	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2	755 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
KSZ8893MBL	Microchip Technology	LAN SWITCHING CIRCUIT	COMMERCIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	2		3.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA100,10X10,32		.8 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	100 Mbps	S-PBGA-B100		1.38 mm	9 mm	Not Qualified		e1			9 mm
CYP15G0401DXB-BGXI	Infineon Technologies	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		4	1.1 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified		e1	20	260	27 mm
AD9375BBCZ-REEL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm				30	260	12 mm
FLLXT971ABE.A4-834104	Cortina Systems	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	64	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1	.11 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA64,8X8,32	Network Interfaces	.8 mm	85 Cel	-40 Cel		BOTTOM	100 Mbps	S-PBGA-B64		1.36 mm	7 mm	Not Qualified			30	240	7 mm
QT2025PRKDB-1	M/a-com Technology Solutions	MANCHESTER ENCODER	COMMERCIAL	BALL	144	LBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE			1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.68 mm	13 mm			e1		260	13 mm
AD9375BBCZ	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm				30	260	12 mm
VSC8552XKS-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2	755 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8575XKS-11	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			4	1890 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8564XKS-11	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			4	1890 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8572XKS-04	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2		2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
DS33W11+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified		e1	30	260	17 mm
DS33W41+	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified		e1	30	260	17 mm
DS33X11+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.5 mm	10 mm	Not Qualified		e1	30	260	10 mm
DS33X161+	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified		e1			17 mm
DS33X41+	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified		e1	30	260	17 mm
DS33X42+	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified		e1	30	260	17 mm
DS33X81+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified		e1	30	260	17 mm
VSC8512XJG-03	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			12		1 V		GRID ARRAY	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B672		2.44 mm	27 mm						27 mm
VSC8512XJG-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			12		1 V		GRID ARRAY	BGA672,26X26,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B672		2.44 mm	27 mm						27 mm
BCM53134MIFBG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	212	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B212	3	1.017 mm	11 mm						11 mm
BCM5481A2KFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	100	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS						GRID ARRAY							BOTTOM	1000 Mbps	R-PBGA-B100	3							260
BCM5482SA2IFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	121	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS						GRID ARRAY							BOTTOM		R-PBGA-B121							NOT SPECIFIED	NOT SPECIFIED
VSC8572XKS-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2	800 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
AQR108-B0-EG-Y	Marvell Technology	ETHERNET TRANSCEIVER	OTHER	BALL	104	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	108 Cel	0 Cel		BOTTOM		R-PBGA-B104		1.57 mm	7 mm				NOT SPECIFIED	NOT SPECIFIED	11 mm
BCM53134PKFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	212	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B212	3	1.017 mm	11 mm						11 mm
VSC8504XKS-02	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			4	900 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm			e1			17 mm
VSC8504XKS-04	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			4		1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
BCM5387KFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			812 mA	1.2 V		GRID ARRAY, LOW PROFILE	BGA256,16X16,40		1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B256	3	1.7 mm	17 mm						17 mm
BCM54616SC0IFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	100	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1				GRID ARRAY							BOTTOM	1000 Mbps	R-PBGA-B100	3							260
BCM53134PIFBG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	212	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-45 Cel		BOTTOM		S-PBGA-B212	3	1.017 mm	11 mm						11 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.