BALL Network Interfaces 343

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TLK2201AJRZQE	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1	.111 mA	2.5 V	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,9X9,20	Network Interfaces	.5 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1600 Mbps	S-PBGA-B80	3	1 mm	5 mm	Not Qualified	e1	30	260	5 mm
TLK2201AJRGQE	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1	.111 mA	2.5 V	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,9X9,20	Network Interfaces	.5 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	1600 Mbps	S-PBGA-B80	2A	1 mm	5 mm	Not Qualified	e0	20	235	5 mm
TLK2201JRZQE	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1	.111 mA	2.5 V	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,9X9,20	Network Interfaces	.5 mm	70 Cel	0 Cel		BOTTOM	1600 Mbps	S-PBGA-B80		1 mm	5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
TLK3118GDV	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	BALL	400	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V	1.2,1.5,2.5	GRID ARRAY, HEAT SINK/SLUG	BGA400,20X20,40	Other Telecom ICs	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B400	4	3.65 mm	21 mm	Not Qualified	e0	20	220	21 mm
TLK3104SAGNT	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V		GRID ARRAY			1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	19 mm
TLK2201JRGQE	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1	.111 mA	2.5 V	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,9X9,20	Network Interfaces	.5 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	1600 Mbps	S-PBGA-B80	2A	1 mm	5 mm	Not Qualified	e0	20	235	5 mm
TLK3114SAGPV	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V		GRID ARRAY			1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified				19 mm
TLK3114SBGNT	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V	1.5/2.5,2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	19 mm
TLK2208BZPV	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	8		1.8 V	1.8,1.8/2.5	GRID ARRAY	BGA289,17X17,40	Network Interfaces	1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1300 Mbps	S-PBGA-B289	3	2 mm	19 mm	Not Qualified	e1	30	260	19 mm
TLK2208GPV	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	8		1.8 V	1.8,1.8/2.5	GRID ARRAY	BGA289,17X17,40	Network Interfaces	1 mm	70 Cel	0 Cel		BOTTOM	1300 Mbps	S-PBGA-B289		2 mm	19 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	19 mm
X2TLK2218GPV	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1		1.8 V	1.8,1.8/2.5	GRID ARRAY	BGA289,17X17,40	Network Interfaces	1 mm	70 Cel	0 Cel		BOTTOM	1300 Mbps	S-PBGA-B289	3	2 mm	19 mm	Not Qualified		20	220	19 mm
TLK2208BGPV	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	8		1.8 V	1.8,2.5	GRID ARRAY	BGA289,17X17,40	Network Interfaces	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	1300 Mbps	S-PBGA-B289	3	2 mm	19 mm	Not Qualified	e0	20	220	19 mm
TLK2208ZPV	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.8 V		GRID ARRAY			1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified				19 mm
TLK2218GPV	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1		1.8 V	1.8,1.8/2.5	GRID ARRAY	BGA289,17X17,40	Network Interfaces	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	1300 Mbps	S-PBGA-B289	3	2 mm	19 mm	Not Qualified	e0	20	220	19 mm
TLK2226GEA	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	6	.39 mA	1.8 V	1.5/1.8,2.5/3.3	GRID ARRAY	BGA196,14X14,40	Network Interfaces	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	2500 Mbps	S-PBGA-B196	3	1.97 mm	15 mm	Not Qualified	e0	20	220	15 mm
TLK3114SCGPV	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.65 mA	2.5 V	2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B289	3	2 mm	19 mm	Not Qualified	e0	20	220	19 mm
TNETX3150AGGP	Texas Instruments	SUPPORT CIRCUIT		BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.55 mA	3.3 V	3.3,5	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	Network Interfaces	1.27 mm				BOTTOM		S-PBGA-B352		1.7 mm	35 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	35 mm
TLK2226ZEA	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	6	.39 mA	1.8 V	1.5/1.8,2.5/3.3	GRID ARRAY	BGA196(UNSPEC)	Network Interfaces	1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1300 Mbps	S-PBGA-B196	3	1.97 mm	15 mm	Not Qualified	e1	30	260	15 mm
TLK3104SCGNT	Texas Instruments	ETHERNET TRANSCEIVER	OTHER	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V		GRID ARRAY			1 mm	75 Cel	-40 Cel		BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	19 mm
TLK2208AZPV	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	8		1.8 V	1.8,1.8/2.5	GRID ARRAY	BGA289,17X17,40	Network Interfaces	1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1300 Mbps	S-PBGA-B289	3	2 mm	19 mm	Not Qualified	e1	30	260	19 mm
TLK3104SC	Texas Instruments	ETHERNET TRANSCEIVER	OTHER	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	4	CMOS					GRID ARRAY							BOTTOM		S-PBGA-B289				Not Qualified
TLK2208AGPV	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	8		1.8 V	1.8,1.8/2.5	GRID ARRAY	BGA289,17X17,40	Network Interfaces	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	1300 Mbps	S-PBGA-B289	3	2 mm	19 mm	Not Qualified	e0	20	220	19 mm
TLK3104SA	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	289	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			2.5 V		GRID ARRAY				70 Cel	0 Cel		BOTTOM		R-PBGA-B289				Not Qualified
TLK3114SAGNT	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V	1.5/2.5,2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	19 mm
TLK3114SCZPV	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.65 mA	2.5 V	2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B289	3	2 mm	19 mm	Not Qualified	e1	30	260	19 mm
DLKPC192SGNT	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.8 V	1.8,2.5,3.3	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified				19 mm
TLK3114SBGPV	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.65 mA	2.5 V	1.5/2.5,2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified				19 mm
TLK10034AAJ	Texas Instruments	SUPPORT CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	4	1249 mA	1 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	10000 Mbps	S-PBGA-B324	4	3.29 mm	19 mm		e1	30	260	19 mm
ADIN2299BBCZ-RL	Analog Devices	ETHERNET TRANSCEIVER		BALL	194	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY	BGA194,17X17,87		2.2 mm	85 Cel	-40 Cel		BOTTOM	100 Mbps	S-PBGA-B194		3.56 mm	38 mm					38 mm
ADIN2299BBCZ	Analog Devices	ETHERNET TRANSCEIVER		BALL	194	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY	BGA194,17X17,87		2.2 mm	85 Cel	-40 Cel		BOTTOM	100 Mbps	S-PBGA-B194		3.56 mm	38 mm			NOT SPECIFIED	NOT SPECIFIED	38 mm
DS33X81+W	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B256	3	1.82 mm	17 mm					17 mm
MAX13345EEBC+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			2.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified	e1	30	260	2.12 mm
DS33W11DK+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B256		1.82 mm	17 mm			NOT SPECIFIED	NOT SPECIFIED	17 mm
DS33X82+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified	e1	30	260	17 mm
STULPI01ATBR	STMicroelectronics	SUPPORT CIRCUIT	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			.5 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B36	3	1.16 mm	3.6 mm	Not Qualified	e1	30	260	3.6 mm
PX1011A-EL1:557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81	1	1.6 mm	9 mm	Not Qualified				9 mm
PX1011BI-EL1/G,551	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified			260	9 mm
PX1011B-EL1/N	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified				9 mm
PX1011B-EL1/Q900	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1011B-EL1/G,551	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified			260	9 mm
PX1011A-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1011AI-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1012A-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1012AI-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1041A-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	208	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B208		1.5 mm	15 mm	Not Qualified	e1			15 mm
PX1011BI-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified	e1	30	260	9 mm
PX1011B-EL1/N,557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified				9 mm
PX1012A-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.