BALL Network Interfaces 343

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PX1011A-EL1	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81	1	1.6 mm	9 mm	Not Qualified					9 mm
PX1041AI-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	208	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B208		1.5 mm	15 mm	Not Qualified		e1			15 mm
PX1012A-EL1/G,551	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.25 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified		e1			9 mm
PX1011AI-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified		e1			9 mm
PX1011B-EL1/N,551	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified					9 mm
PX1012AI-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified		e1			9 mm
PX1011A-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified		e1			9 mm
PX1011B-EL1/G	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified					9 mm
PX1011B-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified				260	9 mm
935296091023	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4				3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel	-40 Cel		BOTTOM		R-PBGA-B12		.615 mm	1.2 mm						1.6 mm
MC92603VM	NXP Semiconductors	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.8 V		GRID ARRAY			1 mm	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.6 mm	17 mm	Not Qualified		e1	40	260	17 mm
935296091012	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4				3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel	-40 Cel		BOTTOM		R-PBGA-B12		.615 mm	1.2 mm						1.6 mm
NTS0104UK,023	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4				3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel	-40 Cel		BOTTOM		R-PBGA-B12		.615 mm	1.2 mm						1.6 mm
NTS0104UK	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4				3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel	-40 Cel		BOTTOM		R-PBGA-B12		.615 mm	1.2 mm						1.6 mm
PLB2224	Infineon Technologies	SUPPORT CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V	1.8,3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B272		2.35 mm	27 mm	Not Qualified		e0			27 mm
CYV15G0401DXB-BGXC	Infineon Technologies	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	4	1.1 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified		e1	20	260	27 mm
CYP15G0201DXB-BBXC	Infineon Technologies	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	2	.7 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	Network Interfaces	1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B196	3	1.5 mm	15 mm	Not Qualified		e1		260	15 mm
MAX13342EEBC+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			2.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified		e1	30	260	2.12 mm
MAX13345EEBC+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			2.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified		e1	30	260	2.12 mm
DS33X162+	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified		e1	30	260	17 mm
DS33Z11+C01	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	169	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169		1.5 mm	14 mm				NOT SPECIFIED	NOT SPECIFIED	14 mm
DS33Z41	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	169	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169	3	1.5 mm	14 mm	Not Qualified					14 mm
MAX13342EEBC+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			2.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified		e1	30	260	2.12 mm
DS33ZH11+	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B100			10 mm	Not Qualified		e1	30	260	10 mm
DS33Z44+	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.8 mm	17 mm	Not Qualified		e1	30	260	17 mm
MAX2986CXV	Maxim Integrated	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM		S-PBGA-B144		1.4 mm	12 mm			e0			12 mm
DS33ZH11	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B100			10 mm	Not Qualified		e1		225	10 mm
DS33Z44	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256		1.77 mm	17 mm	Not Qualified		e1		245	17 mm
MC-10287F1-HN4-M1-A	Renesas Electronics		INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES					3.3 V	3.3	GRID ARRAY	BGA324,18X18,40	Network Interfaces	1 mm	85 Cel	-40 Cel	TIN BISMUTH	BOTTOM		S-PBGA-B324				Not Qualified		e6
82P2916BF	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	Digital Transmission Interfaces	.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		S-PBGA-B484	3	1.7 mm	19 mm	Not Qualified		e0	20	225	19 mm
R9J03G019GBG#AC1	Renesas Electronics	SUPPORT CIRCUIT	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B484		2.34 mm	23 mm						23 mm
UPD60510F1-HN4-M1-A	Renesas Electronics		INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES					3.3 V	3.3	GRID ARRAY	BGA324,18X18,40	Network Interfaces	1 mm	85 Cel	-40 Cel	TIN BISMUTH	BOTTOM		S-PBGA-B324				Not Qualified		e6
BCM81356B0IFSBG	Broadcom	ETHERNET TRANSCEIVER		BALL	729	FBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1		.72 V		GRID ARRAY, FINE PITCH	BGA729, 27X27, 31		.8 mm	85 Cel	-20 Cel		BOTTOM		S-PBGA-B729		2.89 mm	23 mm						23 mm
BCM8011	Broadcom	ETHERNET TRANSCEIVER		BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.8 V		GRID ARRAY							BOTTOM		S-PBGA-B324				Not Qualified
L-ET3048-50B1-DB	Broadcom	LAN SWITCHING CIRCUIT	COMMERCIAL	BALL	717	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B717			40 mm	Not Qualified					40 mm
BCM8021	Broadcom	LAN SWITCHING CIRCUIT		BALL		BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					GRID ARRAY							BOTTOM		S-PBGA-B	1			Not Qualified
L-ET3048-50B-DB	Broadcom	LAN SWITCHING CIRCUIT	COMMERCIAL	BALL	717	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B717			40 mm	Not Qualified					40 mm
ET3048-50B1-DB	Broadcom	LAN SWITCHING CIRCUIT	COMMERCIAL	BALL	717	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B717			40 mm	Not Qualified					40 mm
BCM81724A1KFSBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1		.72 V		GRID ARRAY	BGA484,22X22,32		.8 mm	70 Cel	0 Cel		BOTTOM	56000 Mbps	S-PBGA-B484		2.84 mm	19 mm		IT HAS 56Gb/s PAM-4 and 26 Gb/s NRZ DATA RATES				19 mm
BCM8705	Broadcom	ETHERNET TRANSCEIVER		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY							BOTTOM		S-PBGA-B256				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
L-ET1081N1C-B-DB	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1 V		GRID ARRAY			1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B388			27 mm	Not Qualified		e1	40	245	27 mm
BCM8441	Broadcom	SUPPORT CIRCUIT		BALL	792	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.25 V		GRID ARRAY							BOTTOM		S-PBGA-B792	1			Not Qualified
LU5X34F	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B217		2.32 mm	23 mm	Not Qualified		e0	30	225	23 mm
BCM8705LBIFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY	BGA256(UNSPEC)						BOTTOM	10518.8 Mbps	S-PBGA-B256
BCM8157	Broadcom	ETHERNET TRANSCEIVER		BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1 V		GRID ARRAY							BOTTOM		S-PBGA-B196
BCM8154	Broadcom	ETHERNET TRANSCEIVER		BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1 V		GRID ARRAY							BOTTOM		S-PBGA-B196
BCM8724	Broadcom	ETHERNET TRANSCEIVER		BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY							BOTTOM		S-PBGA-B324				Not Qualified
L-ET3028-50B-DB	Broadcom	LAN SWITCHING CIRCUIT	COMMERCIAL	BALL	524	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B524			31 mm	Not Qualified		e1	40	245	31 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.