BALL Network Interfaces 343

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
VSC8489YJU-02	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			2	150 mA	1.2 V		GRID ARRAY, LOW PROFILE	BGA196,14X14,40		1 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196		1.4 mm	15 mm						15 mm
VSC8662XIC	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2		1.2 V		GRID ARRAY	BGA256,16X16,40		1 mm	90 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		2 mm	17 mm						17 mm
88E1111-B2-BAB-I000	Marvell Technology	ETHERNET TRANSCEIVER		BALL	117	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		1 V		GRID ARRAY, LOW PROFILE	BGA117,9X13,40		1 mm				BOTTOM	1000 Mbps	R-PBGA-B117		1.54 mm	10 mm	Not Qualified	IT ALSO REQUIRES 2.5V DIGITAL SUPPLY				14 mm
BCM5482SHEA2IFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	121	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS						GRID ARRAY							BOTTOM		R-PBGA-B121							NOT SPECIFIED	NOT SPECIFIED
PEF22628EV1XSLL79	Intel	INTERFACE CIRCUIT		BALL	324	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1				GRID ARRAY	BGA324(UNSPEC)						BOTTOM		R-PBGA-B324
88X2222-B0-BKP2C000	Marvell Technology	ETHERNET TRANSCEIVER		BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1		1 V		GRID ARRAY	BGA324,18X18,40		1 mm	70 Cel	0 Cel		BOTTOM	10300 Mbps	S-PBGA-B324		2.82 mm	19 mm						19 mm
BCM53125MIMMLG	Broadcom	ETHERNET TRANSCEIVER		BALL	186		SQUARE	PLASTIC/EPOXY	YES	1			1					BGA186(UNSPEC)						BOTTOM		S-PBGA-B186	3
VSC8254YMR-01	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2		1 V		GRID ARRAY	BGA256,16X16,40		1 mm	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	10000 Mbps	S-PBGA-B256		2.7 mm	17 mm			e1			17 mm
CYP15G0403DXB-BGXC	Infineon Technologies	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		4	1.32 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified		e1	20	260	27 mm
BCM54220SB0KFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	144		RECTANGULAR	PLASTIC/EPOXY	YES	1			2		1 V		GRID ARRAY							BOTTOM	1000 Mbps	R-PBGA-B144	3							260
CYP15G0401DXB-BGXC	Infineon Technologies	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		4	1.1 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified		e1	20	260	27 mm
EZX557AT2SLKVX	Intel	SUPPORT CIRCUIT	COMMERCIAL	BALL		BGA	SQUARE	PLASTIC/EPOXY	YES	1							GRID ARRAY				55 Cel	0 Cel		BOTTOM	10000 Mbps	S-PBGA-B							NOT SPECIFIED	NOT SPECIFIED
SKY85334-11	Skyworks Solutions	WIRELESS LAN CIRCUIT		BALL	16	BGA	SQUARE	UNSPECIFIED	YES	1							GRID ARRAY							BOTTOM		S-XBGA-B16							NOT SPECIFIED	NOT SPECIFIED
BCM54991LB0IFEBG	Broadcom	ETHERNET TRANSCEIVER		BALL			SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1		.8 V									BOTTOM	5000 Mbps	S-PBGA-B
CYP15G0403DXB-BGXI	Cypress Semiconductor	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		4	1.32 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified		e1	20	260	27 mm
PEF22624EV2XSLLJ8	Intel	INTERFACE CIRCUIT		BALL	324		RECTANGULAR	PLASTIC/EPOXY	YES	1														BOTTOM		R-PBGA-B324
88E3082-B1-BAR-I000	Marvell Technology	ETHERNET TRANSCEIVER		BALL	224	BGA	SQUARE	PLASTIC/EPOXY	YES	1							GRID ARRAY							BOTTOM		S-PBGA-B224
BCM52311A1HH0H275S	Broadcom	TELECOM CIRCUIT		BALL	1152	HBGA	SQUARE	PLASTIC/EPOXY	YES	1					.85 V		GRID ARRAY, HEAT SINK/SLUG	BGA1152,34X34,40		1 mm	105 Cel	0 Cel		BOTTOM	12500 Mbps	S-PBGA-B1152		3.21 mm	35 mm						35 mm
BCM53158XUB1KFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	311	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.65 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B311	3	1.337 mm	13 mm			e1			13 mm
BCM84848A1KFSBG	Broadcom	ETHERNET TRANSCEIVER		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1							GRID ARRAY							BOTTOM		S-PBGA-B484							NOT SPECIFIED	NOT SPECIFIED
BCM84881B0IFSBG	Broadcom	ETHERNET TRANSCEIVER		BALL			SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1		1 V									BOTTOM	10000 Mbps	S-PBGA-B	3							260
BCM88470CB0IFSBG	Broadcom	ETHERNET TRANSCEIVER		BALL	1365		SQUARE	PLASTIC/EPOXY	YES	1								BGA1365(UNSPEC)						BOTTOM		S-PBGA-B1365	4							245
CYW15G0403DXB-BGI	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		4	1.32 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified		e0			27 mm
SKY85331-11	Skyworks Solutions	WIRELESS LAN CIRCUIT		BALL	24	BGA	RECTANGULAR	UNSPECIFIED	YES	1							GRID ARRAY							BOTTOM		R-XBGA-B24							NOT SPECIFIED	NOT SPECIFIED
BCM5308EKTB	Broadcom	ETHERNET TRANSCEIVER		BALL	352	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		8		3.3 V		GRID ARRAY							BOTTOM		R-PBGA-B352
BCM53134MKFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	212	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B212	3	1.017 mm	11 mm						11 mm
BCM54185B0IFBG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	400	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		8				GRID ARRAY				85 Cel	-40 Cel		BOTTOM		R-PBGA-B400
BCM5482SA2KFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	121	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		2				GRID ARRAY						TIN SILVER COPPER	BOTTOM	1000 Mbps	R-PBGA-B121	3					e1		260
BCM8705LBIFB	Broadcom	ETHERNET TRANSCEIVER		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1				GRID ARRAY	BGA256(UNSPEC)						BOTTOM	10518.8 Mbps	S-PBGA-B256
BCM89610A2BMLG	Broadcom	ETHERNET TRANSCEIVER		BALL	48	BGA		PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100					GRID ARRAY							BOTTOM									NOT SPECIFIED	NOT SPECIFIED
CYP15G0201DXB-BBXI	Infineon Technologies	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		2	.71 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	Network Interfaces	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B196	3	1.5 mm	15 mm	Not Qualified		e1		260	15 mm
CYP15G0401DXB-BGI	Cypress Semiconductor	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		4		3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified		e0			27 mm
CYV15G0101DXB-BBXC	Infineon Technologies	INTERFACE CIRCUIT	COMMERCIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		1	.5 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA100,10X10,40	Network Interfaces	1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B100	3	1.4 mm	11 mm	Not Qualified		e1	20	260	11 mm
ELLXT971ABE.A4	Intel	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	64	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B64		1.26 mm	7 mm	Not Qualified			40	260	7 mm
VSC8664XIC	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			4		1.2 V		GRID ARRAY	BGA256,16X16,40		1 mm	90 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1000 Mbps	S-PBGA-B256		2 mm	17 mm			e1			17 mm
VSC8664XIC-03	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			4		1.2 V		GRID ARRAY	BGA256,16X16,40		1 mm	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1000 Mbps	S-PBGA-B256		2 mm	17 mm			e1			17 mm
KSZ8692PB	Microchip Technology	SUPPORT CIRCUIT	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B400	3	2.33 mm	27 mm	Not Qualified		e1			27 mm
VSC7444YIH-02	Microchip Technology	SUPPORT CIRCUIT	INDUSTRIAL	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1				7500 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	110 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B672		2.71 mm	27 mm			e1	NOT SPECIFIED	NOT SPECIFIED	27 mm
VSC7464YIH-02	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1				8400 mA	1 V		GRID ARRAY			1 mm	125 Cel	-40 Cel		BOTTOM		S-PBGA-B672	4	2.71 mm	27 mm						27 mm
VSC8244XHG	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	260	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		4		1.2 V		GRID ARRAY, HEAT SINK/SLUG	BGA260,18X18,40		1 mm	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1000 Mbps	S-PBGA-B260	4	2 mm	19 mm			e1	30	260	19 mm
VSC8562XKS-11	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2	1130 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm				NOT SPECIFIED	NOT SPECIFIED	17 mm
VSC8562XKS-14	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2	1130 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm				NOT SPECIFIED	NOT SPECIFIED	17 mm
TLK2218ZPV	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1		1.8 V	1.8,1.8/2.5	GRID ARRAY	BGA289,17X17,40	Network Interfaces	1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1300 Mbps	S-PBGA-B289	3	2 mm	19 mm	Not Qualified		e1	30	260	19 mm
XA1243FPBGABL	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	125 Cel	-40 Cel		BOTTOM		S-PBGA-B161		1.17 mm	10.4 mm						10.4 mm
TLK3104SCIGNT	Texas Instruments	ETHERNET TRANSCEIVER	OTHER	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	4	CMOS						GRID ARRAY			1 mm				BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified					19 mm
TLK3114SCGNT	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				2.5 V	1.5,2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B289	3	2 mm	19 mm	Not Qualified			20	220	19 mm
TNETX3150GGP	Texas Instruments	SUPPORT CIRCUIT		BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.5 mA	3.3 V	3.3,5	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	Network Interfaces	1.27 mm				BOTTOM		S-PBGA-B352		1.7 mm	35 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	35 mm
TNETX4080GGP	Texas Instruments	SUPPORT CIRCUIT		BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				2.5 V	2.5,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	Network Interfaces	1.27 mm				BOTTOM		S-PBGA-B352		1.7 mm	35 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	35 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.