BALL Network Interfaces 343

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

VSC8574XKS-05

Microchip Technology

ETHERNET TRANSCEIVER

AUTOMOTIVE

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

4

980 mA

1 V

GRID ARRAY

BGA256,16X16,40

1 mm

125 Cel

-40 Cel

BOTTOM

1000 Mbps

S-PBGA-B256

1.8 mm

17 mm

17 mm

ELLXT971ABE.A4-870479

Cortina Systems

ETHERNET TRANSCEIVER

INDUSTRIAL

BALL

64

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

.11 mA

3.3 V

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA64,8X8,32

Network Interfaces

.8 mm

85 Cel

-40 Cel

BOTTOM

100 Mbps

S-PBGA-B64

1.36 mm

7 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

7 mm

VSC8572XKS-01

Microchip Technology

ETHERNET TRANSCEIVER

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

2.5 V

GRID ARRAY

1 mm

125 Cel

0 Cel

BOTTOM

S-PBGA-B256

1.8 mm

17 mm

17 mm

88E1548-A1-BAM2C000

Marvell Technology

ETHERNET TRANSCEIVER

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

4

1 V

GRID ARRAY, LOW PROFILE

BGA196,14X14,40

1 mm

70 Cel

0 Cel

BOTTOM

1000 Mbps

S-PBGA-B196

1.5 mm

15 mm

15 mm

VSC8486YSN-04

Microchip Technology

ETHERNET TRANSCEIVER

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1

1.2 V

GRID ARRAY

BGA256,16X16,40

1 mm

95 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

10518.75 Mbps

S-PBGA-B256

3.22 mm

17 mm

e1

17 mm

BCM54220SB0IFBG

Broadcom

ETHERNET TRANSCEIVER

BALL

144

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2

1 V

BOTTOM

S-PBGA-B144

3

also operates with 3.3v nom supply

260

FTXL710-BM2SLLK7

Intel

ETHERNET TRANSCEIVER

BALL

SQUARE

PLASTIC/EPOXY

YES

1

2

55 Cel

0 Cel

BOTTOM

S-PBGA-B

TLK10031CTR

Texas Instruments

SUPPORT CIRCUIT

INDUSTRIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

700 mA

1 V

GRID ARRAY

BGA144,12X12,40

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

10312.5 Mbps

S-PBGA-B144

4

3.25 mm

13 mm

Not Qualified

e1

30

260

13 mm

VSC8572XKS-05

Microchip Technology

ETHERNET TRANSCEIVER

AUTOMOTIVE

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

2

800 mA

2.5 V

GRID ARRAY

BGA256,16X16,40

1 mm

125 Cel

-40 Cel

BOTTOM

1000 Mbps

S-PBGA-B256

1.8 mm

17 mm

17 mm

VSC8574XKS-02

Microchip Technology

ETHERNET TRANSCEIVER

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

4

980 mA

1 V

GRID ARRAY

BGA256,16X16,40

1 mm

125 Cel

0 Cel

BOTTOM

1000 Mbps

S-PBGA-B256

1.8 mm

17 mm

17 mm

VSC8584XKS-11

Microchip Technology

ETHERNET TRANSCEIVER

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

4

1890 mA

2.5 V

GRID ARRAY

BGA256,16X16,40

1 mm

125 Cel

0 Cel

BOTTOM

1000 Mbps

S-PBGA-B256

1.8 mm

17 mm

17 mm

AQR107-B0-IG-Y

Marvell Technology

ETHERNET TRANSCEIVER

INDUSTRIAL

BALL

104

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

108 Cel

-40 Cel

BOTTOM

R-PBGA-B104

1.57 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

11 mm

PEF24628EV1XSLL7F

Intel

INTERFACE CIRCUIT

BALL

324

RECTANGULAR

PLASTIC/EPOXY

YES

1

4

BOTTOM

R-PBGA-B324

NOT SPECIFIED

NOT SPECIFIED

VSC8552XKS-01

Microchip Technology

ETHERNET TRANSCEIVER

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

1 mm

125 Cel

0 Cel

BOTTOM

S-PBGA-B256

1.8 mm

17 mm

17 mm

88E3082-C1-BAR1I000

Marvell Technology

ETHERNET TRANSCEIVER

BALL

224

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

R-PBGA-B224

BCM5481A2IFBG

Broadcom

ETHERNET TRANSCEIVER

BALL

100

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

BOTTOM

1000 Mbps

S-PBGA-B100

TUSB2E22YCGT

Texas Instruments

INTERFACE CIRCUIT

COMMERCIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,16

.35 mm

85 Cel

-20 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

1

.5 mm

2 mm

30

260

2 mm

VSC8502XML-03

Microchip Technology

ETHERNET TRANSCEIVER

AUTOMOTIVE

BALL

135

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2

1 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

LCC135,.47SQ,25

.65 mm

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

BOTTOM

1000 Mbps

S-PBGA-B135

.85 mm

12 mm

e4

12 mm

BCM54140B0IFBG

Broadcom

ETHERNET TRANSCEIVER

INDUSTRIAL

BALL

256

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

4

GRID ARRAY

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B256

e1

255

BCM82391AKFSBG

Broadcom

SUPPORT CIRCUIT

BALL

324

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2

1 V

BOTTOM

100000 Mbps

S-PBGA-B324

IT ALSO REQUIRES 1.8V, 2.5V AND 3.3V NOMINAL SUPPLY VOLTAGE

ELLXT971ABE.A4-870480

Cortina Systems

ETHERNET TRANSCEIVER

INDUSTRIAL

BALL

64

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

.11 mA

3.3 V

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA64,8X8,32

Network Interfaces

.8 mm

85 Cel

-40 Cel

BOTTOM

100 Mbps

S-PBGA-B64

1.36 mm

7 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

7 mm

TUSB2E22YCGR

Texas Instruments

INTERFACE CIRCUIT

COMMERCIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,16

.35 mm

85 Cel

-20 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

1

.5 mm

2 mm

30

260

2 mm

CYP15G0101DXB-BBI

Cypress Semiconductor

INTERFACE CIRCUIT

INDUSTRIAL

BALL

100

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

1

3.3 V

3.3

GRID ARRAY, LOW PROFILE

BGA100,10X10,40

Network Interfaces

1 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

1500 Mbps

S-PBGA-B100

3

1.4 mm

11 mm

Not Qualified

e0

11 mm

VSC8504XKS-01

Microchip Technology

ETHERNET TRANSCEIVER

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

1 mm

125 Cel

0 Cel

BOTTOM

S-PBGA-B256

1.8 mm

17 mm

17 mm

VSC8575XKS-14

Microchip Technology

ETHERNET TRANSCEIVER

AUTOMOTIVE

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

4

1890 mA

1 V

GRID ARRAY

BGA256,16X16,40

1 mm

125 Cel

-40 Cel

BOTTOM

1000 Mbps

S-PBGA-B256

1.8 mm

17 mm

17 mm

AQR108-B0-IG-Y

Marvell Technology

ETHERNET TRANSCEIVER

INDUSTRIAL

BALL

104

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

108 Cel

-40 Cel

BOTTOM

R-PBGA-B104

1.57 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

11 mm

BCM54140B0KFBG

Broadcom

ETHERNET TRANSCEIVER

COMMERCIAL

BALL

256

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

4

GRID ARRAY

70 Cel

0 Cel

BOTTOM

R-PBGA-B256

NOT SPECIFIED

NOT SPECIFIED

BCM54616SC0KFBG

Broadcom

ETHERNET TRANSCEIVER

BALL

100

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

1000 Mbps

R-PBGA-B100

3

260

BCM5461A1KFBG

Broadcom

ETHERNET TRANSCEIVER

BALL

117

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

R-PBGA-B117

3

260

DS33Z11+UNUSED

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

BALL

169

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B169

1.5 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

NTS0104UK,012

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

4

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

BOTTOM

R-PBGA-B12

1

.615 mm

1.2 mm

1.6 mm

VSC8486YJB-11

Microchip Technology

ETHERNET TRANSCEIVER

INDUSTRIAL

BALL

144

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

1

1.2 V

GRID ARRAY, LOW PROFILE

BGA144,12X12,40

1 mm

85 Cel

-40 Cel

BOTTOM

.00001 Mbps

S-PBGA-B144

1.4 mm

13 mm

13 mm

88E1111-B1-BAB1I000

Marvell Technology

ETHERNET TRANSCEIVER

BALL

117

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1 V

GRID ARRAY, LOW PROFILE

1 mm

BOTTOM

R-PBGA-B117

1.54 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

DS33Z11

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

BALL

169

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B169

3

1.5 mm

14 mm

Not Qualified

14 mm

DS33Z11+

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

BALL

169

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B169

3

1.5 mm

14 mm

Not Qualified

e1

30

260

14 mm

GD82559ER

Intel

ETHERNET TRANSCEIVER

OTHER

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

1 mm

85 Cel

0 Cel

BOTTOM

S-PBGA-B196

1.75 mm

15 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

15 mm

GD82559ERSL3RB

Intel

ETHERNET TRANSCEIVER

OTHER

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

1 mm

85 Cel

0 Cel

BOTTOM

S-PBGA-B196

1.75 mm

15 mm

15 mm

KSZ8692PBI

Microchip Technology

SUPPORT CIRCUIT

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.3 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

3

2.33 mm

27 mm

Not Qualified

e1

27 mm

88E2010-A1-BUS4I000

Marvell Technology

ETHERNET TRANSCEIVER

BALL

168

HFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

.88 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA168,12X14,32

.8 mm

85 Cel

-40 Cel

BOTTOM

10000 Mbps

R-PBGA-B168

1

2.647 mm

10 mm

12 mm

BCM53134SKFBG

Broadcom

SUPPORT CIRCUIT

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

BOTTOM

S-PBGA-B256

3

260

VSC8658XHJ

Microchip Technology

ETHERNET TRANSCEIVER

OTHER

BALL

444

BGA

SQUARE

PLASTIC/EPOXY

YES

1

8

1.2 V

GRID ARRAY

BGA444,26X26,40

1 mm

90 Cel

0 Cel

BOTTOM

1000 Mbps

S-PBGA-B444

2.36 mm

27 mm

IT ALSO OPERATS AT 3.3V, SEATED HT-CALCULATED

27 mm

BCM54220B0KFBG

Broadcom

ETHERNET TRANSCEIVER

BALL

144

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

2

1 V

GRID ARRAY

BOTTOM

R-PBGA-B144

BCM8727BIFBG

Broadcom

ETHERNET TRANSCEIVER

BALL

324

SQUARE

PLASTIC/EPOXY

YES

1

1 V

BOTTOM

S-PBGA-B324

3

260

BCM8727CIFBG

Broadcom

ETHERNET TRANSCEIVER

BALL

324

SQUARE

PLASTIC/EPOXY

YES

1

1 V

BOTTOM

S-PBGA-B324

VSC8489YJU-13

Microchip Technology

ETHERNET TRANSCEIVER

INDUSTRIAL

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, LOW PROFILE

1 mm

110 Cel

-40 Cel

BOTTOM

S-PBGA-B196

1.4 mm

15 mm

15 mm

VSC8552XKS-04

Microchip Technology

ETHERNET TRANSCEIVER

AUTOMOTIVE

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

1 mm

125 Cel

-40 Cel

BOTTOM

S-PBGA-B256

1.8 mm

17 mm

17 mm

VSC8584XKS-14

Microchip Technology

ETHERNET TRANSCEIVER

AUTOMOTIVE

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

4

1890 mA

2.5 V

GRID ARRAY

BGA256,16X16,40

1 mm

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1000 Mbps

S-PBGA-B256

1.8 mm

17 mm

e1

17 mm

PX1011BI-EL1/G,557

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

81

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B81

3

1.6 mm

9 mm

Not Qualified

260

9 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.