Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
ETHERNET TRANSCEIVER |
MILITARY |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-55 Cel |
Matte Tin (Sn) |
DUAL |
5 Mbps |
R-PDSO-N14 |
2 |
1 mm |
3 mm |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
4.5 mm |
|||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
.8 mm |
5 mm |
e3 |
260 |
5 mm |
|||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
MILITARY |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-55 Cel |
Matte Tin (Sn) |
DUAL |
2 Mbps |
R-PDSO-N14 |
2 |
1 mm |
3 mm |
e3 |
NOT SPECIFIED |
260 |
4.5 mm |
|||||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
70 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
8 Mbps |
S-PDSO-N8 |
1 mm |
3 mm |
e3 |
3 mm |
||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
MILITARY |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-55 Cel |
Matte Tin (Sn) |
DUAL |
2 Mbps |
R-PDSO-N14 |
2 |
1 mm |
3 mm |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
4.5 mm |
|||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
.07 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
|||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 |
.07 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
4.9 mm |
||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
4 |
900 mA |
1 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
125 Cel |
-40 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B256 |
1.8 mm |
17 mm |
17 mm |
||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
1.27 mm |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
e4 |
30 |
260 |
4.9 mm |
||||||||||||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
70 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
8 Mbps |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
e3 |
4.9 mm |
||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-N14 |
1 |
1 mm |
3 mm |
e4 |
30 |
260 |
4.5 mm |
||||||||||||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100;AEC-Q006 |
1 |
85 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
S-PDSO-N8 |
.9 mm |
3 mm |
3 mm |
||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100; TS 16949 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N48 |
.9 mm |
7 mm |
7 mm |
|||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
109 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
DILCC14,.12x0.18,25 |
.65 mm |
DUAL |
5 Mbps |
R-PDSO-N14 |
1 mm |
3 mm |
4.5 mm |
|||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
1.27 mm |
NICKEL GOLD PALLADIUM |
DUAL |
R-PDSO-G8 |
2A |
1.73 mm |
3.94 mm |
4.93 mm |
|||||||||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
BUTT |
96 |
HBCC |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1 V |
CHIP CARRIER, HEAT SINK/SLUG |
.6 mm |
BOTTOM |
S-XBCC-B96 |
.85 mm |
9 mm |
NOT SPECIFIED |
NOT SPECIFIED |
9 mm |
|||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
8 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
e4 |
30 |
260 |
4.905 mm |
|||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
12 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N12 |
1 |
.5 mm |
1.7 mm |
30 |
260 |
2 mm |
||||||||||||||||
Microchip Technology |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
49 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
HYBRID |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
R-XQMA-N49 |
3.175 mm |
17.78 mm |
26.67 mm |
||||||||||||||||||||
|
NXP Semiconductors |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-G16 |
3 |
2.65 mm |
7.5 mm |
e4 |
30 |
260 |
10.3 mm |
||||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
3 |
.8 mm |
5 mm |
30 |
260 |
5 mm |
||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
e3 |
30 |
260 |
4.9 mm |
||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
.07 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
4.9 mm |
|||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N24 |
2 |
.9 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
1.1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
1000 Mbps |
S-PQCC-N48 |
1 mm |
7 mm |
7 mm |
|||||||||||||||||
Texas Instruments |
CAN FD TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
130 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
8 Mbps |
R-PDSO-G8 |
1.75 mm |
3.895 mm |
4.905 mm |
|||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
UNSPECIFIED |
48 |
UNSPECIFIED |
UNSPECIFIED |
1 |
CMOS |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
4 |
225 mA |
1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.24SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1000 Mbps |
S-PQCC-N36 |
3 |
.9 mm |
6 mm |
IT ALSO REQUIRES 3.3V SUPPLY |
e4 |
30 |
260 |
6 mm |
||||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
140 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
8 Mbps |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
e3 |
4.9 mm |
|||||||||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
TS 16949 |
1 |
70 mA |
5 V |
IN-LINE |
DIP8,.3 |
2.54 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
8 Mbps |
R-PDIP-T8 |
5.334 mm |
7.62 mm |
e3 |
9.271 mm |
||||||||||||
|
Murata Manufacturing |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
XMA |
RECTANGULAR |
METAL |
YES |
1 |
1 |
3.6 mA |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-MXMA-N |
||||||||||||||||||||||
Holt Integrated Circuits |
MIL-STD-1553 DATA BUS TRANSCEIVER |
INDUSTRIAL |
GULL WING |
20 |
HSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG |
1.27 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G20 |
1 |
2.82 mm |
7.493 mm |
Not Qualified |
e0 |
30 |
240 |
12.79 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
2.5 V |
SMALL OUTLINE, SHRINK PITCH |
TSSOP48,.40 |
.635 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
100 Mbps |
R-PDSO-G48 |
3 |
2.794 mm |
7.493 mm |
Not Qualified |
e3 |
15.875 mm |
|||||||||||
Microchip Technology |
LIN TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
12 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
4.9 mm |
||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.07 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
4.9 mm |
|||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100; ISO/TS-16949 |
2 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.28SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1000 Mbps |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
e3 |
40 |
260 |
7 mm |
||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
16 V |
5/27 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
.1 Mbps |
R-PDSO-G8 |
3 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
|||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
2 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
e4 |
30 |
260 |
4.905 mm |
|||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
20 |
240 |
4.9 mm |
|||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
48 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
.5 mm |
125 Cel |
-40 Cel |
TIN |
QUAD |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
e3 |
40 |
260 |
7 mm |
|||||||||||||||
|
Analog Devices |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
75 mA |
5 V |
SMALL OUTLINE |
SOP8,.4 |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
12 Mbps |
R-PDSO-G8 |
3 |
2.65 mm |
5.85 mm |
30 |
260 |
7.5 mm |
||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 |
180 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
e4 |
30 |
260 |
4.9 mm |
||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
2.5 V |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP48,.35SQ |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQFP-G48 |
1.2 mm |
7 mm |
e3 |
7 mm |
|||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 |
.07 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
4.9 mm |
||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
30 |
260 |
4.9 mm |
||||||||||||||||||
|
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
100 Mbps |
S-PQCC-N36 |
1 |
1 mm |
6 mm |
e4 |
30 |
260 |
6 mm |
|||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
1.27 mm |
NICKEL GOLD PALLADIUM |
DUAL |
R-PDSO-G8 |
2A |
1.73 mm |
3.94 mm |
4.93 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.