Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
WIRELESS LAN CIRCUIT |
OTHER |
BUTT |
63 |
LGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
GRID ARRAY |
1.27 mm |
70 Cel |
-20 Cel |
NICKEL GOLD |
BOTTOM |
R-PBGA-B63 |
3 |
2.38 mm |
17.5 mm |
e4 |
30 |
260 |
20.5 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
2.5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQFP-G48 |
1.6 mm |
7 mm |
e3 |
7 mm |
|||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
5 V |
3.3,5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
5 V |
3.3,5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
|||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
e3 |
30 |
260 |
8.65 mm |
||||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
12 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
e3 |
4.9 mm |
|||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
75 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
1 Mbps |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
Not Qualified |
4.9 mm |
|||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
1 |
260 |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
4 |
250 mA |
1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.24SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1000 Mbps |
S-PQCC-N36 |
3 |
.9 mm |
6 mm |
IT ALSO REQUIRES 3.3V SUPPLY |
e4 |
30 |
260 |
6 mm |
||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
2.5 V |
SMALL OUTLINE, SHRINK PITCH |
TSSOP48,.40 |
.635 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
100 Mbps |
R-PDSO-G48 |
3 |
2.794 mm |
7.493 mm |
Not Qualified |
e3 |
15.875 mm |
|||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
3 |
.8 mm |
5 mm |
30 |
260 |
5 mm |
||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 |
180 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
e4 |
30 |
260 |
4.905 mm |
||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.075 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
4.9 mm |
||||||||
|
NXP Semiconductors |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
|||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
.1375 mA |
5 V |
5 |
SMALL OUTLINE |
SOP20,.4 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1 Mbps |
R-PDSO-G20 |
2 |
2.6416 mm |
7.5184 mm |
Not Qualified |
e3 |
30 |
260 |
12.7762 mm |
|||||||
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
5 V |
3.3,5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
5 V |
3.3,5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
|||||||
|
Microchip Technology |
LIN TRANSCEIVER |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
TS 16949 |
1 |
12 V |
IN-LINE |
DIP8,.3 |
2.54 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T8 |
5.33 mm |
7.62 mm |
9.27 mm |
||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
2.8 mm |
5.85 mm |
7.5 mm |
|||||||||||||||||||
|
Elmos Semiconductor Ag |
INTERFACE CIRCUIT |
NO LEAD |
32 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
85 Cel |
-25 Cel |
QUAD |
R-XQCC-N32 |
ALSO OPERATES WITH 5V NOMINAL SUPPLY |
|||||||||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1000 Mbps |
S-XQCC-N56 |
1 mm |
8 mm |
e3 |
8 mm |
|||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
DUAL |
5 Mbps |
S-PDSO-N8 |
1 mm |
3 mm |
ESD on pins CANH and CANL ESD is 8kV |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
||||||||||||
|
NXP Semiconductors |
CAN FD TRANSCEIVER |
NO LEAD |
20 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
67 mA |
13 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC20,.14,20 |
.5 mm |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
15 Mbps |
R-PDSO-N20 |
1 |
1 mm |
3.5 mm |
e4 |
30 |
260 |
5.5 mm |
||||||||||||
Dialog Semiconductor |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
70 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
.078 Mbps |
S-XQCC-N48 |
.9 mm |
7 mm |
Not Qualified |
7 mm |
|||||||||||||
Dialog Semiconductor |
SUPPORT CIRCUIT |
INDUSTRIAL |
UNSPECIFIED |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
TIN OVER NICKEL |
UNSPECIFIED |
R-PXMA-X |
e3 |
||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
DUAL |
R-PDSO-G8 |
2A |
1.75 mm |
4 mm |
260 |
5 mm |
||||||||||||||||
|
NXP Semiconductors |
CAN TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
70 mA |
5 V |
3/5,5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N48 |
.9 mm |
7 mm |
e3 |
7 mm |
|||||||||||||
|
Microchip Technology |
CAN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
70 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1 Mbps |
S-PDSO-N8 |
1 |
1 mm |
3 mm |
e3 |
40 |
260 |
3 mm |
|||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDIP-T8 |
4.2 mm |
7.62 mm |
Not Qualified |
40 |
250 |
9.5 mm |
||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
.07 mA |
5 V |
5 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
Network Interfaces |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
1 Mbps |
S-PDSO-N8 |
1 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
1.27 mm |
NICKEL GOLD PALLADIUM |
DUAL |
R-PDSO-G14 |
2A |
1.75 mm |
4 mm |
30 |
260 |
8.75 mm |
|||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
48 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
.5 mm |
125 Cel |
-40 Cel |
TIN |
QUAD |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
e3 |
40 |
260 |
7 mm |
|||||||||||||||
|
Texas Instruments |
CAN FD TRANSCEIVER |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
130 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
8 Mbps |
S-PDSO-N8 |
2 |
1 mm |
3 mm |
e4 |
30 |
260 |
3 mm |
|||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
5 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
e4 |
30 |
260 |
4.905 mm |
|||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
2.5 mA |
14 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
|||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N24 |
2 |
.9 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
||||||||||
Texas Instruments |
CAN FD TRANSCEIVER |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
130 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
8 Mbps |
S-PDSO-N8 |
1 mm |
3 mm |
3 mm |
|||||||||||||||
Realtek Semiconductor |
ETHERNET TRANSCEIVER |
NO LEAD |
40 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1 |
CHIP CARRIER |
QUAD |
1000 Mbps |
R-XQCC-N40 |
|||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
.1375 mA |
5 V |
5 |
SMALL OUTLINE |
SOP20,.4 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
2 |
2.6416 mm |
7.5184 mm |
Not Qualified |
e3 |
30 |
260 |
12.7762 mm |
||||||||
|
NXP Semiconductors |
CAN FD TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
5 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
e4 |
30 |
260 |
4.9 mm |
||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N32 |
2 |
1 mm |
5 mm |
e3 |
30 |
260 |
5 mm |
|||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
128 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
1.2 V |
FLATPACK, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQFP-G128 |
3.4 mm |
14 mm |
20 mm |
||||||||||||||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
140 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
8 Mbps |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
e3 |
30 |
260 |
4.9 mm |
|||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
2 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
e4 |
30 |
260 |
4.905 mm |
|||||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
70 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
5 Mbps |
R-PDSO-G8 |
3 |
1.8 mm |
3.9 mm |
e4 |
4.9 mm |
|||||||||||
Intel |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
|||||||||||||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
140 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
8 Mbps |
S-PDSO-N8 |
1 mm |
3 mm |
e3 |
3 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.