Network Interfaces

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

PCA82C251/N3

NXP Semiconductors

CAN TRANSCEIVER

AUTOMOTIVE

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

1

78 mA

5 V

IN-LINE

DIP8,.3

2.54 mm

125 Cel

-40 Cel

DUAL

R-PDIP-T8

4.2 mm

7.62 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

9.5 mm

PTLIN10285DRBRQ1

Texas Instruments

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

8

SON

SQUARE

PLASTIC/EPOXY

YES

1

1

AEC-Q100

12 V

SMALL OUTLINE

125 Cel

-40 Cel

DUAL

.1 Mbps

S-PDSO-N8

TLE9261BQXXUMA1

Infineon Technologies

CAN FD TRANSCEIVER

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1

6.5 mA

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

150 Cel

-40 Cel

QUAD

5 Mbps

S-PQCC-N48

.9 mm

7 mm

7 mm

MC33662BLEFR2

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

13.5 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G8

3

1.75 mm

3.9 mm

e3

40

260

4.9 mm

SI4463-B1B-FMR

Silicon Labs

MANCHESTER ENCODER/DECODER

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

.9 mm

4 mm

NOT SPECIFIED

NOT SPECIFIED

4 mm

UJA1169ATK/F/3

NXP Semiconductors

CAN FD TRANSCEIVER

NO LEAD

20

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

1

67 mA

13 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC20,.14,20

.5 mm

DUAL

15 Mbps

R-PDSO-N20

1 mm

3.5 mm

5.5 mm

BCM5241XA1KMLG

Broadcom

ETHERNET TRANSCEIVER

UNSPECIFIED

RECTANGULAR

UNSPECIFIED

NO

1

2.5 V

SPECIAL SHAPE

UNSPECIFIED

R-XXSS-X

3

260

BCM53128VIQLEG

Broadcom

ETHERNET TRANSCEIVER

MCP2551T-E/SNVAO

Microchip Technology

CAN TRANSCEIVER

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

1

75 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

125 Cel

-40 Cel

DUAL

1 Mbps

R-PDSO-G8

1.75 mm

3.9 mm

4.9 mm

RTL8211CL-GR

Realtek Semiconductor

ETHERNET TRANSCEIVER

COMMERCIAL

GULL WING

48

QFP

SQUARE

PLASTIC/EPOXY

YES

1

1.05,2.5,3.3

FLATPACK

QFP48,.35SQ,20

Network Interfaces

.5 mm

70 Cel

0 Cel

QUAD

1000 Mbps

S-PQFP-G48

Not Qualified

TJA1050T/CM,112

NXP Semiconductors

INTERFACE CIRCUIT

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

4.9 mm

TLE6250GXT

Infineon Technologies

CAN TRANSCEIVER

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5 V

SMALL OUTLINE

1.27 mm

DUAL

R-PDSO-G8

1.75 mm

4 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

TLE62513GXUMA2

Infineon Technologies

INTERFACE CIRCUIT

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5 V

SMALL OUTLINE

1.27 mm

Nickel/Gold/Palladium (Ni/Au/Pd)

DUAL

R-PDSO-G14

2A

1.75 mm

4 mm

NOT SPECIFIED

NOT SPECIFIED

8.75 mm

TLE9250VLEXUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

8

SON

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

5 V

SMALL OUTLINE

.65 mm

TIN

DUAL

S-PDSO-N8

2A

1.1 mm

3 mm

e3

3 mm

ADM3057ETRWZ-EP-RL

Analog Devices

INTERFACE CIRCUIT

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

105 Cel

-55 Cel

MATTE TIN

DUAL

R-PDSO-G20

3

2.65 mm

7.5 mm

e3

260

12.8 mm

BCM5461SA1IPFG

Broadcom

DM9161BEP

Davicom Semiconductor

ETHERNET TRANSCEIVER

COMMERCIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

QUAD

S-PQFP-G48

1.6 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

LAN8820-ABZJ

Microchip Technology

ETHERNET TRANSCEIVER

COMMERCIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

1000 Mbps

S-XQCC-N56

1 mm

8 mm

e3

8 mm

MCP2542WFDT-E/SN

Microchip Technology

CAN FD TRANSCEIVER

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

140 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

125 Cel

-40 Cel

DUAL

8 Mbps

R-PDSO-G8

1.75 mm

3.9 mm

NOT SPECIFIED

NOT SPECIFIED

4.9 mm

TJA1051T/E

NXP Semiconductors

CAN TRANSCEIVER

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

1

110 mA

5 V

SMALL OUTLINE

SOP8,.24

1.27 mm

NICKEL PALLADIUM GOLD SILVER

DUAL

5 Mbps

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

L9615D013TR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

1

.08 mA

5 V

5

SMALL OUTLINE

SOP8,.25

Network Interfaces

1.27 mm

110 Cel

-40 Cel

TIN

DUAL

.5 Mbps

R-PDSO-G8

3

1.75 mm

3.9 mm

Not Qualified

e3

30

250

4.9 mm

PCM9211PT

Texas Instruments

TOKEN RING TRANSCEIVER

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

38 mA

3.3 V

FLATPACK

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G48

1

1.6 mm

7 mm

Not Qualified

e4

30

260

7 mm

RTL8019AS-LF-R

Realtek Semiconductor

ETHERNET TRANSCEIVER

COMMERCIAL

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

QFP100,.75X.99

.65 mm

70 Cel

0 Cel

QUAD

R-PQFP-G100

3.3 mm

14 mm

20 mm

TJA1100HN

NXP Semiconductors

ETHERNET TRANSCEIVER

AUTOMOTIVE

NO LEAD

36

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1

27 mA

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC36,.24SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

100 Mbps

S-PQCC-N36

1

1 mm

6 mm

3.3V NOMINAL SUPPLY ALSO AVAILABLE

30

260

6 mm

MCP2021-330E/MD

Microchip Technology

LIN TRANSCEIVER

AUTOMOTIVE

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

1

12 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.16,32

.8 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-N8

1

1 mm

4 mm

e3

260

4 mm

MCP2561FD-H/SN

Microchip Technology

CAN FD TRANSCEIVER

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

TS 16949

1

70 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

150 Cel

-40 Cel

MATTE TIN

DUAL

8 Mbps

R-PDSO-G8

1.75 mm

3.9 mm

e3

4.9 mm

PCA82C250T/YMB,112

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

1

70 mA

5 V

5

SMALL OUTLINE

SOP8,.25

Network Interfaces

1.27 mm

125 Cel

-40 Cel

DUAL

1 Mbps

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

4.9 mm

SI4463-B1B-FM

Silicon Labs

MANCHESTER ENCODER/DECODER

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

.9 mm

4 mm

NOT SPECIFIED

NOT SPECIFIED

4 mm

AD9375BBCZ-REEL

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B196

3

1.27 mm

12 mm

30

260

12 mm

ADM3054WBRWZ-RL7

Analog Devices

ETHERNET TRANSCEIVER

AUTOMOTIVE

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

1

.075 mA

3.3 V

3.3/5,5

SMALL OUTLINE

SOP16,.4

Network Interfaces

1.27 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

1 Mbps

R-PDSO-G16

1

2.65 mm

7.5 mm

Not Qualified

e3

30

260

10.3 mm

ADM3057ETRWZ-EP

Analog Devices

INTERFACE CIRCUIT

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

105 Cel

-55 Cel

MATTE TIN

DUAL

R-PDSO-G20

3

2.65 mm

7.5 mm

e3

260

12.8 mm

ATA663254-GBQW-V07

Microchip Technology

LIN TRANSCEIVER

AUTOMOTIVE

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

1

.95 mA

13.5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

.65 mm

150 Cel

-40 Cel

DUAL

S-PDSO-N8

.9 mm

3 mm

3 mm

MAX13041ASD+T

Analog Devices

CAN TRANSCEIVER

AUTOMOTIVE

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

1

.08 mA

5 V

5

SMALL OUTLINE

SOP14,.25

Network Interfaces

1.27 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

1 Mbps

R-PDSO-G14

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

8.65 mm

MCP2562FDT-E/MFVAO

Microchip Technology

CAN FD TRANSCEIVER

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

1

70 mA

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

.65 mm

125 Cel

-40 Cel

DUAL

8 Mbps

S-PDSO-N8

1 mm

3 mm

3 mm

TCAN1462VDRQ1

Texas Instruments

CAN FD TRANSCEIVER

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

AEC-Q100

1

130 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

8 Mbps

R-PDSO-G8

1

1.75 mm

3.895 mm

e4

260

4.905 mm

TCAN337GD

Texas Instruments

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

3.3 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

5 Mbps

R-PDSO-G8

1

1.75 mm

3.9 mm

e4

30

260

4.9 mm

VSC8501XML-03

Microchip Technology

ETHERNET TRANSCEIVER

AUTOMOTIVE

NO LEAD

135

VFLGA

SQUARE

PLASTIC/EPOXY

YES

1

1

165 mA

1 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

SLGA135(UNSPEC)

.65 mm

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

BOTTOM

1000 Mbps

S-PBGA-N135

.85 mm

12 mm

e4

12 mm

AX-SFEU-1-01-TX30

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.2X.27,20

.5 mm

85 Cel

-40 Cel

NICKEL GOLD PALLADIUM

QUAD

.0006 Mbps

R-PQCC-N40

1

1 mm

5 mm

30

260

7 mm

BCM53134OKFBG

Broadcom

ETHERNET TRANSCEIVER

3

FLLXT971ABE.A4-834104

Cortina Systems

ETHERNET TRANSCEIVER

INDUSTRIAL

BALL

64

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

.11 mA

3.3 V

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA64,8X8,32

Network Interfaces

.8 mm

85 Cel

-40 Cel

BOTTOM

100 Mbps

S-PBGA-B64

1.36 mm

7 mm

Not Qualified

30

240

7 mm

KS8721BLI

Microchip Technology

ETHERNET TRANSCEIVER

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G48

1.6 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

KSZ8851-16MQLI

Microchip Technology

ETHERNET TRANSCEIVER

INDUSTRIAL

GULL WING

128

FQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.8 V

FLATPACK, FINE PITCH

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

R-PQFP-G128

3

3.4 mm

14 mm

Not Qualified

e3

40

260

20 mm

SN65HVD251QDRQ1

Texas Instruments

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

AEC-Q100

1

.065 mA

5 V

5

SMALL OUTLINE

SOP8,.25

Network Interfaces

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1 Mbps

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

TCAN1051HDRBRQ1

Texas Instruments

INTERFACE CIRCUIT

MILITARY

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

1

AEC-Q100

1

180 mA

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

125 Cel

-55 Cel

MATTE TIN

DUAL

2 Mbps

S-PDSO-N8

1

1 mm

3 mm

e3

30

260

3 mm

TJA1028TK/3V3/20

NXP Semiconductors

MIL-STD-1553 DATA BUS TRANSCEIVER

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

DUAL

S-PDSO-N8

1 mm

3 mm

3 mm

TJA1040T/V,112

NXP Semiconductors

INTERFACE CIRCUIT

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1

.07 mA

5 V

5

SMALL OUTLINE

SOP8,.25

Network Interfaces

1.27 mm

NICKEL PALLADIUM GOLD

DUAL

1 Mbps

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

4.9 mm

WJLXT971ALC.A4

Intel

ETHERNET TRANSCEIVER

COMMERCIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

Matte Tin (Sn)

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

e3

40

260

10 mm

KSZ8051RNLI-TR

Microchip Technology

ETHERNET TRANSCEIVER

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

100 Mbps

S-XQCC-N32

.9 mm

5 mm

5 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.