Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
CAN TRANSCEIVER |
AUTOMOTIVE |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
1 |
78 mA |
5 V |
IN-LINE |
DIP8,.3 |
2.54 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDIP-T8 |
4.2 mm |
7.62 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
9.5 mm |
|||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
8 |
SON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
12 V |
SMALL OUTLINE |
125 Cel |
-40 Cel |
DUAL |
.1 Mbps |
S-PDSO-N8 |
|||||||||||||||||||||
|
Infineon Technologies |
CAN FD TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
6.5 mA |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
150 Cel |
-40 Cel |
QUAD |
5 Mbps |
S-PQCC-N48 |
.9 mm |
7 mm |
7 mm |
||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
13.5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G8 |
3 |
1.75 mm |
3.9 mm |
e3 |
40 |
260 |
4.9 mm |
||||||||||||||
|
Silicon Labs |
MANCHESTER ENCODER/DECODER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
|||||||||||||||||
|
NXP Semiconductors |
CAN FD TRANSCEIVER |
NO LEAD |
20 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
67 mA |
13 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC20,.14,20 |
.5 mm |
DUAL |
15 Mbps |
R-PDSO-N20 |
1 mm |
3.5 mm |
5.5 mm |
|||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
UNSPECIFIED |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
2.5 V |
SPECIAL SHAPE |
UNSPECIFIED |
R-XXSS-X |
3 |
260 |
||||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
||||||||||||||||||||||||||||||||||||||
Microchip Technology |
CAN TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100; TS 16949 |
1 |
75 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
1 Mbps |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
4.9 mm |
|||||||||||||||
|
Realtek Semiconductor |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.05,2.5,3.3 |
FLATPACK |
QFP48,.35SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
1000 Mbps |
S-PQFP-G48 |
Not Qualified |
||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
4.9 mm |
|||||||||||||||||||||||
|
Infineon Technologies |
CAN TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G8 |
1.75 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
|||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
Nickel/Gold/Palladium (Ni/Au/Pd) |
DUAL |
R-PDSO-G14 |
2A |
1.75 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
8.75 mm |
|||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
8 |
SON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
.65 mm |
TIN |
DUAL |
S-PDSO-N8 |
2A |
1.1 mm |
3 mm |
e3 |
3 mm |
||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
105 Cel |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
3 |
2.65 mm |
7.5 mm |
e3 |
260 |
12.8 mm |
|||||||||||||||
|
Broadcom |
||||||||||||||||||||||||||||||||||||||
|
Davicom Semiconductor |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G48 |
1.6 mm |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
1000 Mbps |
S-XQCC-N56 |
1 mm |
8 mm |
e3 |
8 mm |
|||||||||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
140 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
8 Mbps |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
|||||||||||||
|
NXP Semiconductors |
CAN TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE |
SOP8,.24 |
1.27 mm |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
5 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
|||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.08 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
110 Cel |
-40 Cel |
TIN |
DUAL |
.5 Mbps |
R-PDSO-G8 |
3 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
250 |
4.9 mm |
||||||
|
Texas Instruments |
TOKEN RING TRANSCEIVER |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
38 mA |
3.3 V |
FLATPACK |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G48 |
1 |
1.6 mm |
7 mm |
Not Qualified |
e4 |
30 |
260 |
7 mm |
||||||||||||
Realtek Semiconductor |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK |
QFP100,.75X.99 |
.65 mm |
70 Cel |
0 Cel |
QUAD |
R-PQFP-G100 |
3.3 mm |
14 mm |
20 mm |
|||||||||||||||||||
|
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
27 mA |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.24SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-PQCC-N36 |
1 |
1 mm |
6 mm |
3.3V NOMINAL SUPPLY ALSO AVAILABLE |
30 |
260 |
6 mm |
||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.16,32 |
.8 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N8 |
1 |
1 mm |
4 mm |
e3 |
260 |
4 mm |
||||||||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
70 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
8 Mbps |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
e3 |
4.9 mm |
||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
1 |
70 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
1 Mbps |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
Not Qualified |
4.9 mm |
|||||||||||
|
Silicon Labs |
MANCHESTER ENCODER/DECODER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
|||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.3 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B196 |
3 |
1.27 mm |
12 mm |
30 |
260 |
12 mm |
||||||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
.075 mA |
3.3 V |
3.3/5,5 |
SMALL OUTLINE |
SOP16,.4 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1 Mbps |
R-PDSO-G16 |
1 |
2.65 mm |
7.5 mm |
Not Qualified |
e3 |
30 |
260 |
10.3 mm |
||||||
|
Analog Devices |
INTERFACE CIRCUIT |
OTHER |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
105 Cel |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
3 |
2.65 mm |
7.5 mm |
e3 |
260 |
12.8 mm |
|||||||||||||||
Microchip Technology |
LIN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100; TS 16949 |
1 |
.95 mA |
13.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
DUAL |
S-PDSO-N8 |
.9 mm |
3 mm |
3 mm |
||||||||||||||||
|
Analog Devices |
CAN TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.08 mA |
5 V |
5 |
SMALL OUTLINE |
SOP14,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1 Mbps |
R-PDSO-G14 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
8.65 mm |
||||||
Microchip Technology |
CAN FD TRANSCEIVER |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100; TS 16949 |
1 |
70 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
8 Mbps |
S-PDSO-N8 |
1 mm |
3 mm |
3 mm |
||||||||||||||||
|
Texas Instruments |
CAN FD TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
130 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
8 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
e4 |
260 |
4.905 mm |
||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
5 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
e4 |
30 |
260 |
4.9 mm |
||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
135 |
VFLGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
165 mA |
1 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
SLGA135(UNSPEC) |
.65 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
1000 Mbps |
S-PBGA-N135 |
.85 mm |
12 mm |
e4 |
12 mm |
|||||||||||||
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2X.27,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
.0006 Mbps |
R-PQCC-N40 |
1 |
1 mm |
5 mm |
30 |
260 |
7 mm |
||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
3 |
||||||||||||||||||||||||||||||||||||
Cortina Systems |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
64 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.11 mA |
3.3 V |
3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA64,8X8,32 |
Network Interfaces |
.8 mm |
85 Cel |
-40 Cel |
BOTTOM |
100 Mbps |
S-PBGA-B64 |
1.36 mm |
7 mm |
Not Qualified |
30 |
240 |
7 mm |
||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G48 |
1.6 mm |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
128 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 V |
FLATPACK, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-PQFP-G128 |
3 |
3.4 mm |
14 mm |
Not Qualified |
e3 |
40 |
260 |
20 mm |
||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
.065 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
|||||
|
Texas Instruments |
INTERFACE CIRCUIT |
MILITARY |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
180 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
2 Mbps |
S-PDSO-N8 |
1 |
1 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||
NXP Semiconductors |
MIL-STD-1553 DATA BUS TRANSCEIVER |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
DUAL |
S-PDSO-N8 |
1 mm |
3 mm |
3 mm |
|||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.07 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
NICKEL PALLADIUM GOLD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
4.9 mm |
|||||||||||
|
Intel |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
e3 |
40 |
260 |
10 mm |
||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-XQCC-N32 |
.9 mm |
5 mm |
5 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.