Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
4.9 mm |
|||||||||||||||||||
|
NXP Semiconductors |
LIN TRANSCEIVER |
GULL WING |
14 |
HVSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
.65 mm |
DUAL |
R-PDSO-G14 |
1 |
1 mm |
3 mm |
30 |
260 |
4.5 mm |
||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
TIN |
2A |
e3 |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
BALL |
672 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
12 |
1 V |
GRID ARRAY |
BGA672,26X26,40 |
1 mm |
125 Cel |
-40 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B672 |
2.44 mm |
27 mm |
27 mm |
||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
3 |
||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
100 Mbps |
S-XQCC-N32 |
2 |
1 mm |
5 mm |
e4 |
40 |
260 |
5 mm |
||||||||||
|
Microchip Technology |
SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
128 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
FLATPACK, FINE PITCH |
QFP128,.68X.91,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
R-PQFP-G128 |
3 |
3.4 mm |
14 mm |
Not Qualified |
e3 |
30 |
260 |
20 mm |
|||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
1.752 mm |
3.899 mm |
Not Qualified |
e3 |
30 |
260 |
4.9025 mm |
|||||||||||||
|
NXP Semiconductors |
CAN TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
.009 mA |
12 V |
5/26.5 |
SMALL OUTLINE |
SOP14,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
.08333 Mbps |
R-PDSO-G14 |
3 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
40 |
260 |
8.65 mm |
|||||||
|
NXP Semiconductors |
CAN TRANSCEIVER |
NO LEAD |
8 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
AEC-Q100 |
1 |
65 mA |
5 V |
5 |
SMALL OUTLINE |
SOLCC8,.12,25 |
Network Interfaces |
.635 mm |
DUAL |
1 Mbps |
R-PDSO-N8 |
1 |
Not Qualified |
260 |
||||||||||||||||
|
Infineon Technologies |
CAN TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
AEC-Q100 |
1 |
.07 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
TIN |
DUAL |
1 Mbps |
R-PDSO-G8 |
3 |
1.75 mm |
4 mm |
Not Qualified |
e3 |
260 |
5 mm |
|||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.26 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP64,.55SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
10 mm |
||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
672 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
12 |
1 V |
GRID ARRAY |
BGA672,26X26,40 |
1 mm |
125 Cel |
0 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B672 |
2.44 mm |
27 mm |
27 mm |
|||||||||||||||||
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
70 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
DUAL |
5 Mbps |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
4.9 mm |
|||||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
2 mA |
13.5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
3 |
1.8 mm |
3.9 mm |
40 |
260 |
4.9 mm |
|||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
212 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.65 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B212 |
3 |
1.017 mm |
11 mm |
11 mm |
|||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
NO LEAD |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
CHIP CARRIER |
MATTE TIN |
QUAD |
R-XQCC-N |
3 |
e3 |
260 |
|||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
100 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GRID ARRAY |
BOTTOM |
1000 Mbps |
R-PBGA-B100 |
3 |
260 |
|||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
121 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GRID ARRAY |
BOTTOM |
R-PBGA-B121 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||
Murata Manufacturing |
WIRELESS LAN CIRCUIT |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N40 |
.8 mm |
6 mm |
6 mm |
|||||||||||||||||||
Ic Plus |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
48 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
5 |
1.1 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
.4 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-XQCC-N48 |
.9 mm |
6 mm |
6 mm |
||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
100 Mbps |
S-XQCC-N32 |
.9 mm |
5 mm |
e4 |
5 mm |
||||||||||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
140 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
DUAL |
8 Mbps |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
|||||||||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
140 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
8 Mbps |
R-PDSO-N8 |
.8 mm |
2 mm |
e3 |
30 |
260 |
3 mm |
|||||||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
TS 16949 |
2 |
70 mA |
5 V |
SMALL OUTLINE |
SOP14,.25 |
1.27 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
8 Mbps |
R-PDSO-G14 |
1.75 mm |
3.9 mm |
e3 |
8.65 mm |
||||||||||||
|
Microchip Technology |
CAN TRANSCEIVER |
AUTOMOTIVE |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
TS 16949 |
1 |
70 mA |
5 V |
IN-LINE |
DIP8,.3 |
2.54 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1 Mbps |
R-PDIP-T8 |
5.334 mm |
7.62 mm |
e3 |
9.271 mm |
||||||||||||
|
Onsemi |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
70 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
5 Mbps |
R-PDSO-G8 |
2 |
1.75 mm |
4.9 mm |
e3 |
30 |
260 |
6 mm |
|||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
MILITARY |
NO LEAD |
10 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1 |
1 |
6 mA |
3.3 V |
UNCASED CHIP |
210 Cel |
-55 Cel |
UPPER |
1 Mbps |
R-XUUC-N10 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
COMMERCIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 |
.08 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
7.5 mA |
14 V |
SMALL OUTLINE |
SOP8,.24 |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.02 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
Not Qualified |
e4 |
30 |
260 |
4.905 mm |
|||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
1.1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
10 Mbps |
S-XQCC-N40 |
3 |
.8 mm |
6 mm |
ESD FOR TXN, TXP, RXN, RXP Pins is 3B |
260 |
6 mm |
||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
3 |
2.64 mm |
7.5 mm |
260 |
12.8 mm |
|||||||||||||||||
Ic Plus |
SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
128 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
1.9 V |
FLATPACK, FINE PITCH |
QFP128,.68X.91,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQFP-G128 |
3.42 mm |
14 mm |
20 mm |
||||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100; TS 16949 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N32 |
.9 mm |
5 mm |
e3 |
5 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100; TS 16949 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N32 |
.9 mm |
5 mm |
e3 |
5 mm |
|||||||||||||
|
STMicroelectronics |
MANCHESTER DECODER |
3 |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
||||||||||||||
|
NXP Semiconductors |
CAN TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
.009 mA |
12 V |
5/26.5 |
SMALL OUTLINE |
SOP14,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
.08333 Mbps |
R-PDSO-G14 |
3 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
40 |
260 |
8.65 mm |
|||||||
|
Onsemi |
LIN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100 |
1 |
8 mA |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
.02 Mbps |
S-XDSO-N8 |
1 |
1 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||
|
Silicon Labs |
MANCHESTER ENCODER/DECODER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
|||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 |
180 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
e4 |
30 |
260 |
4.9 mm |
||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
MILITARY |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
180 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
2 Mbps |
S-PDSO-N8 |
1 |
1 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||
|
NXP Semiconductors |
LIN TRANSCEIVER |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
12 V |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G14 |
1 |
1.75 mm |
3.9 mm |
30 |
260 |
8.65 mm |
||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
|||||||||||||||||||
|
NXP Semiconductors |
SUPPORT CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
e4 |
30 |
260 |
4.9 mm |
||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
800 mA |
2.5 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
125 Cel |
0 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B256 |
1.8 mm |
17 mm |
17 mm |
||||||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
BUTT |
96 |
BCC |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1 V |
CHIP CARRIER |
.6 mm |
BOTTOM |
S-XBCC-B96 |
.8 mm |
9 mm |
NOT SPECIFIED |
NOT SPECIFIED |
9 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.