Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
DUAL |
S-PDSO-N8 |
1 |
1 mm |
3 mm |
3 mm |
||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
2 |
.14 mA |
5 V |
5 |
SMALL OUTLINE |
SOP14,.25 |
Network Interfaces |
1.27 mm |
MATTE TIN |
DUAL |
1 Mbps |
R-PDSO-G14 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
8.65 mm |
|||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
|||||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
1.55,3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Network Interfaces |
.5 mm |
105 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
100 Mbps |
S-PQCC-N32 |
2 |
1 mm |
5 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
5 mm |
||||||||
|
NXP Semiconductors |
CAN FD TRANSCEIVER |
NO LEAD |
20 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
67 mA |
13 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC20,.14,20 |
.5 mm |
DUAL |
15 Mbps |
R-PDSO-N20 |
1 mm |
3.5 mm |
5.5 mm |
|||||||||||||||||
|
NXP Semiconductors |
CAN FD TRANSCEIVER |
NO LEAD |
20 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
67 mA |
13 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC20,.14,20 |
.5 mm |
DUAL |
15 Mbps |
R-PDSO-N20 |
1 mm |
3.5 mm |
5.5 mm |
|||||||||||||||||
Marvell Technology |
ETHERNET TRANSCEIVER |
SQUARE |
1 |
4 |
15000 Mbps |
||||||||||||||||||||||||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
GULL WING |
128 |
HQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, HEAT SINK/SLUG |
QUAD |
R-PQFP-G128 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
4 |
1 V |
GRID ARRAY, LOW PROFILE |
BGA196,14X14,40 |
1 mm |
70 Cel |
0 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B196 |
1.5 mm |
15 mm |
15 mm |
|||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
Not Qualified |
4.9 mm |
||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
24 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N48 |
1 |
.8 mm |
7 mm |
e3 |
30 |
260 |
7 mm |
|||||||||||||
|
Analog Devices |
CAN TRANSCEIVER |
NICKEL PALLADIUM GOLD |
1 |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
CAN FD/LIN TRANSCEIVER |
AEC-Q100 |
3 |
40 |
260 |
|||||||||||||||||||||||||||||||||
|
Microchip Technology |
CAN TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
70 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1 Mbps |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
e3 |
4.9 mm |
||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
2 |
1.727 mm |
3.937 mm |
e3 |
30 |
260 |
4.927 mm |
|||||||||||||
Intel |
INTERFACE CIRCUIT |
||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
.021 mA |
5 V |
5 |
SMALL OUTLINE |
SOP14,.25 |
Network Interfaces |
1.27 mm |
DUAL |
R-PDSO-G14 |
1.75 mm |
3.9 mm |
Not Qualified |
8.65 mm |
||||||||||||||||
|
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N36 |
1 |
1 mm |
6 mm |
e4 |
30 |
260 |
6 mm |
|||||||||||||
|
NXP Semiconductors |
CAN TRANSCEIVER |
NO LEAD |
14 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
AEC-Q100 |
1 |
67 mA |
3/28 |
SMALL OUTLINE |
SOLCC14,.12,25 |
Network Interfaces |
.635 mm |
DUAL |
1 Mbps |
R-PDSO-N14 |
1 |
Not Qualified |
30 |
260 |
||||||||||||||||
|
NXP Semiconductors |
CAN FD TRANSCEIVER |
NO LEAD |
20 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
67 mA |
13 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC20,.14,20 |
.5 mm |
DUAL |
15 Mbps |
R-PDSO-N20 |
1 mm |
3.5 mm |
5.5 mm |
|||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
68 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
.4 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQCC-N68 |
3 |
.9 mm |
8 mm |
e3 |
260 |
8 mm |
||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
128 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.5 V |
FLATPACK, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-PQFP-G128 |
3.4 mm |
14 mm |
e3 |
20 mm |
|||||||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
NO LEAD |
16 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
.5 mA |
13.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC16,.13,25 |
.65 mm |
150 Cel |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-N16 |
1 mm |
3 mm |
e3 |
5.5 mm |
||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
3 |
||||||||||||||||||||||||||||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
80 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
3.3 V |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP80,.55SQ |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-PQFP-G80 |
1.2 mm |
12 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
12 mm |
|||||||||||
|
Holt Integrated Circuits |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
18 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
15 mA |
5 V |
3.3/5,5 |
SMALL OUTLINE |
SOP18,.4 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1 Mbps |
R-PDSO-G18 |
3 |
2.35 mm |
7.5 mm |
Not Qualified |
e3 |
260 |
11.55 mm |
||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G8 |
3 |
1.75 mm |
4 mm |
e3 |
260 |
5 mm |
|||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N32 |
.9 mm |
5 mm |
e3 |
5 mm |
|||||||||||||
|
STMicroelectronics |
MANCHESTER DECODER |
MATTE TIN |
3 |
e3 |
260 |
|||||||||||||||||||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.072 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
2 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
|||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
||||||||||||
|
NXP Semiconductors |
CAN FD/LIN TRANSCEIVER |
AEC-Q100 |
3 |
40 |
260 |
|||||||||||||||||||||||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-N8 |
1 mm |
2 mm |
3 mm |
||||||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
AUTOMOTIVE |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
TS 16949 |
1 |
12 V |
IN-LINE |
DIP8,.3 |
2.54 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T8 |
5.334 mm |
7.62 mm |
e3 |
9.271 mm |
||||||||||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
TS 16949 |
1 |
70 mA |
5 V |
IN-LINE |
DIP8,.3 |
2.54 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
8 Mbps |
R-PDIP-T8 |
5.334 mm |
7.62 mm |
e3 |
9.271 mm |
||||||||||||
|
Intel |
ETHERNET TRANSCEIVER |
NO LEAD |
48 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER |
QUAD |
R-XQCC-N48 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
|
Microchip Technology |
LAN SWITCHING CIRCUIT |
OTHER |
NO LEAD |
44 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
2 mm |
85 Cel |
-30 Cel |
UNSPECIFIED |
R-XXMA-N44 |
3.5 mm |
20 mm |
NOT SPECIFIED |
NOT SPECIFIED |
37 mm |
||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
180 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
5 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
e4 |
NOT SPECIFIED |
260 |
4.905 mm |
|||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
e4 |
30 |
260 |
4.9 mm |
||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
12 V |
SMALL OUTLINE |
1.27 mm |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
4.9 mm |
||||||||||||||||||
|
NXP Semiconductors |
CAN FD TRANSCEIVER |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,25 |
.65 mm |
150 Cel |
DUAL |
5 Mbps |
R-PDSO-N14 |
1 |
1 mm |
3 mm |
260 |
4.5 mm |
||||||||||||||||
|
Infineon Technologies |
CAN FD TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
6.5 mA |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.28SQ,20 |
.5 mm |
150 Cel |
-40 Cel |
QUAD |
2 Mbps |
S-PQCC-N48 |
3 |
.9 mm |
7 mm |
7 mm |
||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
8 |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
135 mA |
12 V |
SOP8(UNSPEC) |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.02 Mbps |
S-PDSO-G8 |
2 |
e4 |
30 |
260 |
||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
5 mA |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.02 Mbps |
S-PDSO-N8 |
2 |
1 mm |
3 mm |
e4 |
30 |
260 |
3 mm |
|||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.26 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP64,.55SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N32 |
2 |
1 mm |
5 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
5 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.